Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TOBY-L280-03S by U-blox Ag is a CELLPHONE IC with 152 terminals in GRID ARRAY package. It operates b/w -20°C to 65°C, ideal for RF and baseband circuits. With a compact size of 24.8mm x 35.6mm x 2.87mm, it's suitable for mobile communication devices.
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Enables easy and fast installation on printed circuit boards, saving time and effort during production.
Rectangular shape provides uniformity in design and layout, making it easier to integrate into various devices.
Having a high number of terminals allows for more connectivity options and functionalities in the device.
Grid array style helps in efficient heat dissipation and signal routing, enhancing overall performance of the IC.
Ability to operate at high temperatures ensures reliability and stability under harsh operating conditions.
Wide range of operating temperature ensures functionality in both extreme cold and hot environments.
Bottom terminal positioning allows for better signal integrity and thermal management in the device.
Low profile design enables compact and slim device designs, ideal for space-constrained applications.
No lead terminals provide improved electrical performance and reliability compared to traditional leaded terminals.
Combining RF and baseband circuitry in one IC simplifies design complexity and enhances functionality for telecommunications applications.
Stable supply voltage ensures consistent performance and efficiency of the IC in various operating conditions.
MSL 4 indicates the IC's resistance to moisture-induced damage, making it suitable for a wide range of environmental conditions.
Cellphone ICs TOBY-L280-03S attributes and parameters. Explore more Cellphone ICs devices from U-blox Ag
Additional Features:
JESD-30 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Telecom IC Type:
Terminal Form:
Terminal Position:
Width:
TOBY-L280-03S Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - TOBY MPCI 12-Apr-2022
PCN Design/Specification - Mult Dev FW/Status Chgs 10/Sep/2021
PCN Assembly/Origin - Mult Dev FW/Doc Chgs 27/May/2021
PCN Other - TOBY-L2/MPCI-L2 Quality 06/Oct/2023
Our world is moving fast, soon your car will drive itself and you will carry your doctor in your pocket. Your home will power the grid and you will be connected like never before. At u-blox we are setting the beat delivering the core technology to locate and wirelessly connect people, machines and everything else making us the agile and reliable partner that will take you beyond expectations. With our innovative products and services, we empower customers to locate their devices and connect them from silicon to cloud. Ever since three bright ETH doctorate students and their professor founded u-blox in 1997, two things have driven everything we do: a desire to innovate and a constant focus on giving our customers a real competitive edge.
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
SMBJ18CA
Silicon Standard
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
1N4148WT
Changzhou Galaxy Century Microelectronics
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
Crystalonics
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
Semiconductor Technology
AT86RF231-ZF
Microchip Technology
AT86RF231-ZF by Microchip Technology is a cellphone IC with surface mount capability. It has 1 function and comes in a square package shape. With a temperature range of -40 to 85 °C, it is suitable for industrial applications as an RF and baseband circuit.
TOBY-L210-65S
U-blox Ag
TOBY-L210-65S by U-blox Ag is a surface mount Cellphone IC with 1 function. It has 152 terminals and a rectangular package shape. With a max operating temperature of 65°C, it is suitable for RF and baseband circuit applications.
CC1100ERGPT
Texas Instruments
The Texas Instruments CC1100ERGPT is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a CMOS technology, RF and baseband circuit for data rates up to 0.5 Mbps. This chip carrier package with nickel palladium gold finish is suitable for industrial applications requiring low power supplies of 1.8-3.6V.
HMC6001LP711E
Analog Devices
Analog Devices' HMC6001LP711E is a 60-terminal cellphone IC in a rectangular chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.
CC1110F16RSPG3
CC1110F16RSPG3 by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85°C and has a supply voltage of 3V. This RF and baseband circuit technology is ideal for industrial telecom applications due to its compact size and low power consumption.
SKY68031-11
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; No. of Functions: 1;
CC2420-RTR2
CC2420-RTR2 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 1.8V, CMOS technology, and RF/baseband circuitry. This surface-mount chip carrier is ideal for telecom applications due to its compact square package shape and low profile design.
HMC380QS16G
Analog Devices' HMC380QS16G is a 16-terminal RF and baseband circuit IC for cellphones. With a small outline package style, it operates b/w -40°C to 85°C, ideal for industrial telecom applications. Featuring tin lead terminal finish and gull wing form, it has a compact size of 3.9mm width and 4.9mm length.
