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HMC422MS8

Analog Devices

HMC422MS8 by Analog Devices

Analog Devices' HMC422MS8 is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40°C to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,291 parts In-Stock

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Digiode

USA . 824 parts In-Stock

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Prism Electronics

USA . 78 parts In-Stock

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Parana Technologies

USA . 1,696 parts In-Stock

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$7.056

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$6.562

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IDEA Electronic Components Group

UK . 2,174 parts In-Stock

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$7.587

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$7.208

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DigiPath Technology Company

USA . 2,272 parts In-Stock

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$11.836

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$11.362

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$11.362

2,272

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$11.362

AZTECH Wire

Italy . 230 parts In-Stock

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$15.627

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Semicontronic

India . 513 parts In-Stock

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$954.000

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$930.150

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$925.380

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513

$954.000

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$925.380

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One Stop Electronics

USA . 1,137 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,634 parts In-Stock

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Kepictronics

USA . 7,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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GreenTree Electronics

Israel . 2,330 parts In-Stock

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Corphita

USA . 451 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of your cellphone with the HMC422MS8 by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch quality and reliability. This Cellphone IC is designed to optimize performance and efficiency, making it perfect for a wide range of applications. With its compact design and advanced features, this product offers exceptional value and benefits to customers looking to enhance their mobile devices. Upgrade your cellphone experience with the HMC422MS8 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort in the production process.

Package Shape: SQUARE

Square package shape provides a compact design, maximizing space efficiency on the circuit board.

No. of Terminals: 8

Having 8 terminals allows for a sufficient number of connections, enabling versatile functionality and connectivity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform reliably in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function even in extremely cold environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good electrical conductivity and corrosion resistance, enhancing the product's performance and longevity.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options, allowing for multiple configurations and applications.

Maximum Seated Height: 1.1 mm

Low maximum seated height minimizes the profile of the product, making it suitable for compact electronic devices.

Width: 3 mm

Narrow width dimension enables space-efficient placement on the circuit board, ideal for densely packed electronic assemblies.

Peak Reflow Temperature °C: 235

High peak reflow temperature ensures proper soldering during assembly, leading to secure and reliable connections.

Length: 3 mm

Compact length dimension saves space on the circuit board, contributing to efficient layout and design.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can withstand harsh operating conditions typically found in industrial environments.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical stability and ease of soldering, enhancing the overall reliability of the product.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Combining RF and baseband circuits in one IC simplifies the design and improves the performance of telecom applications.

Nominal Supply Voltage: 3 V

Stable 3V supply voltage provides consistent power to the product, ensuring reliable operation without voltage fluctuations.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for dense packing of terminals on the IC, enabling high functionality in a compact form factor.

Technical Specifications

Cellphone ICs HMC422MS8 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

HMC422MS8 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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