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TLV321AC37CN

Texas Instruments

TLV321AC37CN by Texas Instruments

TLV321AC37CN by Texas Instruments is a 20-terminal IC for cellphones. It operates b/w 0-70°C, with a supply voltage of 3V. This CMOS technology-based IC is ideal for baseband circuits in commercial-grade applications due to its compact rectangular package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,714 parts In-Stock

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2,714

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Digiode

USA . 186 parts In-Stock

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186

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Distributors (Availability)

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AZTECH Wire

Italy . 461 parts In-Stock

1+ parts

$7.135

100+ parts

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461

$7.135

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Parana Technologies

USA . 928 parts In-Stock

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$13.031

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$13.526

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928

$13.031

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$13.526

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DigiPath Technology Company

USA . 2,273 parts In-Stock

1+ parts

$14.349

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2,273

$14.349

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ChromeModa Solutions

Germany . 3,800 parts In-Stock

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$14.642

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$12.006

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3,800

$14.642

$12.006

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IDEA Electronic Components Group

UK . 479 parts In-Stock

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$14.642

100+ parts

$13.910

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$13.178

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479

$14.642

$13.910

$13.178

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One Stop Electronics

USA . 1,278 parts In-Stock

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$64.000

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1,278

$64.000

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Semicontronic

India . 181 parts In-Stock

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$885.000

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$862.875

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$858.450

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181

$885.000

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$858.450

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Corphita

USA . 4,673 parts In-Stock

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Corohmni

South Africa . 110 parts In-Stock

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Overview

Enhance your cellphone's performance with the TLV321AC37CN by Texas Instruments. Known for their top-quality products, Texas Instruments delivers cutting-edge technology in a compact rectangular package. With 20 terminals and a commercial temperature grade, this baseband circuit will elevate your device's capabilities. Experience seamless communication and enhanced functionality with this innovative IC. Upgrade your cellphone today with the TLV321AC37CN and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for the product, making it a suitable choice for long-term use.

No. of Terminals: 20

Having 20 terminals allows for the IC to support a wide range of functions and connectivity options, making it versatile for various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the IC can withstand extreme conditions, making it suitable for use in diverse environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable for extended use.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V makes the IC compatible with a wide range of devices and power sources, enhancing its usability.

Technical Specifications

Cellphone ICs TLV321AC37CN attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TLV321AC37CN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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