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Telecom - Switching ICs

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.

Telecom - Switching ICs

Available Parts 407

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length
KSZ8863RLLI by Microchip Technology

KSZ8863RLLI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8995MAI by Microchip Technology

KSZ8995MAI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

230 mA

1.8 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

1

3.4 mm

14 mm

e3

260

20 mm

KSZ8863RLLI-TR by Microchip Technology

KSZ8863RLLI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8895MQXI by Microchip Technology

KSZ8895MQXI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

3.4 mm

14 mm

e3

260

20 mm

KSZ8795CLXIC by Microchip Technology

KSZ8795CLXIC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.47SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G80

3

1.6 mm

10 mm

e3

30

260

10 mm

KSZ8863RLL by Microchip Technology

KSZ8863RLL

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8873RLLI by Microchip Technology

KSZ8873RLLI

Microchip Technology

LAN SWITCHING CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

3

1.6 mm

10 mm

Not Qualified

e3

30

260

10 mm

LAN9303I-ABZJ by Microchip Technology

LAN9303I-ABZJ

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

Not Qualified

e3

260

8 mm

KSZ8863MLLI by Microchip Technology

KSZ8863MLLI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

260

7 mm

KSZ8873RLLI-TR by Microchip Technology

KSZ8873RLLI-TR

Microchip Technology

LAN SWITCHING CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

LAN SWITCHING CIRCUIT

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100; TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

12 mm

e3

30

260

12 mm

KSZ8863MLL by Microchip Technology

KSZ8863MLL

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

3

1.6 mm

7 mm

e3

7 mm

KSZ8863MLLI-TR by Microchip Technology

KSZ8863MLLI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ9477STXI-TR by Microchip Technology

KSZ9477STXI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ8864CNXIA by Microchip Technology

KSZ8864CNXIA

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

e3

260

8 mm

KSZ8995XA by Microchip Technology

KSZ8995XA

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

70 Cel

0 Cel

TIN

QUAD

R-PQFP-G128

3

3.4 mm

14 mm

Not Qualified

e3

20 mm

LAN9303I-ABZJ-TR by Microchip Technology

LAN9303I-ABZJ-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N56

3

1 mm

8 mm

e3

260

8 mm

KSZ9477STXI by Microchip Technology

KSZ9477STXI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ8873MLLI by Microchip Technology

KSZ8873MLLI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

Not Qualified

Internal 1.8V LDO

e3

30

260

10 mm

KSZ9896CTXI-TR by Microchip Technology

KSZ9896CTXI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ8895RQXI by Microchip Technology

KSZ8895RQXI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

e3

20 mm

KSZ8463MLI by Microchip Technology

KSZ8463MLI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

64

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP64,.47SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G64

1.6 mm

10 mm

e3

10 mm

KSZ9893RNXC by Microchip Technology

KSZ9893RNXC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-N64

.9 mm

8 mm

e3

8 mm

KSZ8794CNXIC by Microchip Technology

KSZ8794CNXIC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 60; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

60

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC60,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N60

3

.9 mm

8 mm

e3

260

8 mm

KSZ8895RQXI-TR by Microchip Technology

KSZ8895RQXI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

e3

20 mm

KSZ9896CTXI by Microchip Technology

KSZ9896CTXI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ8795CLXCC by Microchip Technology

KSZ8795CLXCC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.2 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP80,.47SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G80

3

1.6 mm

10 mm

e3

30

260

10 mm

KSZ8895MQXI-TR by Microchip Technology

KSZ8895MQXI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

3.4 mm

14 mm

e3

260

20 mm

KSZ9567STXI by Microchip Technology

KSZ9567STXI

Microchip Technology

ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET TRANSCEIVER

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ9893RNXI-TR by Microchip Technology

KSZ9893RNXI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-PQCC-N64

.9 mm

8 mm

8 mm

KSZ8995MA by Microchip Technology

KSZ8995MA

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

230 mA

1.8 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

e3

30

260

20 mm

KSZ8895MQXC by Microchip Technology

KSZ8895MQXC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

e3

20 mm

KSZ8863RLL-TR by Microchip Technology

KSZ8863RLL-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ9893RNXI by Microchip Technology

KSZ9893RNXI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQCC-N64

.9 mm

8 mm

e3

8 mm

KSZ8995MI by Microchip Technology

KSZ8995MI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

375 mA

1.8 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3

3.4 mm

14 mm

Not Qualified

e3

20 mm

KSZ8794CNXIC-TR by Microchip Technology

KSZ8794CNXIC-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N64

.9 mm

8 mm

8 mm

LAN9303-ABZJ by Microchip Technology

LAN9303-ABZJ

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

NO LEAD

56

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC56,.31SQ,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N56

1 mm

8 mm

Not Qualified

e3

8 mm

KSZ8864CNXIA-TR by Microchip Technology

KSZ8864CNXIA-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N64

.9 mm

8 mm

e3

260

8 mm

KSZ8895RQXC by Microchip Technology

KSZ8895RQXC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

70 Cel

0 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

e3

30

260

20 mm

KSZ8794CNXCC-TR by Microchip Technology

KSZ8794CNXCC-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

TS 16949

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

QUAD

S-XQCC-N64

.9 mm

8 mm

8 mm

KSZ9896CTXC by Microchip Technology

KSZ9896CTXC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ8794CNXCC by Microchip Technology

KSZ8794CNXCC

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 60; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

NO LEAD

60

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC60,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-XQCC-N60

.9 mm

8 mm

e3

8 mm

KSZ8863FLLI by Microchip Technology

KSZ8863FLLI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3.3 V

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G48

1.6 mm

7 mm

e3

7 mm

KSZ9567RTXI-TR by Microchip Technology

KSZ9567RTXI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ8567RTXI-TR by Microchip Technology

KSZ8567RTXI-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ9893RNXC-TR by Microchip Technology

KSZ9893RNXC-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: HVQCCN; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

NO LEAD

64

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC64,.32SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQCC-N64

.9 mm

8 mm

e3

8 mm

KSZ9896CTXC-TR by Microchip Technology

KSZ9896CTXC-TR

Microchip Technology

ETHERNET SWITCH; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

COMMERCIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

70 Cel

0 Cel

MATTE TIN

QUAD

S-PQFP-G128

1.2 mm

14 mm

e3

14 mm

KSZ8567RTXI by Microchip Technology

KSZ8567RTXI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

TS 16949

1.2 V

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

TQFP128,.63SQ,16

.4 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-PQFP-G128

3

1.2 mm

14 mm

e3

260

14 mm

KSZ8995FQI by Microchip Technology

KSZ8995FQI

Microchip Technology

ETHERNET SWITCH; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: FQFP; Package Shape: RECTANGULAR;

ETHERNET SWITCH

INDUSTRIAL

GULL WING

128

FQFP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

230 mA

1.8 V

FLATPACK, FINE PITCH

QFP128,.68X.91,20

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

R-PQFP-G128

3.4 mm

14 mm

e3

20 mm