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HMC422MS8E

Analog Devices

HMC422MS8E by Analog Devices

Analog Devices' HMC422MS8E is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85°C and has a terminal pitch of 0.65mm. Ideal for RF and baseband circuits in telecom applications due to its matte tin finish and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 5,637 parts In-Stock

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Digiode

USA . 665 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 222 parts In-Stock

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Resion

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Cogito LLC

Ukraine . 9 parts In-Stock

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J2 Sourcing AB

Sweden . 7 parts In-Stock

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Prism Electronics

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Parana Technologies

USA . 4,120 parts In-Stock

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$11.498

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$10.693

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IDEA Electronic Components Group

UK . 1,108 parts In-Stock

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$12.363

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$11.745

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AZTECH Wire

Italy . 714 parts In-Stock

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$14.621

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DigiPath Technology Company

USA . 1,057 parts In-Stock

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$19.286

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$18.515

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$18.515

One Stop Electronics

USA . 178 parts In-Stock

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$605.000

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Semicontronic

India . 1,540 parts In-Stock

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$609.000

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$593.775

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$590.730

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QUARKTWIN TECHNOLOGY LTD

USA . 26,316 parts In-Stock

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RC Electronics

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

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Perfect Parts

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Kepictronics

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GreenTree Electronics

Israel . 15 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 15 parts In-Stock

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Overview

Upgrade your cellphone performance with the HMC422MS8E by Analog Devices. Manufactured to the highest quality standards, this RF and baseband circuit IC offers unparalleled value and benefits. From improved signal clarity to faster data processing, this small outline, thin profile package is designed for maximum efficiency in a range of telecom applications. Trust Analog Devices to deliver cutting-edge technology that enhances your mobile experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the IC can withstand various environmental conditions, making it a reliable choice for cellphones.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly, reducing manufacturing costs and improving overall product reliability.

Package Shape: SQUARE

The square shape helps in efficient space utilization on the PCB, enabling a compact design for cellphones.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can handle demanding usage conditions without overheating or malfunctioning.

Nominal Supply Voltage: 3 V

The low supply voltage requirement contributes to energy efficiency and extends battery life in cellphones.

Technical Specifications

Cellphone ICs HMC422MS8E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

HMC422MS8E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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