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ADF7020-11BCPZ-RL7

Analog Devices

ADF7020-11BCPZ-RL7 by Analog Devices

Analog Devices ADF7020-11BCPZ-RL7 is a cellphone IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 3V, making it ideal for telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,924 parts In-Stock

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Digiode

USA . 619 parts In-Stock

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619

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Native Components

USA . 762 parts In-Stock

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$1.469

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762

$1.469

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Northwest PG Solutions

USA . 1,202 parts In-Stock

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$1.616

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$1.616

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Parana Technologies

USA . 4,139 parts In-Stock

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$9.837

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$9.148

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$9.837

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$9.148

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IDEA Electronic Components Group

UK . 1,859 parts In-Stock

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$10.577

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$10.048

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AZTECH Wire

Italy . 741 parts In-Stock

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$12.937

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DigiPath Technology Company

USA . 1,909 parts In-Stock

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$16.500

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$15.840

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$15.840

1,909

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$15.840

One Stop Electronics

USA . 872 parts In-Stock

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$326.000

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Semicontronic

India . 538 parts In-Stock

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$901.000

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$878.475

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$873.970

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538

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Ampacity Inc.

Singapore . 1,604 parts In-Stock

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$905.000

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Corphita

USA . 355 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the ADF7020-11BCPZ-RL7 by Analog Devices. Manufactured to the highest quality standards, this Cellphone IC is designed for superior performance and reliability. With its surface mount capability and compact square package shape, this IC offers endless possibilities in telecommunications. From RF circuits to baseband processing, this versatile device provides outstanding value and benefits to customers looking for cutting-edge solutions in the industry. Elevate your communication systems with the ADF7020-11BCPZ-RL7 and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient installation on a circuit board, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board and allowing for higher component density.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options for various functions and interfaces within a cellphone IC.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even under demanding environmental conditions.

Nominal Supply Voltage: 3 V

The 3V supply voltage is commonly used in cellphone ICs, ensuring compatibility and ease of integration in existing systems.

Technical Specifications

Cellphone ICs ADF7020-11BCPZ-RL7 attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

ADF7020-11BCPZ-RL7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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