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M34116C1

STMicroelectronics

M34116C1 by STMicroelectronics

STMicroelectronics' M34116C1 is a 28-terminal telecom IC with 5V power supply, operating b/w 0-70°C. It features CMOS technology, J-bend terminals, and is ideal for conferencing circuits in commercial-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Anansix

USA . 2,747 parts In-Stock

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Digiode

USA . 2,639 parts In-Stock

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Vyrian

USA . 1,397 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 120 parts In-Stock

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Holdelec - ElecDif-Pro

France . 34 parts In-Stock

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 12 parts In-Stock

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AZTECH Wire

Italy . 723 parts In-Stock

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$5.191

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723

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Corohmni

South Africa . 83 parts In-Stock

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$8.687

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IDEA Electronic Components Group

UK . 2,243 parts In-Stock

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$11.206

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$10.085

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Aztec Data Supply Inc.

USA . 214 parts In-Stock

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$16.390

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MKK Technologies

India . 780 parts In-Stock

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$21.071

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DigiPath Technology Company

USA . 780 parts In-Stock

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$21.071

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Ampacity Inc.

Singapore . 1,162 parts In-Stock

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$819.000

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Lixinc

USA . 9,862 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,900 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,600 parts In-Stock

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Argo Parts USA

USA . 4,361 parts In-Stock

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Corphita

USA . 2,789 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Parana Technologies

USA . 679 parts In-Stock

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$13.398

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Continental Prestige Electronics

USA . 447 parts In-Stock

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Assy Fe

Spain . 5 parts In-Stock

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Overview

Experience seamless communication with the M34116C1 by STMicroelectronics, a top-quality Telecom - Switching IC designed to enhance conferencing circuits. Manufactured by industry leader STMicroelectronics, this chip carrier package offers exceptional performance and reliability. With its compact design and advanced CMOS technology, this IC ensures optimal functionality at both high and low temperatures. Trust in STMicroelectronics for cutting-edge solutions that deliver value and efficiency to your telecom applications. Unlock the potential of your projects with the M34116C1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, minimizing the risk of damage during handling and transportation.

Surface Mount: YES

Being surface mountable makes the product suitable for automated assembly processes, saving time and cost in production.

Power Supplies (V): 5

Operating at 5V provides a common voltage level compatible with many other electronic components, making it easier to integrate into various systems.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options, enabling the product to interface with multiple external devices or components.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in signal processing.

Technical Specifications

Telecom - Switching ICs M34116C1 attributes and parameters. Explore more Telecom - Switching ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

50 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

M34116C1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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