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ADRF6658BCPZ-RL7

Analog Devices

ADRF6658BCPZ-RL7 by Analog Devices

Analog Devices' ADRF6658BCPZ-RL7 is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 °C to 105°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3.3V, making it ideal for telecom applications.

Median Price

$20.090

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 154 parts In-Stock

1+ parts

-

100+ parts

$20.090

1k+ parts

$17.980

10k+ parts

$16.920

154

-

$20.090

$17.980

$16.920

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 493 parts In-Stock

1+ parts

$19.408

100+ parts

-

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493

$19.408

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-

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Vyrian

USA . 8,420 parts In-Stock

1+ parts

-

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8,420

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Conversion2

USA . 1,148 parts In-Stock

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1,148

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 594 parts In-Stock

1+ parts

$0.325

100+ parts

-

1k+ parts

-

10k+ parts

$0.312

594

$0.325

-

-

$0.312

Northwest PG Solutions

USA . 2,359 parts In-Stock

1+ parts

$0.358

100+ parts

-

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-

10k+ parts

$0.315

2,359

$0.358

-

-

$0.315

AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$9.030

100+ parts

-

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764

$9.030

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Advanced Electronics

New Zealand . 60 parts In-Stock

1+ parts

$11.520

100+ parts

$10.483

1k+ parts

$9.446

10k+ parts

-

60

$11.520

$10.483

$9.446

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Parana Technologies

USA . 1,321 parts In-Stock

1+ parts

$12.558

100+ parts

-

1k+ parts

$11.679

10k+ parts

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1,321

$12.558

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$11.679

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IDEA Electronic Components Group

UK . 192 parts In-Stock

1+ parts

$13.503

100+ parts

$12.828

1k+ parts

$12.828

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192

$13.503

$12.828

$12.828

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Semicontronic

India . 448 parts In-Stock

1+ parts

$17.370

100+ parts

$16.936

1k+ parts

$16.849

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448

$17.370

$16.936

$16.849

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Corphita

USA . 610 parts In-Stock

1+ parts

$18.387

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610

$18.387

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DigiPath Technology Company

USA . 2,203 parts In-Stock

1+ parts

$21.065

100+ parts

$20.222

1k+ parts

-

10k+ parts

$20.222

2,203

$21.065

$20.222

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$20.222

Corohmni

South Africa . 71 parts In-Stock

1+ parts

$21.849

100+ parts

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71

$21.849

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Overview

Discover the cutting-edge technology of the ADRF6658BCPZ-RL7 by Analog Devices, a leading manufacturer in the industry. This high-quality cellphone IC offers unparalleled performance and reliability for a variety of applications. With its surface mount capability and compact square package shape, this innovative product is perfect for telecom RF and baseband circuit designs. Experience the value and benefits of this advanced solution, from its industrial temperature grade to its low profile design. Trust Analog Devices to deliver top-of-the-line products that exceed expectations. Elevate your projects with the ADRF6658BCPZ-RL7 today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto a PCB, making it suitable for mass production.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, enabling compact and sleek design for the cellphone.

No. of Terminals: 48

Sufficient number of terminals for connecting various components in the cellphone IC, ensuring optimal functionality.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, providing reliability and durability in different environmental conditions.

Nominal Supply Voltage: 3.3 V

Compatible with standard supply voltages in cellphones, ensuring seamless integration and operation.

Technical Specifications

Cellphone ICs ADRF6658BCPZ-RL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

ADRF6658BCPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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