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DS160PT801ACBR

Texas Instruments

DS160PT801ACBR by Texas Instruments

DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.

Median Price

$26.010

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 49,810 parts In-Stock

1+ parts

$26.010

100+ parts

$23.120

1k+ parts

$17.000

10k+ parts

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49,810

$26.010

$23.120

$17.000

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,019 parts In-Stock

1+ parts

$24.710

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4,019

$24.710

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Vyrian

USA . 7,363 parts In-Stock

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7,363

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Velocity Electronics

USA . 13 parts In-Stock

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 338 parts In-Stock

1+ parts

$18.010

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-

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338

$18.010

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AZTECH Wire

Italy . 101 parts In-Stock

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$18.690

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101

$18.690

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Northwest PG Solutions

USA . 855 parts In-Stock

1+ parts

$19.811

100+ parts

$17.830

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855

$19.811

$17.830

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Corphita

USA . 2,318 parts In-Stock

1+ parts

$23.409

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2,318

$23.409

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Parana Technologies

USA . 1,742 parts In-Stock

1+ parts

$27.982

100+ parts

-

1k+ parts

$42.409

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1,742

$27.982

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$42.409

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DigiPath Technology Company

USA . 2,241 parts In-Stock

1+ parts

$30.811

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2,241

$30.811

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ChromeModa Solutions

Germany . 4,299 parts In-Stock

1+ parts

$31.440

100+ parts

$25.781

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4,299

$31.440

$25.781

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IDEA Electronic Components Group

UK . 1,882 parts In-Stock

1+ parts

$31.440

100+ parts

$29.868

1k+ parts

$28.296

10k+ parts

-

1,882

$31.440

$29.868

$28.296

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Corohmni

South Africa . 2,442 parts In-Stock

1+ parts

$68.993

100+ parts

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2,442

$68.993

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Lixinc

USA . 8,992 parts In-Stock

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8,992

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Overview

Experience the ultimate in performance and reliability with the DS160PT801ACBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality bus controllers that are perfect for a wide range of applications. With a sleek, thin profile package body made of durable plastic/epoxy material, this innovative product ensures seamless data transfer at an impressive rate of up to 2000 MBps. Trust in Texas Instruments to provide you with the cutting-edge technology you need for your projects, while enjoying the unmatched value and benefits that come with choosing the DS160PT801ACBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the bus controller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Data Transfer Rate: 2000 MBps

High data transfer rate allows for efficient and fast communication between devices connected to the bus controller.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments, making it suitable for a variety of applications.

Maximum Seated Height: 1.1 mm

Thin profile and low height design allow for space-saving installation in compact devices.

Nominal Supply Voltage: 1.1 V

Low voltage requirement helps in energy efficiency and reduces power consumption.

Technical Specifications

Bus Controllers DS160PT801ACBR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Bus Compatibility:

PCI

Maximum Data Transfer Rate:

2000 MBps

JESD-30 Code:

R-PBGA-B332

JESD-609 Code:

e1

Length:

13.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

339

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA332,22X22,28

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.707 mm

Terminal Position:

BOTTOM

Width:

8.5 mm

Peripheral IC Type:

Trade Compliance

DS160PT801ACBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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