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MAX5863ETM+T

Analog Devices

MAX5863ETM+T by Analog Devices

Analog Devices' MAX5863ETM+T is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features RF and baseband circuits, CMOS technology, and nominal voltage of 3V for telecom applications.

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Vyrian

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Digiode

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Anansix

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AZTECH Wire

Italy . 450 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

USA . 924 parts In-Stock

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Kenton Components

USA . 200 parts In-Stock

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Qasali Group International

UK . 5,733 parts In-Stock

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One Stop Electronics

USA . 2,576 parts In-Stock

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Semicontronic

India . 1,013 parts In-Stock

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Microchip USA

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Overview

Unleash the power of connectivity with the MAX5863ETM+T by Analog Devices. This cutting-edge Cellphone IC boasts top-tier quality and reliability, courtesy of a renowned manufacturer. With its sleek surface mount design and versatile package styles, this chip enables seamless integration into various devices. Elevate your communication experience with enhanced RF and baseband circuitry, all while enjoying the convenience of a wide supply voltage range and industrial-grade temperature tolerance. Stay ahead of the curve with the MAX5863ETM+T - where innovation meets excellence.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in production processes.

Package Shape: SQUARE

Square package shape provides better stability and alignment on the circuit board, reducing the risk of misalignment during assembly.

No. of Terminals: 48

Having 48 terminals allows for a higher level of connectivity and functionality within the cellphone IC, enabling more features and capabilities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles results in efficient heat dissipation and space-saving design for compact and high-performing cellphone ICs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the cellphone IC can maintain stability and reliability even under demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the cellphone IC can function effectively even in extremely cold environments, making it versatile and resilient.

Terminal Position: QUAD

Quad terminal positions provide better connectivity and signal transmission, enhancing the overall performance of the cellphone IC.

Maximum Seated Height: 0.8 mm

The low maximum seated height contributes to a streamlined and space-efficient design, ideal for slim and sleek cellphone devices.

Width: 7 mm

Compact width dimensions enable the cellphone IC to fit into smaller and more compact devices, offering flexibility in design and application.

Length: 7 mm

The short length of the cellphone IC allows for better integration and placement within the device, optimizing space utilization and overall layout.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this cellphone IC is built to withstand harsh environmental conditions and deliver reliable performance in demanding settings.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliable operation, making it an efficient choice for cellphone ICs requiring high-performance and energy efficiency.

Terminal Form: NO LEAD

The no-lead terminal form ensures improved reliability and durability, minimizing the risk of lead-related issues and offering a safer and more environmentally friendly solution.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuit capabilities in one IC allows for seamless communication and signal processing within the cellphone, enhancing overall connectivity and performance.

Nominal Supply Voltage: 3 V

Having a nominal supply voltage of 3V provides compatibility with standard power sources, ensuring consistent and stable operation of the cellphone IC.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density packaging and fine pitch interconnects, enabling more efficient signal transmission and reducing signal loss within the cellphone IC.

Technical Specifications

Cellphone ICs MAX5863ETM+T attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

MAX5863ETM+T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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