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TLV320AC56IDWR

Texas Instruments

TLV320AC56IDWR by Texas Instruments

TLV320AC56IDWR by Texas Instruments is a Cellphone IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, 3V supply voltage, and Gull Wing terminal form. Ideal for baseband circuit applications in the telecom industry due to its small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,765 parts In-Stock

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3,765

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Digiode

USA . 2,339 parts In-Stock

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2,339

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 188 parts In-Stock

1+ parts

$5.434

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188

$5.434

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Parana Technologies

USA . 1,437 parts In-Stock

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$6.162

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$6.933

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1,437

$6.162

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$6.933

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IDEA Electronic Components Group

UK . 1,370 parts In-Stock

1+ parts

$6.924

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$6.232

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1,370

$6.924

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$6.232

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ChromeModa Solutions

Germany . 62 parts In-Stock

1+ parts

$6.924

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$5.678

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62

$6.924

$5.678

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One Stop Electronics

USA . 921 parts In-Stock

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$880.000

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921

$880.000

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DigiPath Technology Company

USA . 1,881 parts In-Stock

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$6.243

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1,881

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$6.243

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Corphita

USA . 280 parts In-Stock

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Overview

Enhance the performance of your cellphone with the TLV320AC56IDWR by Texas Instruments. Known for their top-notch quality and innovative technology, Texas Instruments delivers exceptional Cellphone ICs that are designed to optimize functionality and efficiency. Whether you're looking to improve audio quality, enhance signal processing, or boost overall performance, this product offers unmatched value and reliability. Upgrade your device with the TLV320AC56IDWR and experience the difference in sound clarity and processing speed. Elevate your mobile experience today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making this product suitable for mass production.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, reducing production time and cost.

Package Shape: RECTANGULAR

Rectangular shape provides a compact footprint, saving space on the PCB and making it suitable for smaller devices.

No. of Terminals: 20

Having 20 terminals allows for more connectivity options and functionality in the device.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without any issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhances the reliability of the connections.

Maximum Seated Height: 2.65 mm

Low seated height allows for a slim design and facilitates the integration of the IC into compact devices.

Width: 7.5 mm

Narrow width makes it suitable for applications where space is limited.

Length: 12.8 mm

Compact length enhances the flexibility in designing the layout on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Terminal Form: GULL WING

Gull-wing terminals facilitate automated assembly processes and provide secure soldering connections.

Telecom IC Type: BASEBAND CIRCUIT

Baseband circuit IC type is essential for handling communication protocols in mobile devices, making this product suitable for cellphone applications.

Nominal Supply Voltage: 3 V

3V supply voltage is a common and standard requirement in many electronic devices, ensuring compatibility and ease of integration.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting on the PCB, maximizing the functionality of the device.

Technical Specifications

Cellphone ICs TLV320AC56IDWR attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TLV320AC56IDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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