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LMV225SD/NOPB

Texas Instruments

LMV225SD/NOPB by Texas Instruments

LMV225SD/NOPB by Texas Instruments is a cellphone IC with 6 terminals in a small outline, very thin profile package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V and max supply current of 8mA, making it ideal for telecom applications.

Median Price

$1.590

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 110 parts In-Stock

1+ parts

$0.550

100+ parts

$0.540

1k+ parts

$0.530

10k+ parts

-

110

$0.550

$0.540

$0.530

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Arrow

USA . 11 parts In-Stock

1+ parts

$1.042

100+ parts

-

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11

$1.042

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Chip1Stop

Japan . 150 parts In-Stock

1+ parts

$1.590

100+ parts

$1.010

1k+ parts

-

10k+ parts

$0.891

150

$1.590

$1.010

-

$0.891

DigiKey

USA . 11,816 parts In-Stock

1+ parts

$1.910

100+ parts

$1.139

1k+ parts

$1.001

10k+ parts

$0.929

11,816

$1.910

$1.139

$1.001

$0.929

Mouser Electronics

USA . 4,128 parts In-Stock

1+ parts

$1.910

100+ parts

$1.140

1k+ parts

$1.000

10k+ parts

$0.945

4,128

$1.910

$1.140

$1.000

$0.945

Verical

USA . 11 parts In-Stock

1+ parts

-

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-

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11

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,287 parts In-Stock

1+ parts

$0.845

100+ parts

-

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-

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3,287

$0.845

-

-

-

Vyrian

USA . 847 parts In-Stock

1+ parts

$0.889

100+ parts

-

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-

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847

$0.889

-

-

-

Maritex

Poland . 337 parts In-Stock

1+ parts

$2.259

100+ parts

$1.098

1k+ parts

$0.955

10k+ parts

-

337

$2.259

$1.098

$0.955

-

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

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3,000

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Quantum Digital Technology

USA . 1,355 parts In-Stock

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1,355

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Microfarads

USA . 865 parts In-Stock

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865

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Anansix

USA . 528 parts In-Stock

1+ parts

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528

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Prism Electronics

USA . 147 parts In-Stock

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147

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Connector Distribution Corp

USA . 101 parts In-Stock

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101

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Right Parts Inc.

USA . 101 parts In-Stock

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101

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 5,569 parts In-Stock

1+ parts

$0.700

100+ parts

$0.870

1k+ parts

$0.930

10k+ parts

-

5,569

$0.700

$0.870

$0.930

-

Corphita

USA . 2,757 parts In-Stock

1+ parts

$0.800

100+ parts

-

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2,757

$0.800

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Parana Technologies

USA . 411 parts In-Stock

1+ parts

$8.462

100+ parts

-

1k+ parts

$9.107

10k+ parts

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411

$8.462

-

$9.107

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DigiPath Technology Company

USA . 1,538 parts In-Stock

1+ parts

$9.318

100+ parts

$8.572

1k+ parts

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1,538

$9.318

$8.572

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ChromeModa Solutions

Germany . 2,768 parts In-Stock

1+ parts

$9.508

100+ parts

$7.797

1k+ parts

-

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2,768

$9.508

$7.797

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IDEA Electronic Components Group

UK . 989 parts In-Stock

1+ parts

$9.508

100+ parts

$9.033

1k+ parts

$8.557

10k+ parts

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989

$9.508

$9.033

$8.557

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Lixinc

USA . 10,867 parts In-Stock

1+ parts

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10,867

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 9,063 parts In-Stock

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Metaverse IC Inc.

Canada . 5,880 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,576 parts In-Stock

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5,576

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Alle Elektronik GmbH

Germany . 3,025 parts In-Stock

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3,025

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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S.R.D Solutions

India . 1,000 parts In-Stock

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1,000

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Overview

Unlock the potential of your cellphone with the LMV225SD/NOPB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Cellphone ICs that guarantee reliability and performance. This versatile component offers a range of applications in RF and baseband circuits, providing customers with enhanced functionality and efficiency. With its small outline and very thin profile package style, this product is designed for seamless integration and optimal performance. Experience the value and benefits of Texas Instruments' innovative solutions with the LMV225SD/NOPB.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: RECTANGULAR

Compact shape allows for efficient use of space on the PCB.

No. of Terminals: 6

Sufficient number of terminals for connectivity and functionality.

Package Style: SMALL OUTLINE, VERY THIN PROFILE

Low profile design is ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

Can operate in high temperature environments without issues.

Minimum Operating Temperature: -40 °C

Can operate in low temperature environments without issues.

Terminal Finish: MATTE TIN

Provides reliable solder connections for long-term durability.

Terminal Position: DUAL

Dual terminal position allows for flexible circuit design.

Maximum Seated Height: 0.8 mm

Low seated height is beneficial for slim device design.

Width: 2.2 mm

Narrow width is suitable for space-constrained PCB layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes potential damage to the component during assembly.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures stable solder connections.

Length: 2.5 mm

Moderate length provides a balanced footprint on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature requirements.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with regulations.

Maximum Supply Current: 8 mA

Low supply current consumption for energy-efficient operation.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combines RF and baseband circuit functions for comprehensive communication capability.

Nominal Supply Voltage: 2.7 V

Low supply voltage requirement for power-efficient operation.

Terminal Pitch: 0.65 mm

Fine terminal pitch enables high-density PCB design.

Technical Specifications

Cellphone ICs LMV225SD/NOPB attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e3

Length:

2.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Current:

8 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.2 mm

Trade Compliance

LMV225SD/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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