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AD6432AST

Analog Devices

AD6432AST by Analog Devices

AD6432AST by Analog Devices is a Cellphone IC with 44 terminals, operating at -25 to 85 °C. It has a supply voltage of 3/3.3 V and uses BIPOLAR technology for BASEBAND CIRCUIT applications in telecom devices. The package is SQUARE, FLATPACK, LOW PROFILE made of PLASTIC/EPOXY with GULL WING terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,595 parts In-Stock

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Digiode

USA . 495 parts In-Stock

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495

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Parana Technologies

USA . 3,532 parts In-Stock

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$5.745

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$5.342

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3,532

$5.745

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$5.342

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IDEA Electronic Components Group

UK . 2,049 parts In-Stock

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$6.177

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$5.868

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2,049

$6.177

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$5.868

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DigiPath Technology Company

USA . 1,842 parts In-Stock

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$9.636

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$9.251

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$9.636

$9.251

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AZTECH Wire

Italy . 364 parts In-Stock

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$17.059

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364

$17.059

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Native Components

USA . 377 parts In-Stock

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$17.691

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377

$17.691

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Northwest PG Solutions

USA . 630 parts In-Stock

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$19.460

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$17.514

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630

$19.460

$17.514

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One Stop Electronics

USA . 1,482 parts In-Stock

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$493.000

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Semicontronic

India . 386 parts In-Stock

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$888.000

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$865.800

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$861.360

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386

$888.000

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$861.360

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Kepictronics

USA . 5,500 parts In-Stock

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5,500

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 799 parts In-Stock

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Overview

Elevate your cellphone performance with the AD6432AST by Analog Devices. Known for their top-notch quality and innovation in the industry, Analog Devices delivers unparalleled value to customers through cutting-edge technology and reliability. This Cellphone IC offers seamless integration and enhanced functionality for various telecom applications. With a focus on power efficiency and optimal performance, this product ensures a superior user experience. Upgrade your device today with the AD6432AST and experience the difference Analog Devices can make in your technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

Power Supplies (V): 3/3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with various systems.

No. of Terminals: 44

Having a high number of terminals allows for more connectivity options and features in the device.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style saves space and enables a compact design for the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature allows for use in a wide range of temperatures without compromising functionality.

Terminal Position: QUAD

The quad terminal position provides stability and ease of soldering during installation.

Maximum Seated Height: 1.6 mm

The low maximum seated height contributes to a slim and compact form factor for the product.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precision in signal processing, ideal for cellphone ICs.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and maintenance of the product.

Telecom IC Type: BASEBAND CIRCUIT

The baseband circuit type is essential for handling communication protocols and data processing in cellular devices.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is a standard requirement for many cellphone components, ensuring compatibility with existing systems.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for fine-pitch connections and compact layout on the circuit board.

Technical Specifications

Cellphone ICs AD6432AST attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PQFP-G44

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

AD6432AST Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.G

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

Category top products 20

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