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ADRF5547BCPZN-RL

Analog Devices

ADRF5547BCPZN-RL by Analog Devices

Analog Devices' ADRF5547BCPZN-RL is a 40-terminal cellphone IC with a square package shape and chip carrier style. It operates b/w -40 to 105 °C, suitable for industrial telecom applications requiring RF front end circuits. With a nominal voltage of 5V, it features a terminal pitch of 0.5mm and can withstand peak reflow temperature of 260°C for up to 30 seconds.

Median Price

$20.330

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 12,500 parts In-Stock

1+ parts

$24.050

100+ parts

-

1k+ parts

$15.440

10k+ parts

$17.714

12,500

$24.050

-

$15.440

$17.714

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$16.611

2,500

-

-

-

$16.611

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 188 parts In-Stock

1+ parts

$19.864

100+ parts

-

1k+ parts

-

10k+ parts

-

188

$19.864

-

-

-

Vyrian

USA . 6,926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,926

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,637 parts In-Stock

1+ parts

$16.193

100+ parts

-

1k+ parts

$15.060

10k+ parts

-

1,637

$16.193

-

$15.060

-

Ampacity Inc.

Singapore . 12,398 parts In-Stock

1+ parts

$16.310

100+ parts

-

1k+ parts

-

10k+ parts

-

12,398

$16.310

-

-

-

Semicontronic

India . 12,069 parts In-Stock

1+ parts

$16.310

100+ parts

$15.902

1k+ parts

$15.821

10k+ parts

-

12,069

$16.310

$15.902

$15.821

-

IDEA Electronic Components Group

UK . 736 parts In-Stock

1+ parts

$17.412

100+ parts

$16.541

1k+ parts

$16.541

10k+ parts

-

736

$17.412

$16.541

$16.541

-

AZTECH Wire

Italy . 1,179 parts In-Stock

1+ parts

$18.660

100+ parts

-

1k+ parts

-

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1,179

$18.660

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-

-

Native Components

USA . 946 parts In-Stock

1+ parts

$18.713

100+ parts

-

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946

$18.713

-

-

-

Corphita

USA . 508 parts In-Stock

1+ parts

$18.819

100+ parts

-

1k+ parts

-

10k+ parts

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508

$18.819

-

-

-

Northwest PG Solutions

USA . 603 parts In-Stock

1+ parts

$20.584

100+ parts

$18.526

1k+ parts

-

10k+ parts

-

603

$20.584

$18.526

-

-

DigiPath Technology Company

USA . 591 parts In-Stock

1+ parts

$27.163

100+ parts

$26.076

1k+ parts

-

10k+ parts

$26.076

591

$27.163

$26.076

-

$26.076

QUARKTWIN TECHNOLOGY LTD

USA . 14,193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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14,193

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Overview

Enhance the performance of your cellphone with the ADRF5547BCPZN-RL by Analog Devices, a top-tier manufacturer known for its innovative solutions. This cutting-edge RF front end circuit offers unparalleled quality and reliability, making it an ideal choice for a wide range of applications. With its compact square package shape and 40 terminals, this surface mount IC delivers exceptional value and benefits to customers looking to optimize their mobile device's functionality. Upgrade your cellphone experience today with the ADRF5547BCPZN-RL and enjoy superior performance like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and costs during manufacturing.

Package Shape: SQUARE

Square package shape provides uniformity and compactness, making the IC suitable for applications where space is limited.

No. of Terminals: 40

Having 40 terminals allows for connection to multiple components and peripherals, making the IC versatile for various applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environments where temperature fluctuates.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to function effectively in cold conditions without any degradation in performance.

Telecom IC Type: RF FRONT END CIRCUIT

Being a RF front end circuit IC, it is designed specifically for wireless communication applications, ensuring optimal signal transmission and reception.

Technical Specifications

Cellphone ICs ADRF5547BCPZN-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N40

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

ADRF5547BCPZN-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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