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KSZ8864RMNUB-TR

Microchip Technology

KSZ8864RMNUB-TR by Microchip Technology

Microchip Technology's KSZ8864RMNUB-TR is an Ethernet switch IC with 64 terminals, AEC-Q100 screening level, and operating temperature range of -40 to 85°C. It comes in a square chip carrier package style suitable for telecom applications.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,232 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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Sensible Micro Corp

USA . 770 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Ampacity Inc.

Singapore . 967 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 223 parts In-Stock

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$14.076

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Corohmni

South Africa . 498 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$14.911

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Aztec Data Supply Inc.

USA . 1,510 parts In-Stock

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$15.970

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Semicontronic

India . 758 parts In-Stock

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$807.000

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$786.825

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$782.790

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Kepictronics

USA . 26,087 parts In-Stock

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Microchip USA

USA . 12,497 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Argo Parts USA

USA . 4,270 parts In-Stock

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West Coast Incorporated

USA . 3,145 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 2,084 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Continental Prestige Electronics

USA . 216 parts In-Stock

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Overview

Upgrade your telecom network with the Microchip Technology KSZ8864RMNUB-TR Ethernet Switch. Manufactured by a trusted name in the industry, this switching IC offers advanced features and reliability. Ideal for applications in telecommunications, this surface-mount device provides seamless connectivity and efficient performance. With AEC-Q100 and TS 16949 screening levels, this product ensures quality and durability. Experience the value and benefits of this high-quality switch for your networking needs.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient assembly onto a PCB, saving time and effort during production.

Screening Level: AEC-Q100; TS 16949

Meets automotive and industrial quality standards, ensuring reliable performance in harsh environments.

Package Shape: SQUARE

Provides a compact form factor, saving space on the PCB and allowing for efficient layout designs.

No. of Terminals: 64

Offers ample connectivity options for various networking applications.

Maximum Operating Temperature: 85 °C

Supports operation in high-temperature environments without compromising performance.

Nominal Supply Voltage: 1.2 V

Operates efficiently at a low voltage, reducing power consumption and heat dissipation.

Technical Specifications

Telecom - Switching ICs KSZ8864RMNUB-TR attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

Additional Features:

SEATED HT-CALCULATED

JESD-30 Code:

S-XQCC-N64

JESD-609 Code:

e3

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC64,.32SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

8 mm

Trade Compliance

KSZ8864RMNUB-TR Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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