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HMC600LP4

Analog Devices

HMC600LP4 by Analog Devices

Analog Devices' HMC600LP4 is a cellphone IC with 24 terminals in a square chip carrier package. Operating b/w -40 to 85°C, it's ideal for RF and baseband circuits, with a nominal voltage of 3.3V. The compact design (4x4mm) features surface mount capability and industrial temperature grade suitability.

Median Price

$18.540

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9 parts In-Stock

1+ parts

$11.108

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$11.108

-

-

-

Rochester

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$18.540

1k+ parts

$16.590

10k+ parts

$15.620

214

-

$18.540

$16.590

$15.620

DigiKey

USA . 214 parts In-Stock

1+ parts

-

100+ parts

$21.480

1k+ parts

-

10k+ parts

-

214

-

$21.480

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 531 parts In-Stock

1+ parts

$10.553

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$10.553

-

-

-

Vyrian

USA . 8,381 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,381

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 61 parts In-Stock

1+ parts

$9.440

100+ parts

$9.204

1k+ parts

$9.157

10k+ parts

-

61

$9.440

$9.204

$9.157

-

Corphita

USA . 962 parts In-Stock

1+ parts

$9.997

100+ parts

-

1k+ parts

-

10k+ parts

-

962

$9.997

-

-

-

Parana Technologies

USA . 560 parts In-Stock

1+ parts

$12.155

100+ parts

-

1k+ parts

$11.304

10k+ parts

-

560

$12.155

-

$11.304

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IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$13.070

100+ parts

$12.416

1k+ parts

$12.416

10k+ parts

-

1,476

$13.070

$12.416

$12.416

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DigiPath Technology Company

USA . 1,699 parts In-Stock

1+ parts

$20.389

100+ parts

$19.574

1k+ parts

-

10k+ parts

$19.574

1,699

$20.389

$19.574

-

$19.574

Overview

The HMC600LP4 by Analog Devices is a top-of-the-line Cellphone IC that offers unparalleled quality and reliability. With a reputation for excellence, Analog Devices has crafted this cutting-edge product to meet the demands of today's technology-driven world. From RF and baseband circuits to heat sink/slug package styles, this versatile component caters to a wide range of applications. Customers can expect nothing but the best in performance, efficiency, and innovation when they choose the HMC600LP4. Elevate your projects with this exceptional product and experience the difference Analog Devices brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and resistance to external factors, making this product reliable for long-term use.

Surface Mount: YES

Being surface mountable makes this product easy to integrate into circuit boards, saving space and simplifying the assembly process.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy alignment during assembly, contributing to overall design simplicity.

No. of Terminals: 24

With 24 terminals, this product offers a sufficient number of connection points for complex circuit configurations, enabling diverse functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even under demanding environmental conditions, making this product suitable for industrial applications.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, this product is compatible with standard power sources, making it easy to integrate into existing systems.

Technical Specifications

Cellphone ICs HMC600LP4 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

HMC600LP4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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