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MAX2902ETI+T

Analog Devices

MAX2902ETI+T by Analog Devices

Analog Devices' MAX2902ETI+T is a cellphone IC with 28 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial telecom applications. Features RF and baseband circuits, nominal voltage of 4.5V, and terminal pitch of 0.5mm.

Median Price

$5.110

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

MAX2902ETI+T by Analog Devices
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.110

10k+ parts

$6.361

7,500

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$5.110

$6.361

Distributors (In-Stock)

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Vyrian

USA . 868 parts In-Stock

1+ parts

$4.440

100+ parts

-

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868

$4.440

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Digiode

USA . 2,810 parts In-Stock

1+ parts

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2,810

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Anansix

USA . 1,499 parts In-Stock

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1,499

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Distributors (Availability)

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Andel Nordic

Denmark . 76 parts In-Stock

1+ parts

$0.530

100+ parts

-

1k+ parts

$0.368

10k+ parts

$0.368

76

$0.530

-

$0.368

$0.368

Semicontronic

India . 7,498 parts In-Stock

1+ parts

$8.210

100+ parts

$8.005

1k+ parts

$7.964

10k+ parts

-

7,498

$8.210

$8.005

$7.964

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MARBEL Systems

Belgium . 209 parts In-Stock

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$15.576

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209

$15.576

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Texas Native Microelectronics

USA . 30 parts In-Stock

1+ parts

$17.904

100+ parts

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$16.651

10k+ parts

$15.756

30

$17.904

-

$16.651

$15.756

Kenton Components

USA . 197 parts In-Stock

1+ parts

$21.485

100+ parts

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$18.907

197

$21.485

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$18.907

Qasali Group International

UK . 14,782 parts In-Stock

1+ parts

$48.341

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14,782

$48.341

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Component Stockers USA

USA . 8,240 parts In-Stock

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Corphita

USA . 272 parts In-Stock

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272

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Overview

Discover the ultimate solution for your cellphone IC needs with the MAX2902ETI+T by Analog Devices. Renowned for their high-quality products, Analog Devices delivers unmatched performance and reliability in the telecom IC industry. This surface-mount chip carrier boasts a very thin profile and quad terminal position, making it ideal for a wide range of applications. With a nominal supply voltage of 4.5V, industrial temperature grade, and matte tin finish, this RF and baseband circuit offers exceptional value and benefits to customers looking for top-notch performance and efficiency in their devices. Elevate your product with the MAX2902ETI+T and experience unparalleled quality like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: SQUARE

Square package shape helps in efficient use of space on the circuit board, allowing for compact and sleek designs.

No. of Terminals: 28

With 28 terminals, this IC is capable of handling multiple functions and connections, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environments and extended use without compromising performance.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures that the IC can operate reliably in extreme cold conditions, making it suitable for diverse environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and electrical conductivity while the annealed process improves the long-term reliability of the terminals.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and durability during assembly processes, resulting in a robust and reliable final product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuitry in one IC simplifies design, reduces component count, and enhances overall performance in communication applications.

Technical Specifications

Cellphone ICs MAX2902ETI+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N28

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

4.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MAX2902ETI+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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