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LMV225TLX

Texas Instruments

LMV225TLX by Texas Instruments

Texas Instruments LMV225TLX is a cellphone IC with 4 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 200 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

10k+ parts

-

200

$0.770

$0.580

$0.500

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Vyrian

USA . 8,029 parts In-Stock

1+ parts

-

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8,029

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Digiode

USA . 4,633 parts In-Stock

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4,633

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Anansix

USA . 1,248 parts In-Stock

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1,248

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Semi Source

USA . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,109 parts In-Stock

1+ parts

$9.527

100+ parts

-

1k+ parts

$10.125

10k+ parts

-

1,109

$9.527

-

$10.125

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DigiPath Technology Company

USA . 1,859 parts In-Stock

1+ parts

$10.490

100+ parts

$9.651

1k+ parts

-

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1,859

$10.490

$9.651

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ChromeModa Solutions

Germany . 4,491 parts In-Stock

1+ parts

$10.704

100+ parts

$8.777

1k+ parts

-

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4,491

$10.704

$8.777

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IDEA Electronic Components Group

UK . 2,164 parts In-Stock

1+ parts

$10.704

100+ parts

$10.169

1k+ parts

$9.634

10k+ parts

-

2,164

$10.704

$10.169

$9.634

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AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$12.215

100+ parts

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704

$12.215

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One Stop Electronics

USA . 551 parts In-Stock

1+ parts

$564.000

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551

$564.000

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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6,000

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Alle Elektronik GmbH

Germany . 3,493 parts In-Stock

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3,493

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Corphita

USA . 2,446 parts In-Stock

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2,446

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Assy Fe

Spain . 1,856 parts In-Stock

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Perfect Parts

USA . 1,232 parts In-Stock

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1,232

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Overview

Unlock the full potential of your cellphone with the LMV225TLX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This versatile IC is perfect for a wide range of applications, offering customers exceptional value and benefits. With its compact and innovative design, the LMV225TLX ensures optimal performance and efficiency, making it the ideal choice for all your cellphone needs. Elevate your user experience and stay connected seamlessly with the LMV225TLX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the IC lightweight and durable, enhancing its reliability and longevity.

Surface Mount: YES

Being surface mountable allows for easier integration onto circuit boards, saving space and facilitating efficient assembly processes.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, making it suitable for applications where space is limited.

No. of Terminals: 4

With 4 terminals, this IC can efficiently connect to other components in the circuit, enabling seamless communication and data transfer.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the IC can perform reliably in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to function effectively even in extremely cold environments.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies the PCB layout and connection process, enhancing the overall ease of use.

Maximum Seated Height: 0.675 mm

The very thin profile and low seated height of 0.675 mm make this IC suitable for applications where space constraints are critical.

Width: 1.014 mm

The narrow width of 1.014 mm allows for a compact design, ideal for devices where size and form factor are essential considerations.

Length: 1.014 mm

The short length of 1.014 mm further contributes to the compact footprint of the IC, making it suitable for small-scale electronic devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures that the IC can operate reliably in demanding environments and industrial applications.

Terminal Form: BALL

The ball terminal form provides a reliable connection and facilitates easy soldering, enhancing the overall performance and durability of the IC.

Telecom IC Type: RF AND BASEBAND CIRCUIT

The RF and baseband circuit type makes this IC suitable for telecommunications applications, enabling efficient signal processing and communication functions.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7 V ensures compatibility with common power sources, making it easy to integrate the IC into existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density mounting, enabling the integration of multiple components within a limited space.

Technical Specifications

Cellphone ICs LMV225TLX attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B4

Length:

1.014 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

.675 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

1.014 mm

Trade Compliance

LMV225TLX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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