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Memory Management Units (MMU)

A Memory Management Unit (MMU) is a hardware component that manages the translation of virtual memory addresses to physical memory addresses. The MMU is an essential component of modern computer systems and is responsible for providing a layer of abstraction between the operating system and the physical memory of the system.

The MMU translates virtual memory addresses to physical memory addresses using a page table, which is a data structure that maps virtual memory addresses to physical memory addresses. The page table is stored in memory and is managed by the operating system. When a program requests data from memory, the MMU uses the page table to translate the virtual memory address to a physical memory address.

The MMU also provides memory protection by assigning different access permissions to different memory regions. This allows the operating system to isolate programs from each other and prevent unauthorized access to memory. For example, the MMU can assign read-only access to certain memory regions to prevent programs from modifying critical data.

Another important function of the MMU is memory sharing. The MMU allows multiple programs to share memory regions, which can improve system performance and reduce memory usage. By sharing memory, programs can communicate with each other more efficiently and reduce the need for redundant data storage.

Memory Management Units (MMU)

Available Parts 23

Part RoHS Manufacturer Description Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount Maximum Supply Voltage No. of Addressable Pages Address Bus Width Power Supplies (V) Package Style (Meter) Package Equivalence Code Minimum Supply Voltage Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position Maximum Seated Height Width External Data Bus Width Maximum Clock Frequency Technology Maximum Supply Current Nominal Supply Voltage Sub-Category Bus Compatibility Terminal Pitch Maximum Address Translation Time JESD-30 Code Qualification Low Power Mode JESD-609 Code
MC68451L8 by Motorola

MC68451L8

Motorola

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 64; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

64

DIP

RECTANGULAR

CERAMIC

NO

IN-LINE

DIP64,.9

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

MOS

Memory Management Units

2.54 mm

R-XDIP-T64

Not Qualified

e0

MC68451R10 by Motorola

MC68451R10

Motorola

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; Package Code: PGA; Package Equivalence Code: PGA(UNSPEC); Minimum Operating Temperature: 0 Cel;

MEMORY MANAGEMENT UNIT

COMMERCIAL

PIN/PEG

PGA

CERAMIC

NO

GRID ARRAY

PGA(UNSPEC)

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

MOS

Memory Management Units

Not Qualified

e0

TI32082WJDL-2 by Texas Instruments

TI32082WJDL-2

Texas Instruments

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

24

IN-LINE

DIP48,.6

4.75 V

70 Cel

0 Cel

DUAL

16

10 MHz

NMOS

5 V

Memory Management Units

TI32016T; TI32032T

2.54 mm

50 ns

R-CDIP-T48

Not Qualified

NO

Z8010B6 by STMicroelectronics

Z8010B6

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

8

IN-LINE

4.75 V

85 Cel

-40 Cel

DUAL

4.06 mm

15.24 mm

8

10 MHz

CMOS

5 V

Z8001

2.54 mm

R-PDIP-T48

Not Qualified

NO

Z8015D1 by STMicroelectronics

Z8015D1

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 64; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

64

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

64

16

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

16

4 MHz

CMOS

5 V

Z8000

R-CDIP-T64

Not Qualified

NO

Z8010D2 by STMicroelectronics

Z8010D2

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

MILITARY

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

125 Cel

-55 Cel

DUAL

3.73 mm

15.24 mm

8

4 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010D1 by STMicroelectronics

Z8010D1

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

3.73 mm

15.24 mm

8

4 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010BB6 by STMicroelectronics

Z8010BB6

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

8

IN-LINE

4.75 V

85 Cel

-40 Cel

DUAL

4.06 mm

15.24 mm

8

10 MHz

CMOS

5 V

Z8001

2.54 mm

R-PDIP-T48

Not Qualified

NO

Z8010AD6 by STMicroelectronics

Z8010AD6

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

85 Cel

-40 Cel

DUAL

3.73 mm

15.24 mm

8

6 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010BD2 by STMicroelectronics

Z8010BD2

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

MILITARY

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

125 Cel

-55 Cel

DUAL

3.73 mm

15.24 mm

8

10 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010AB6 by STMicroelectronics

