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CC1050

Texas Instruments

CC1050 by Texas Instruments

The Texas Instruments CC1050 is a cellphone IC with 24 terminals, operating at temperatures from -40 to 85°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry for telecom applications. The package is small outline, thin profile, with shrink pitch and gull wing terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,889 parts In-Stock

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Digiode

USA . 1,700 parts In-Stock

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Parana Technologies

USA . 1,079 parts In-Stock

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$10.862

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$11.341

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$11.341

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ChromeModa Solutions

Germany . 2,110 parts In-Stock

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$12.205

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$10.008

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IDEA Electronic Components Group

UK . 1,944 parts In-Stock

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$12.205

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$11.595

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$10.984

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AZTECH Wire

Italy . 716 parts In-Stock

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One Stop Electronics

USA . 1,409 parts In-Stock

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$987.000

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A-Z Elektronik GmbH

Germany . 5,952 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,968 parts In-Stock

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Corphita

USA . 925 parts In-Stock

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Native Components

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Northwest PG Solutions

USA . 752 parts In-Stock

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DigiPath Technology Company

USA . 205 parts In-Stock

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$11.004

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Overview

The CC1050 by Texas Instruments is a cutting-edge Cellphone IC that offers unmatched quality and reliability. With its innovative technology and Industrial-grade temperature rating, this RF and Baseband circuit is perfect for a wide range of applications. Whether you're designing smartphones or other mobile devices, the CC1050 delivers exceptional performance and efficiency. Trust in Texas Instruments' reputation for excellence and choose the CC1050 for all your cellphone IC needs. Experience the value and benefits of superior design and functionality with the CC1050 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the IC onto circuit boards, saving space and improving overall design.

Package Shape: RECTANGULAR

The rectangular shape is common and easy to work with, allowing for standardized assembly processes.

Power Supplies (V): 2.5/3.3

Multiple power supply options provide flexibility in design and compatibility with various systems.

No. of Terminals: 24

Having a sufficient number of terminals allows for connections to multiple components and enhances the functionality of the IC.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a compact design with a small profile, making it suitable for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the IC to function effectively in cold environments without any issues.

Terminal Position: DUAL

Dual terminal positions allow for efficient connections and better signal integrity, enhancing the overall performance of the IC.

Maximum Seated Height: 1.2 mm

The low seated height of the package ensures a slim profile and easy integration into compact devices.

Width: 4.4 mm

The narrow width of the IC makes it suitable for applications where space is limited.

Length: 7.8 mm

The compact length of the IC contributes to a small form factor, ideal for portable and handheld devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the IC can withstand harsh industrial environments without compromising performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures reliable connections, making the assembly process more efficient.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This type of IC is specifically designed for telecom applications, ensuring optimized performance in communication systems.

Nominal Supply Voltage: 3 V

The 3V supply voltage is a common standard in many electronic devices, ensuring compatibility and ease of integration.

Terminal Pitch: 0.65 mm

The tight terminal pitch allows for compact integration of the IC onto circuit boards, saving space and improving overall design efficiency.

Technical Specifications

Cellphone ICs CC1050 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

CC1050 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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