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ADF7901BRUZ-REEL7

Analog Devices

ADF7901BRUZ-REEL7 by Analog Devices

Analog Devices' ADF7901BRUZ-REEL7 is a cellphone IC with 24 terminals in a small outline, thin profile package. It operates b/w 0 °C to 50°C and has a nominal voltage of 3V. This RF and baseband circuit is ideal for telecom applications requiring high-performance connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,080 parts In-Stock

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Digiode

USA . 797 parts In-Stock

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AZTECH Wire

Italy . 654 parts In-Stock

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$12.012

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$12.012

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Parana Technologies

USA . 574 parts In-Stock

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$14.577

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$13.556

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IDEA Electronic Components Group

UK . 86 parts In-Stock

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$15.674

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$14.890

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$14.890

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86

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$14.890

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DigiPath Technology Company

USA . 2,549 parts In-Stock

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$24.451

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$23.473

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$23.473

2,549

$24.451

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$23.473

Native Components

USA . 878 parts In-Stock

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$181.211

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$173.963

878

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$173.963

Northwest PG Solutions

USA . 582 parts In-Stock

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$199.332

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582

$199.332

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Semicontronic

India . 1,034 parts In-Stock

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$212.000

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$206.700

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$205.640

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One Stop Electronics

USA . 339 parts In-Stock

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$216.000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Corphita

USA . 486 parts In-Stock

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Overview

Unlock the potential of your cellphone with the ADF7901BRUZ-REEL7 by Analog Devices. Known for their top-notch quality and reliability, Analog Devices delivers cutting-edge Cellphone ICs that are perfect for a wide range of applications. With a sleek design and advanced features, this product offers customers unmatched value, benefits, and advantages. Upgrade your device today and experience the difference that Analog Devices can make in your technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection to the internal components of the cellphone IC, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy installation and integration of the IC onto the PCB, making the manufacturing process more efficient.

Maximum Operating Temperature: 50 °C

With a high maximum operating temperature of 50 °C, this cellphone IC can withstand demanding environmental conditions without compromising performance.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage is commonly used in mobile devices, ensuring compatibility and efficient power management.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This cellphone IC is designed for RF and Baseband circuit applications, making it suitable for telecommunications devices that require high-performance signal processing capabilities.

Technical Specifications

Cellphone ICs ADF7901BRUZ-REEL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

ADF7901BRUZ-REEL7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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