Z8010AB6

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

8

IN-LINE

4.75 V

85 Cel

-40 Cel

DUAL

4.06 mm

15.24 mm

8

6 MHz

CMOS

5 V

Z8001

2.54 mm

R-PDIP-T48

Not Qualified

NO

Z8010B1 by STMicroelectronics

Z8010B1

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

8

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

4.06 mm

15.24 mm

8

10 MHz

CMOS

5 V

Z8001

2.54 mm

R-PDIP-T48

Not Qualified

NO

Z8010AB1 by STMicroelectronics

Z8010AB1

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

8

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

4.06 mm

15.24 mm

8

6 MHz

CMOS

5 V

Z8001

2.54 mm

R-PDIP-T48

Not Qualified

NO

Z8010AD2 by STMicroelectronics

Z8010AD2

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

MILITARY

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

125 Cel

-55 Cel

DUAL

3.73 mm

15.24 mm

8

6 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010BB1 by STMicroelectronics

Z8010BB1

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

5.25 V

8

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

4.06 mm

15.24 mm

8

10 MHz

CMOS

5 V

Z8001

2.54 mm

R-PDIP-T48

Not Qualified

NO

Z8010BD1 by STMicroelectronics

Z8010BD1

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

3.73 mm

15.24 mm

8

10 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010D6 by STMicroelectronics

Z8010D6

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

85 Cel

-40 Cel

DUAL

3.73 mm

15.24 mm

8

4 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010BD6 by STMicroelectronics

Z8010BD6

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

INDUSTRIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

85 Cel

-40 Cel

DUAL

3.73 mm

15.24 mm

8

10 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

Z8010AD1 by STMicroelectronics

Z8010AD1

STMicroelectronics

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 48; Package Code: DIP; Package Shape: RECTANGULAR;

MEMORY MANAGEMENT UNIT

COMMERCIAL

THROUGH-HOLE

48

DIP

RECTANGULAR

CERAMIC, METAL-SEALED COFIRED

NO

5.25 V

8

IN-LINE

4.75 V

70 Cel

0 Cel

DUAL

3.73 mm

15.24 mm

8

6 MHz

CMOS

5 V

Z8001

2.54 mm

R-CDIP-T48

Not Qualified

NO

L64815NC-33 by Broadcom

L64815NC-33

Broadcom

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 224; Package Code: PGA; Package Shape: SQUARE;

MEMORY MANAGEMENT UNIT

COMMERCIAL

PIN/PEG

224

PGA

SQUARE

PLASTIC/EPOXY

NO

5

GRID ARRAY

PGA224,18X18

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

530 mA

5 V

Memory Management Units

2.54 mm

S-PPGA-P224

Not Qualified

e0

L64860 by Broadcom

L64860

Broadcom

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 299; Package Code: PGA; Package Shape: SQUARE;

MEMORY MANAGEMENT UNIT

COMMERCIAL

PIN/PEG

299

PGA

SQUARE

CERAMIC

NO

5

GRID ARRAY

PGA299,20X20

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

300 mA

5 V

Memory Management Units

2.54 mm

S-XPGA-P299

Not Qualified

e0

L64815QC-25 by Broadcom

L64815QC-25

Broadcom

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;

MEMORY MANAGEMENT UNIT

COMMERCIAL

GULL WING

208

QFP

SQUARE

PLASTIC/EPOXY

YES

5

FLATPACK

QFP208,1.2SQ,20

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

QUAD

CMOS

340 mA

5 V

Memory Management Units

.5 mm

S-PQFP-G208

Not Qualified

e0

L64815NC-25 by Broadcom

L64815NC-25

Broadcom

MEMORY MANAGEMENT UNIT; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 224; Package Code: PGA; Package Shape: SQUARE;

MEMORY MANAGEMENT UNIT

COMMERCIAL

PIN/PEG

224

PGA

SQUARE

PLASTIC/EPOXY

NO

5

GRID ARRAY

PGA224,18X18

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

PERPENDICULAR

CMOS

340 mA

5 V

Memory Management Units

2.54 mm

S-PPGA-P224

Not Qualified

e0