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SJA1105REL

NXP Semiconductors

SJA1105REL by NXP Semiconductors

NXP SJA1105REL is an Ethernet switch IC with 159 terminals, operating at -40 to 105°C. It features AEC-Q100 and ISO 26262 screening for automotive applications. The package is a low-profile grid array measuring 12x12mm, suitable for telecom switching systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 3,284 parts In-Stock

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Anansix

USA . 2,861 parts In-Stock

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Vyrian

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Flip Electronics

USA . 583 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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AZTECH Wire

Italy . 241 parts In-Stock

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$8.922

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One Stop Electronics

USA . 178 parts In-Stock

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Ampacity Inc.

Singapore . 1,567 parts In-Stock

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Lixinc

USA . 15,691 parts In-Stock

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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UNI Independent Distributors

Spain . 8,324 parts In-Stock

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Infinite Electronics LLP (Excess)

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Continental Prestige Electronics

USA . 6,343 parts In-Stock

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Corphita

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Argo Parts USA

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the SJA1105REL by NXP Semiconductors. Designed for the Telecom industry, this Ethernet switch IC boasts unparalleled quality and reliability. With advanced features and cutting-edge technology, this product offers unmatched value and benefits to customers. Experience fast and efficient data transfer while ensuring optimal performance in a wide range of applications. Trust NXP Semiconductors for superior solutions that elevate your connectivity experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications in telecommunications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and cost in manufacturing.

Screening Level: AEC-Q100; ISO 26262

Compliance with AEC-Q100 and ISO 26262 standards ensures high quality and reliability, making it suitable for automotive and industrial applications.

No. of Terminals: 159

The high number of terminals allows for more connectivity options, enhancing the versatility of the product.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand rigorous operating conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature makes this product suitable for use in extreme cold environments.

Width: 12 mm

Compact width of 12mm allows for space-saving PCB design, ideal for applications where size constraints are a concern.

Telecom IC Type: ETHERNET SWITCH

As an Ethernet switch, this product allows for efficient data transmission and network management, making it a reliable choice for telecom applications.

Technical Specifications

Telecom - Switching ICs SJA1105REL attributes and parameters. Explore more Telecom - Switching ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B159

Length:

12 mm

No. of Functions:

1

No. of Terminals:

159

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA159,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Screening Level:

AEC-Q100; ISO 26262

Maximum Seated Height:

1.5 mm

Maximum Supply Current:

200 mA

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Trade Compliance

SJA1105REL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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