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HMC422MS8TR

Analog Devices

HMC422MS8TR by Analog Devices

Analog Devices' HMC422MS8TR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C and has a nominal voltage of 3V. This RF and baseband circuit is ideal for telecom applications due to its compact size and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,036 parts In-Stock

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Semi Source

USA . 1,000 parts In-Stock

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Digiode

USA . 701 parts In-Stock

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701

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PC Components Company LLC

USA . 21 parts In-Stock

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Bristol Electronics

USA . 21 parts In-Stock

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Parana Technologies

USA . 2,191 parts In-Stock

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$6.676

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$6.208

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$6.676

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IDEA Electronic Components Group

UK . 1,242 parts In-Stock

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$7.178

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$6.819

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AZTECH Wire

Italy . 729 parts In-Stock

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$8.444

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DigiPath Technology Company

USA . 772 parts In-Stock

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$11.198

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$10.750

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$10.750

772

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$10.750

Semicontronic

India . 1,072 parts In-Stock

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$447.000

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$435.825

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$433.590

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1,072

$447.000

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One Stop Electronics

USA . 944 parts In-Stock

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$751.000

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$751.000

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QUARKTWIN TECHNOLOGY LTD

USA . 24,234 parts In-Stock

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Corphita

USA . 198 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of cutting-edge technology with the HMC422MS8TR by Analog Devices. Crafted with precision and expertise, this cellphone IC offers unparalleled performance and reliability for a wide range of applications. From RF to baseband circuits, this versatile IC is designed to meet the demands of the industrial environment, ensuring optimal functionality at all times. With its compact design and advanced features, the HMC422MS8TR is the perfect choice for those looking to elevate their mobile devices to the next level. Upgrade your technology today and experience the difference with Analog Devices.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices such as cellphones.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto the circuit board, saving time and space during production.

No. of Terminals: 8

Having 8 terminals provides flexibility in connecting various components within the cellphone circuit, allowing for more functionality and features.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can withstand high temperatures, ensuring reliable performance even under demanding conditions.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V, this IC is energy-efficient, contributing to longer battery life in the cellphone.

Technical Specifications

Cellphone ICs HMC422MS8TR attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

HMC422MS8TR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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