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TLV320AC56CN

Texas Instruments

TLV320AC56CN by Texas Instruments

TLV320AC56CN by Texas Instruments is a 20-terminal IC with 3V supply, operating from 0 to 70°C. It features a 13-bit linear codec and μ-law companding for baseband circuits in cellphones. The rectangular plastic package has a width of 7.62mm and length of 24.325mm, making it suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,660 parts In-Stock

1+ parts

-

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7,660

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Digiode

USA . 486 parts In-Stock

1+ parts

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486

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 740 parts In-Stock

1+ parts

$7.096

100+ parts

-

1k+ parts

$7.621

10k+ parts

-

740

$7.096

-

$7.621

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DigiPath Technology Company

USA . 445 parts In-Stock

1+ parts

$7.814

100+ parts

$7.188

1k+ parts

-

10k+ parts

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445

$7.814

$7.188

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ChromeModa Solutions

Germany . 5,721 parts In-Stock

1+ parts

$7.973

100+ parts

$6.538

1k+ parts

-

10k+ parts

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5,721

$7.973

$6.538

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IDEA Electronic Components Group

UK . 908 parts In-Stock

1+ parts

$7.973

100+ parts

-

1k+ parts

$7.176

10k+ parts

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908

$7.973

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$7.176

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AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$15.232

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235

$15.232

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One Stop Electronics

USA . 1,016 parts In-Stock

1+ parts

$45.000

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1,016

$45.000

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Corphita

USA . 3,556 parts In-Stock

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3,556

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Overview

Enhance your cellphone's audio quality with the TLV320AC56CN from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch Cellphone ICs that provide superior sound performance. This versatile component is perfect for a wide range of applications, ensuring clear and crisp audio for your device. With its compact design and advanced technology, the TLV320AC56CN offers unmatched value and benefits to customers looking to improve their mobile experience. Upgrade your phone's audio capabilities today with this high-quality product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product is able to withstand daily wear and tear.

Power Supplies (V): 3

Operating at 3 volts allows for efficient power usage, extending the battery life of the cellphone IC.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for various components, enhancing the functionality of the cellphone IC.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this cellphone IC can perform reliably even in high-temperature environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high performance, making the cellphone IC efficient and effective.

Filter: YES

The inclusion of a filter helps in eliminating unwanted noise and interference, resulting in clearer and more reliable communication signals.

Technical Specifications

Cellphone ICs TLV320AC56CN attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

.0075 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TLV320AC56CN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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