Loading...

TLV320AC57DW

Texas Instruments

TLV320AC57DW by Texas Instruments

TLV320AC57DW by Texas Instruments is a cellphone IC with 20 terminals, operating b/w -40 to 85°C. It has a small outline package style and gull wing terminal form, suitable for baseband circuits in telecom applications. The package dimensions are 7.5mm x 12.8mm with a seated height of 2.65mm, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,599

-

-

-

-

Digiode

USA . 4,518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,518

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 712 parts In-Stock

1+ parts

$13.371

100+ parts

-

1k+ parts

-

10k+ parts

-

712

$13.371

-

-

-

Parana Technologies

USA . 302 parts In-Stock

1+ parts

$14.853

100+ parts

-

1k+ parts

$15.283

10k+ parts

-

302

$14.853

-

$15.283

-

DigiPath Technology Company

USA . 1,221 parts In-Stock

1+ parts

$16.355

100+ parts

-

1k+ parts

-

10k+ parts

-

1,221

$16.355

-

-

-

ChromeModa Solutions

Germany . 1,028 parts In-Stock

1+ parts

$16.689

100+ parts

$13.685

1k+ parts

-

10k+ parts

-

1,028

$16.689

$13.685

-

-

IDEA Electronic Components Group

UK . 186 parts In-Stock

1+ parts

$16.689

100+ parts

$15.855

1k+ parts

$15.020

10k+ parts

-

186

$16.689

$15.855

$15.020

-

One Stop Electronics

USA . 709 parts In-Stock

1+ parts

$75.000

100+ parts

-

1k+ parts

-

10k+ parts

-

709

$75.000

-

-

-

Corphita

USA . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

252

-

-

-

-

Overview

Enhance the performance of your cellphone with the TLV320AC57DW by Texas Instruments. Trusted for its superior quality and reliability, Texas Instruments delivers cutting-edge Cellphone ICs that are perfect for a wide range of applications. From enhancing audio quality to improving signal processing, this product offers unmatched value and benefits to customers looking to elevate their mobile experience. Upgrade your device today with the TLV320AC57DW and enjoy the advantages of Texas Instruments technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the internal components of the cellphone IC, ensuring long-term reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation onto a circuit board, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient placement and organization of components on the circuit board, optimizing space utilization.

No. of Terminals: 20

With a higher number of terminals, this cellphone IC can support multiple connections and functions, making it versatile and adaptable for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures that the cellphone IC can withstand and operate effectively in elevated temperature environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this cellphone IC to function seamlessly in cold conditions, enhancing its reliability in diverse environments.

Telecom IC Type: BASEBAND CIRCUIT

Being a baseband circuit telecom IC type, this product is designed specifically for handling communication protocols, making it well-suited for cellular devices and other telecommunications applications.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3 volts, this cellphone IC is energy-efficient and compatible with a wide range of power sources, contributing to its versatility and usability.

Technical Specifications

Cellphone ICs TLV320AC57DW attributes and parameters. Explore more Cellphone ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TLV320AC57DW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20