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CC1020-RTB1

Texas Instruments

CC1020-RTB1 by Texas Instruments

CC1020-RTB1 by Texas Instruments is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit technology has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.

Median Price

$3.790

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9 parts In-Stock

1+ parts

-

100+ parts

$3.790

1k+ parts

$3.390

10k+ parts

$3.190

9

-

$3.790

$3.390

$3.190

Distributors (In-Stock)

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Digiode

USA . 1,002 parts In-Stock

1+ parts

$4.000

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1,002

$4.000

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Vyrian

USA . 9,061 parts In-Stock

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9,061

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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EMSNET

USA . 6 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 4,529 parts In-Stock

1+ parts

$3.789

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4,529

$3.789

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Parana Technologies

USA . 1,976 parts In-Stock

1+ parts

$6.598

100+ parts

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$7.335

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1,976

$6.598

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$7.335

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DigiPath Technology Company

USA . 341 parts In-Stock

1+ parts

$7.265

100+ parts

$6.684

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341

$7.265

$6.684

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ChromeModa Solutions

Germany . 4,208 parts In-Stock

1+ parts

$7.413

100+ parts

$6.079

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4,208

$7.413

$6.079

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IDEA Electronic Components Group

UK . 2,298 parts In-Stock

1+ parts

$7.413

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$6.672

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2,298

$7.413

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Native Components

USA . 588 parts In-Stock

1+ parts

$83.835

100+ parts

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$80.482

588

$83.835

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$80.482

Northwest PG Solutions

USA . 296 parts In-Stock

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$92.219

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296

$92.219

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Perfect Parts

USA . 22 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

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Overview

Experience unparalleled quality and innovation with the Texas Instruments CC1020-RTB1, a cutting-edge Cellphone IC designed to revolutionize communication technology. With Texas Instruments' reputation for excellence in manufacturing, this surface-mount device offers exceptional performance and reliability for a wide range of applications. From RF to baseband circuits, this versatile chip carrier boasts a very thin profile and advanced CMOS technology, ensuring optimal efficiency and functionality. Elevate your products with the CC1020-RTB1's superior features and industrial-grade temperature tolerance, delivering value and benefits that exceed expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the cell phone ICs onto circuit boards, making them a convenient and cost-effective choice for manufacturers.

Package Shape: SQUARE

The square package shape provides a compact design, allowing for efficient use of space within the cell phone and making it suitable for small and slim devices.

Power Supplies (V): 3

Operating at a voltage of 3V ensures compatibility with a wide range of cell phone systems, making this IC suitable for various devices.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options and supports the integration of multiple functions within the cell phone IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand demanding usage conditions and maintain performance reliability even in extreme environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures that the cell phone IC remains functional even in cold climates, providing consistent performance in various conditions.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the cell phone IC.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V means the IC operates within standard power parameters, ensuring compatibility with most cell phone systems and reducing the risk of damage from voltage fluctuations.

Technical Specifications

Cellphone ICs CC1020-RTB1 attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.27SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

CC1020-RTB1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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