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HMC495LP3E

Analog Devices

HMC495LP3E by Analog Devices

HMC495LP3E by Analog Devices is a cellphone IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, suitable for industrial use. Telecom IC type for RF and baseband circuits, with nominal voltage of 3.3V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,515 parts In-Stock

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6,515

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Chip Stock

USA . 6,374 parts In-Stock

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6,374

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Digiode

USA . 622 parts In-Stock

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622

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LIBRA Elektronik GmbH

Germany . 80 parts In-Stock

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80

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North Shore Components

USA . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 4,744 parts In-Stock

1+ parts

$10.853

100+ parts

-

1k+ parts

$10.093

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4,744

$10.853

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$10.093

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IDEA Electronic Components Group

UK . 2,110 parts In-Stock

1+ parts

$11.670

100+ parts

$11.086

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$11.086

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2,110

$11.670

$11.086

$11.086

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AZTECH Wire

Italy . 877 parts In-Stock

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$12.815

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877

$12.815

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DigiPath Technology Company

USA . 622 parts In-Stock

1+ parts

$18.205

100+ parts

$17.477

1k+ parts

-

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$17.477

622

$18.205

$17.477

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$17.477

One Stop Electronics

USA . 495 parts In-Stock

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$44.000

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495

$44.000

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Semicontronic

India . 998 parts In-Stock

1+ parts

$120.000

100+ parts

$117.000

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$116.400

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998

$120.000

$117.000

$116.400

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QUARKTWIN TECHNOLOGY LTD

USA . 12,845 parts In-Stock

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12,845

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Perfect Parts

USA . 1,313 parts In-Stock

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1,313

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RC Electronics

USA . 1,290 parts In-Stock

1+ parts

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$5.040

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$4.580

10k+ parts

$4.420

1,290

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$5.040

$4.580

$4.420

Corphita

USA . 544 parts In-Stock

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544

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Overview

Elevate your cellphone performance with the HMC495LP3E by Analog Devices. This cutting-edge Cellphone IC boasts top-tier quality and reliability from a trusted manufacturer, ensuring seamless functionality for your device. With applications in RF and baseband circuits, this versatile chip carrier offers unparalleled value and benefits to customers looking for enhanced connectivity and efficiency. Say goodbye to technical glitches and hello to optimal performance with the HMC495LP3E - the ultimate solution for your mobile communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into a variety of PCB designs.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and easy placement during assembly.

No. of Terminals: 16

With 16 terminals, this product can handle a variety of connections and functionalities.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensure efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows this product to withstand harsh environments and extended usage.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures this product can function in colder conditions without any issues.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position allows for easy alignment and connection on the PCB.

Maximum Seated Height: 1 mm

The low seated height enables compact and slim product designs.

Width: 3 mm

The small width makes this product suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds minimizes the risk of thermal damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Length: 3 mm

The short length of 3 mm contributes to the compact form factor of this product.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for a wide range of operating environments.

Terminal Form: NO LEAD

The use of lead-free terminal form makes this product environmentally friendly.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Featuring RF and baseband circuit functionality, this product is suitable for telecom applications requiring signal processing and RF communication.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in electronics, making this product compatible with many systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting and connectivity in compact PCB designs.

Technical Specifications

Cellphone ICs HMC495LP3E attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

HMC495LP3E Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5865-01-615-3223, 5865016153223

NIIN

016153223

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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