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ADF7020-1BCPZ-RL

Analog Devices

ADF7020-1BCPZ-RL by Analog Devices

Analog Devices' ADF7020-1BCPZ-RL is a cellphone IC with 48 terminals, operating at -40 to 85 °C. It features a supply voltage of 3V, RF and baseband circuitry, and a compact square package suitable for telecom applications.

Median Price

$3.822

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 22,500 parts In-Stock

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$3.822

22,500

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$3.822

Distributors (In-Stock)

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Vyrian

USA . 8,595 parts In-Stock

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8,595

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Digiode

USA . 438 parts In-Stock

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438

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Distributors (Availability)

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Native Components

USA . 799 parts In-Stock

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$0.312

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$0.300

799

$0.312

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$0.300

Northwest PG Solutions

USA . 811 parts In-Stock

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$0.343

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$0.303

811

$0.343

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$0.303

Semicontronic

India . 4,971 parts In-Stock

1+ parts

$3.750

100+ parts

$3.656

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$3.638

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4,971

$3.750

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$3.638

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Parana Technologies

USA . 1,482 parts In-Stock

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$8.071

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$7.506

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1,482

$8.071

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IDEA Electronic Components Group

UK . 2,281 parts In-Stock

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$8.678

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$8.244

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DigiPath Technology Company

USA . 188 parts In-Stock

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$13.538

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$12.996

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$12.996

188

$13.538

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$12.996

AZTECH Wire

Italy . 1,074 parts In-Stock

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$15.170

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QUARKTWIN TECHNOLOGY LTD

USA . 20,721 parts In-Stock

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Metaverse IC Inc.

Canada . 7,500 parts In-Stock

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Component Stockers USA

USA . 3,637 parts In-Stock

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Corphita

USA . 444 parts In-Stock

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Overview

Enhance the performance of your cellphone with the ADF7020-1BCPZ-RL by Analog Devices. With a reputation for superior quality and reliability, Analog Devices delivers cutting-edge technology in the telecommunications industry. This surface mount IC offers seamless integration with power supplies of 2.5/3.3V, making it ideal for various applications. Elevate your communication experience with this compact and efficient solution that provides unmatched value and benefits to customers seeking top-notch connectivity solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly, making this product suitable for mass production.

Package Shape: SQUARE

The square package shape helps optimize space usage and allows for efficient placement on circuit boards.

Power Supplies (V): 2.5/3.3

This product supports multiple power supply voltages, providing flexibility in various applications.

No. of Terminals: 48

Having a high number of terminals allows for a greater degree of connectivity and functionality in the device.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile in the package style helps in thermal management and space-saving.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this product suitable for use in diverse environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and helps in preventing corrosion, ensuring reliable connections.

Terminal Position: QUAD

The quad terminal position allows for efficient routing and connection of signals within the device.

Maximum Seated Height: 1 mm

The low maximum seated height helps in reducing overall profile of the device, making it suitable for compact designs.

Width: 7 mm

The compact width of 7mm ensures that the product can fit into tight spaces on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required for peak reflow temperature helps in preventing damage to the IC during the assembly process.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the soldering process without any adverse effects on performance.

Length: 7 mm

The compact length of 7mm allows for efficient placement and routing of the IC on a circuit board.

Temperature Grade: INDUSTRIAL

Being industrial-grade, this product is suitable for use in harsh environments and demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and complies with RoHS regulations, making it a sustainable choice.

Telecom IC Type: RF AND BASEBAND CIRCUIT

This product is designed for telecom applications and incorporates both RF and baseband circuit functionalities for improved performance.

Nominal Supply Voltage: 3 V

The 3V nominal supply voltage ensures compatibility with standard power sources and simplifies integration into existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and increased connectivity within the device.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand standard levels of exposure to humidity during handling and storage.

Technical Specifications

Cellphone ICs ADF7020-1BCPZ-RL attributes and parameters. Explore more Cellphone ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

ADF7020-1BCPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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