Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Texas Instruments LMV225UR/NOPB is a cellphone IC with 8mA max supply current. It features grid array package style, very thin profile, and fine pitch. Ideal for telecom applications requiring RF and baseband circuit integration in surface mount designs.
Median Price
$1.335
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1k+
Texas Instruments
1+ parts
$1.456
100+ parts
$1.203
1k+ parts
$0.650
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Mouser Electronics
$2.270
$1.360
$0.970
$0.931
Rochester
$1.170
$0.971
$0.866
Verical
$1.214
$1.082
Greenchips
$0.803
$0.765
$0.728
$0.657
Digiode
$0.858
Vyrian
$0.903
SIE Connect GmbH - GreenChips
Anansix
ACDS - Activité Composants Distribution Service
Holdelec - ElecDif-Pro
Corphita
$0.813
Parana Technologies
$12.916
$13.402
DigiPath Technology Company
$14.222
IDEA Electronic Components Group
$14.512
$13.786
$13.061
ChromeModa Solutions
$11.900
Lixinc
Authorized Procurement Solutions
Perfect Parts
This product can be easily mounted on the surface of a PCB, making it suitable for automated assembly processes.
The square package shape helps in efficient use of board space and allows for better organization of components on the PCB.
The grid array style with a very thin profile and fine pitch enables high-density mounting, allowing for more components to be placed on the PCB without compromising on space.
The use of tin, silver, and copper for terminal finish provides good conductivity and reliability, ensuring stable connections.
The bottom terminal position simplifies the PCB layout and allows for easier routing of traces, improving overall signal integrity.
With a maximum time of 30 seconds at peak reflow temperature, this product offers quick and efficient soldering during manufacturing processes.
The high peak reflow temperature of 260°C ensures proper soldering of the component on the PCB, resulting in a reliable connection.
The ball terminal form provides a secure and robust connection, minimizing the risk of disconnection or signal loss.
The low maximum supply current of 8 mA helps in reducing power consumption and heat generation, making the product more energy-efficient.
Being designed for RF and baseband circuits, this product is suitable for telecommunications applications, offering superior performance in signal processing and communication.
Cellphone ICs LMV225UR/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments
JESD-30 Code:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
No. of Channels:
No. of Functions:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Supply Current:
Surface Mount:
Telecom IC Type:
Terminal Finish:
Terminal Form:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
LMV225UR/NOPB Telecommunications trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
MC7805CTG
Onsemi
MC7805CTG by Onsemi is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation. The package style is flange mount with through-hole terminals, ensuring easy installation and reliability in diverse electronic designs.
SN6505BDBVR
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
SS14
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
2N2222A
Space Power Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MC13142D
Freescale Semiconductor
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
MAX2044ETP+T
Analog Devices
Analog Devices' MAX2044ETP+T is a Cellphone IC with 20 terminals in a square package. It operates at -40 to 85 °C, with power supplies of 3.3/5V. Ideal for RF and baseband circuits, it features BICMOS technology and a terminal pitch of 0.65mm.
ADF7021-VBCPZ-RL
Analog Devices' ADF7021-VBCPZ-RL is a cellphone IC with 48 terminals in a square chip carrier package. It operates at -40 to 85 °C, with a supply voltage of 3V. Ideal for RF and baseband circuits, it has a terminal pitch of 0.5mm and is suitable for industrial temperature grades.
MAX5864E/D
Analog Devices' MAX5864E/D is a cellphone IC with CMOS technology, operating from -40 to 85 °C. It features an unencased chip package, tin-lead terminal finish, and 3V supply voltage. Ideal for RF and baseband circuits in industrial-grade telecom applications.
MAX2605EUT+
MAX2605EUT+ by Analog Devices is a Cellphone IC with 6 terminals in a small outline package. It operates b/w -40 to 85 °C, suitable for industrial use. Telecom applications benefit from its baseband circuit and low profile design.
BALF-NRG-02D3
STMicroelectronics
BALF-NRG-02D3 by STMicroelectronics is a CELLPHONE IC with 4 terminals, PLASTIC/EPOXY body, and TIN SILVER COPPER finish. It features a GRID ARRAY package style, -40 to 105 °C operating temp range, and RF AND BASEBAND CIRCUIT for telecom applications.
MAX2676EWT+T
MAX2676EWT+T by Analog Devices is a CELLPHONE IC with BICMOS tech. Features include 3.3V supply, -40 to 85 °C temp range, and RF/BASEBAND circuitry. Package: GRID ARRAY, 0.4mm pitch, 1.27x.865x.69mm dimensions for compact telecom applications.
