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HMC687LP4E

Analog Devices

HMC687LP4E by Analog Devices

Analog Devices' HMC687LP4E is a BICMOS technology Cellphone IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. With matte tin finish and no-lead terminal form, it supports RF and baseband circuits at 5V nominal voltage.

Median Price

$21.210

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 170 parts In-Stock

1+ parts

-

100+ parts

$21.210

1k+ parts

$18.980

10k+ parts

$17.860

170

-

$21.210

$18.980

$17.860

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 305 parts In-Stock

1+ parts

$22.448

100+ parts

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305

$22.448

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Vyrian

USA . 7,641 parts In-Stock

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7,641

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Prism Electronics

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 13 parts In-Stock

1+ parts

$10.323

100+ parts

-

1k+ parts

$9.600

10k+ parts

-

13

$10.323

-

$9.600

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

1+ parts

$11.100

100+ parts

$10.545

1k+ parts

$10.545

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-

1,258

$11.100

$10.545

$10.545

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DigiPath Technology Company

USA . 1,390 parts In-Stock

1+ parts

$17.316

100+ parts

$16.623

1k+ parts

-

10k+ parts

$16.623

1,390

$17.316

$16.623

-

$16.623

Semicontronic

India . 170 parts In-Stock

1+ parts

$20.090

100+ parts

$19.588

1k+ parts

$19.487

10k+ parts

-

170

$20.090

$19.588

$19.487

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Corphita

USA . 677 parts In-Stock

1+ parts

$21.267

100+ parts

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677

$21.267

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Component Stockers USA

USA . 355 parts In-Stock

1+ parts

$99.990

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355

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,570 parts In-Stock

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11,570

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Metaverse IC Inc.

Canada . 394 parts In-Stock

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394

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Kepictronics

USA . 294 parts In-Stock

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294

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Perfect Parts

USA . 157 parts In-Stock

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Overview

Discover the cutting-edge technology of the HMC687LP4E by Analog Devices, a top-tier manufacturer known for superior quality and innovation in the cellphone IC category. This versatile surface mount device offers a compact square package with 24 terminals, ideal for a wide range of applications. With an industrial temperature grade and advanced BICMOS technology, this RF and baseband circuit provides exceptional performance and reliability. Elevate your design with the value and benefits of the HMC687LP4E, delivering unmatched advantages to customers seeking premium solutions in telecommunications and beyond.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto a printed circuit board, saving time and labor costs.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 24

With 24 terminals, this IC can handle a variety of input and output connections, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this IC to operate effectively in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures a reliable electrical connection.

Terminal Position: QUAD

Quad terminal position enables better heat dissipation and electrical performance compared to other terminal configurations.

Width: 4 mm

The compact width of 4 mm saves space on the PCB and allows for a more compact overall design.

Length: 4 mm

The length of 4 mm ensures that the IC occupies minimal space on the PCB, making it suitable for compact designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments with wide temperature variations.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Cellphone ICs HMC687LP4E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

HMC687LP4E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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