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ADF7020-1BCPZ

Analog Devices

ADF7020-1BCPZ by Analog Devices

Analog Devices' ADF7020-1BCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V, RF and baseband circuits for telecom applications, and a compact square package suitable for surface mounting in industrial settings.

Median Price

$5.792

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 6 parts In-Stock

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$2.100

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$2.100

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Analog Devices Inc

USA . 13 parts In-Stock

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$7.170

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$5.426

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$3.320

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13

$7.170

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$3.320

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DigiKey

USA . 61 parts In-Stock

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$7.650

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$5.793

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$5.286

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$5.093

61

$7.650

$5.793

$5.286

$5.093

Verical

USA . 260 parts In-Stock

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$4.414

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260

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$4.414

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Digiode

USA . 877 parts In-Stock

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$1.995

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$1.995

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Nova Conductors

Japan . 100 parts In-Stock

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$4.269

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Chip Stock

USA . 9,550 parts In-Stock

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Vyrian

USA . 6,782 parts In-Stock

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VNN

France . 1,251 parts In-Stock

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Bristol Electronics

USA . 331 parts In-Stock

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Cyclops Electronics Ltd

UK . 46 parts In-Stock

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Flex Direct, LLC

USA . 26 parts In-Stock

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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ABC Electronics Ltd.

UK . 10 parts In-Stock

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Connector Distribution Corp

USA . 7 parts In-Stock

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Right Parts Inc.

USA . 7 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 139 parts In-Stock

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$1.780

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$1.780

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Semicontronic

India . 45 parts In-Stock

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$1.780

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$1.736

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$1.727

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45

$1.780

$1.736

$1.727

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Corphita

USA . 873 parts In-Stock

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$1.890

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873

$1.890

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Continental Prestige Electronics

USA . 4,255 parts In-Stock

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$4.032

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$3.952

4,255

$4.032

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$3.952

Argo Parts USA

USA . 2,614 parts In-Stock

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$4.032

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2,614

$4.032

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Netroflash

USA . 1,000 parts In-Stock

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$4.269

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$4.269

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Corohmni

South Africa . 35 parts In-Stock

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$8.474

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$8.474

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$9.265

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$8.431

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$7.597

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$9.265

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$7.597

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Aztec Data Supply Inc.

USA . 155 parts In-Stock

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$10.637

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AZTECH Wire

Italy . 657 parts In-Stock

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$12.578

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Parana Technologies

USA . 320 parts In-Stock

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$16.720

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$15.549

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$16.720

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IDEA Electronic Components Group

UK . 95 parts In-Stock

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$17.978

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$17.079

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$17.079

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$17.978

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$17.079

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DigiPath Technology Company

USA . 1,522 parts In-Stock

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$28.046

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$26.924

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$26.924

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$28.046

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$26.924

RC Electronics

USA . 8,422 parts In-Stock

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$4.500

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$4.110

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$3.980

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$3.980

A-Z Elektronik GmbH

Germany . 5,550 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Lixinc

USA . 3,943 parts In-Stock

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GreenTree Electronics

Israel . 3,780 parts In-Stock

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3,780

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Kepictronics

USA . 1,734 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Elevate your cellphone design with the ADF7020-1BCPZ by Analog Devices, a top-tier manufacturer known for delivering high-quality ICs. This powerful chip carrier offers a very thin profile and quad terminal position, making it perfect for cutting-edge telecom applications. With a nominal supply voltage of 3V and industrial temperature grade, this RF and baseband circuit ensures reliable performance in any environment. Trust Analog Devices to provide innovative solutions that enhance the functionality and efficiency of your devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a circuit board, saving time and reducing costs.

Power Supplies (V): 2.5/3.3

Having multiple power supply options allows for flexibility in different applications and compatibility with various systems.

No. of Terminals: 48

A higher number of terminals allows for more connections and functionality within the integrated circuit, making it suitable for complex cellphone applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offer efficient heat dissipation and space-saving design in cellphone applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding conditions, making the product suitable for industrial use.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability of the integrated circuit.

Telecom IC Type: RF AND BASEBAND CIRCUIT

Having both RF and baseband circuit capabilities in one IC simplifies the design and integration process for cellphone manufacturers, reducing overall system complexity.

Technical Specifications

Cellphone ICs ADF7020-1BCPZ attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

ADF7020-1BCPZ Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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