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VSC7427XJG-02

Microchip Technology

VSC7427XJG-02 by Microchip Technology

VSC7427XJG-02 by Microchip: Ethernet switch IC with 672 terminals, operating temp. range of 0-125°C. Package style: grid array, suitable for telecom applications. Nominal voltage: 1V, max supply current: 2700mA, terminal pitch: 1mm.

Median Price

$88.920

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 36 parts In-Stock

1+ parts

$57.940

100+ parts

$48.260

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$57.940

$48.260

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Newark

USA . 36 parts In-Stock

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$76.300

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36

$76.300

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Microchip Technology

USA . 39 parts In-Stock

1+ parts

$88.920

100+ parts

$67.370

1k+ parts

$62.240

10k+ parts

$59.050

39

$88.920

$67.370

$62.240

$59.050

DigiKey

USA . 37 parts In-Stock

1+ parts

$88.920

100+ parts

$71.588

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37

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Element14

Singapore . 36 parts In-Stock

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$118.420

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$118.420

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Maritex

Poland . 520 parts In-Stock

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$111.057

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520

$111.057

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Vyrian

USA . 5,596 parts In-Stock

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Chip Stock

USA . 645 parts In-Stock

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Nova Conductors

Japan . 39 parts In-Stock

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Bristol Electronics

USA . 20 parts In-Stock

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Vigor

Singapore . 6,700 parts In-Stock

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$52.380

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$52.380

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Ampacity Inc.

Singapore . 38 parts In-Stock

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$59.980

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Continental Prestige Electronics

USA . 40 parts In-Stock

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$77.230

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Lixinc

USA . 11,062 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,393 parts In-Stock

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Fulton Briggs Corp.

USA . 3,271 parts In-Stock

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RC Electronics

USA . 247 parts In-Stock

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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Netroflash

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Kepictronics

USA . 35 parts In-Stock

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Overview

Elevate your telecom networking capabilities with the VSC7427XJG-02 by Microchip Technology. Known for their top-notch quality and reliability, Microchip delivers cutting-edge solutions for Telecom - Switching ICs. This versatile Ethernet switch is designed to optimize performance and efficiency, offering seamless connectivity and enhanced data transfer speeds. With a compact package and easy surface mount installation, this product is perfect for a wide range of applications. Experience the value and benefits that only Microchip Technology can provide, and take your networking to the next level with the VSC7427XJG-02.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and durability, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient and space-saving PCB assembly, making the product suitable for compact designs.

No. of Terminals: 672

Having a high number of terminals allows for multiple connections and configurations, making the product versatile and compatible with various setups.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, ensuring reliability in harsh environments.

Telecom IC Type: ETHERNET SWITCH

Being an Ethernet switch IC, this product enables high-speed data transmission and efficient network connectivity, making it ideal for telecom applications.

Nominal Supply Voltage: 1 V

Operating at a low nominal supply voltage, this product offers energy efficiency and helps reduce power consumption in telecom systems.

Terminal Pitch: 1 mm

A small terminal pitch allows for compact design and high-density mounting, making the product suitable for space-constrained applications.

Technical Specifications

Telecom - Switching ICs VSC7427XJG-02 attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B672

Length:

27 mm

No. of Functions:

1

No. of Terminals:

672

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA672,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

2.44 mm

Maximum Supply Current:

2700 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

VSC7427XJG-02 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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