BGA725L6E6327FTSA1
Infineon Technologies
Infineon's BGA725L6E6327FTSA1 is a cellphone IC with 6 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features a nominal voltage of 1.8V and is designed for baseband circuit applications.
LMV226TLX/NOPB
LMV226TLX/NOPB by Texas Instruments is a cellphone IC with surface mount capability. It features a max operating temperature of 85°C, industrial temperature grade, and low supply current of 8mA. Ideal for telecom applications requiring RF and baseband circuit integration in a compact grid array package.
HMC682LP6CE
Analog Devices' HMC682LP6CE is a 40-terminal cellphone IC in a square chip carrier package with matte tin finish. It operates b/w -40 to 85°C, suitable for industrial telecom applications requiring RF and baseband circuits at a nominal 5V supply voltage. The compact design features a very thin profile, making it ideal for space-constrained environments.
CC1070-RTY1
CC1070-RTY1 by Texas Instruments is a cellphone IC with 20 terminals, operating at -40 to 105°C. It features a supply voltage of 3V, CMOS technology, and RF/baseband circuitry. This square-shaped chip carrier is surface-mountable with a very thin profile, ideal for industrial telecom applications.
SARA-R510M8S-61B
U-blox Ag
RF AND BASEBAND CIRCUIT;
LMH6522SQ
Texas Instruments LMH6522SQ is a 54-terminal cellphone IC with RF and baseband circuit. Operating b/w -40 to 85°C, it has a nominal voltage of 5V. This surface-mount chip carrier is ideal for telecom applications due to its compact size and industrial temperature grade.
LMH6523SQ/NOPB
LMH6523SQ/NOPB by Texas Instruments is a 54-terminal cellphone IC with a rectangular package style. It operates in industrial temperature range (-40 to 85°C) and has 4 channels for RF and baseband circuits. With a max gain tolerance of 25.74 dB, it consumes up to 485 mA at nominal voltage of 5V, making it suitable for telecom applications.
TCM320AC56CDWR
Texas Instruments TCM320AC56CDWR is a 20-terminal cellphone IC in small outline package. Operating temp range: 0-70°C, supply voltage: 5V. Ideal for baseband circuit applications due to CMOS technology and gull wing terminal form.
MAX5863E/D
Analog Devices' MAX5863E/D is a cellphone IC with CMOS technology, operating b/w -40 °C to 85°C. It features a 3V supply voltage, suitable for RF and baseband circuits. This surface-mount chip has tin-lead finish and is ideal for industrial telecom applications.
SKY68031-11
Skyworks Solutions
RF AND BASEBAND CIRCUIT; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3; No. of Functions: 1;
SARA-U270-03S-01
SARA-U270-03S-01 by U-blox Ag is a CELL IC with 96 terminals in RECTANGULAR CHIP CARRIER package. Operating temp range -20 to 55°C, voltage 3.8V. Ideal for telecom circuits due to its compact size (16x26mm) and butt terminal form, suitable for commercial applications.
RFFM6903
Qorvo
RFFM6903 by Qorvo is a cellphone IC with 28 terminals in a square grid array package. Operating temperature range from -40 to 85°C, suitable for industrial telecom applications. Features nickel palladium gold finish, butt terminal form, and nominal voltage of 3.6V.
CC2510F8RSP
Texas Instruments CC2510F8RSP is a cellphone IC with 36 terminals, operating at -40 to 85°C. It features a 3V supply voltage, CMOS technology, and RF/baseband circuit for telecom applications. The chip carrier package has a very thin profile, nickel palladium gold finish, and quad terminal position.
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
LMV226URX
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 4; Package Code: VFBGA; Package Shape: SQUARE;
LMV225URX
LMV225TL
LMV226UR
LMV226TL
LMV225UR
LMV226URX/NOPB
RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
LMV225SD/NOPB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;
LMV225URX/NOPB
RF AND BASEBAND CIRCUIT; Terminal Form: BALL; Package Code: VFBGA; Package Shape: SQUARE; No. of Channels: 1; Maximum Time At Peak Reflow Temperature (s): 30;
LMV225TL/NOPB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
LMV226TL/NOPB
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 8 mA;
LMV225TLX/NOPB
LMV226UR/NOPB
RF AND BASEBAND CIRCUIT; Terminal Form: BALL; Package Code: VFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; JESD-30 Code: S-XBGA-B4;
LMV225SDX/NOPB
LMV225SD
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR;
LMV225SDX
LMV225TLX
LMV226TLX
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