LMH9126IRRLR
Texas Instruments LMH9126IRRLR is a cellphone IC with 12 terminals in a square chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It features RF and baseband circuits, operates at 3.3V, and has moisture sensitivity level of 2.
RFFM6903
Qorvo
RFFM6903 by Qorvo is a cellphone IC with 28 terminals in a square grid array package. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Features nickel palladium gold finish, butt terminal form, and nominal voltage of 3.6V.
MAX4003EBL+T
Maxim Integrated
MAX4003EBL+T by Maxim Integrated is a CELLPHONE IC with 8 terminals in GRID ARRAY package. Operating temp range -40 to 85°C, suitable for RF and baseband circuits. Features include CMOS technology, 3V supply voltage, and compact 0.5mm terminal pitch.
AD9361BBC-CSH
RF AND BASEBAND CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
LMH2110TM/NOPB
LMH2110TM/NOPB by Texas Instruments is a Cellphone IC with 6 terminals in a rectangular grid array package. It operates b/w -40 to 85°C, with a supply current of 5.5mA at 4.5V. This RF and baseband circuit is ideal for telecom applications due to its thin profile and fine pitch design.
SARA-R412M-02B
SARA-R412M-02B by U-blox Ag is a Cellphone IC with 96 terminals in a rectangular grid array package. Operating b/w -20°C to 65°C, it integrates RF and baseband circuits for telecom applications. With a nominal voltage of 3.8V, this surface-mount IC measures 16mm x 26mm and has a low seated height of 2.78mm suitable for compact devices.
HMC420QS16ETR
Analog Devices' HMC420QS16ETR is a 16-terminal cellphone IC with PLASTIC/EPOXY body, suitable for RF and baseband circuits. It operates b/w -40 to 85 °C, with a nominal voltage of 5V. The small outline package measures 4.9mm x 3.9mm x 1.75mm, making it ideal for telecom applications requiring compact components.
CC1020-RTB1
CC1020-RTB1 by Texas Instruments is a cellphone IC with 32 terminals in a square package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit technology has a terminal pitch of 0.65mm, making it ideal for industrial telecom applications.
TLV320AC57IDW
TLV320AC57IDW by Texas Instruments is a 20-terminal IC with 3V supply voltage, operating b/w -40 to 85°C. It features A-LAW companding law, 13-bit linear coding, and includes a filter. Ideal for cellphone applications due to its small outline package style and telecom baseband circuit type.
ST25R3911B-ASWB
ADL5363ACPZ-R7
ADL5363ACPZ-R7 by Analog Devices is a cellphone IC with BICMOS technology, operating b/w -40 to 85°C. It features 20 terminals in a square chip carrier package style, suitable for RF and baseband circuits. With a nominal voltage of 5V, it is ideal for industrial telecom applications.
TLV321AC36CN
TLV321AC36CN by Texas Instruments is a Cellphone IC with 20 terminals, CMOS technology, and 3V supply voltage. It has a rectangular package style, suitable for baseband circuits in commercial temperature grades. Dimensions are 7.62mm width, 24.325mm length, and 5.08mm seated height for through-hole mounting at temperatures ranging from 0 to 70°C.
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TOBY-L210-03S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.8 V;
TOBY-L210-03S-03
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
TOBY-L210-62S
TOBY-L210-62S by U-blox Ag is a CELL IC with 152 terminals in GRID ARRAY package. It operates b/w -20°C to 65°C, ideal for RF and baseband circuits in cellphones. With a compact size of 24.8mm x 35.6mm and low supply voltage of 3.8V, it's suitable for mobile communication applications.
TOBY-L200-00S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 65 Cel;
TOBY-L200-02S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Length: 35.6 mm;
TOBY-L200-03S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Additional Features: -40 to 85 extended operating temp available;
TOBY-L201-01S
TOBY-L201-02S
TOBY-L210-00S
TOBY-L210-02S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Width: 24.8 mm;
TOBY-L210-60S
TOBY-L220-02S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
TOBY-L220-62S
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: LGA; Package Shape: RECTANGULAR; Maximum Seated Height: 2.87 mm;
TOBY-L280-02S
TOBY-L280-03A-01
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; Surface Mount: YES;
TOBY-L210-03A-00
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 65 Cel;
TOBY-L200-03A-01
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; Nominal Supply Voltage: 3.8 V;
TOBY-L210-03A-01
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 152; Package Code: XMA; Package Shape: RECTANGULAR; No. of Functions: 1;
TOBY-L201-02S-02
RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 152; Package Shape: RECTANGULAR; Length: 35.6 mm;
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