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KSZ8895MLUB

Microchip Technology

KSZ8895MLUB by Microchip Technology

KSZ8895MLUB by Microchip Technology is an Ethernet switch IC with 128 terminals, operating temperature range of -40 to 85°C. It features AEC-Q100 screening level and TS 16949 certification. Ideal for telecom applications, this low-profile flatpack IC has a terminal pitch of 0.4mm.

Median Price

$12.640

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 13,233 parts In-Stock

1+ parts

$12.640

100+ parts

$9.580

1k+ parts

$8.860

10k+ parts

$8.390

13,233

$12.640

$9.580

$8.860

$8.390

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$8.200

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-

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450

$8.200

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Chip Stock

USA . 23,500 parts In-Stock

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23,500

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Vyrian

USA . 11,182 parts In-Stock

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11,182

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 282 parts In-Stock

1+ parts

$7.901

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-

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282

$7.901

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Continental Prestige Electronics

USA . 6,804 parts In-Stock

1+ parts

$8.200

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-

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10k+ parts

$8.036

6,804

$8.200

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$8.036

Corohmni

South Africa . 77 parts In-Stock

1+ parts

$8.597

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77

$8.597

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Semicontronic

India . 11,420 parts In-Stock

1+ parts

$10.740

100+ parts

$10.472

1k+ parts

$10.418

10k+ parts

-

11,420

$10.740

$10.472

$10.418

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Ampacity Inc.

Singapore . 11,369 parts In-Stock

1+ parts

$10.740

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11,369

$10.740

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Advanced Electronics

New Zealand . 63 parts In-Stock

1+ parts

$16.705

100+ parts

$15.869

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$15.869

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63

$16.705

$15.869

$15.869

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QUARKTWIN TECHNOLOGY LTD

USA . 19,273 parts In-Stock

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Lixinc

USA . 13,999 parts In-Stock

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NIA Electronics

USA . 7,518 parts In-Stock

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7,518

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Ledger Components

France . 7,518 parts In-Stock

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7,518

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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LOOK Integrated Logistics

Peru . 5,854 parts In-Stock

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5,854

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Montano Global Distributors

Canada . 5,794 parts In-Stock

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Microchip USA

USA . 2,617 parts In-Stock

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2,617

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Argo Parts USA

USA . 1,426 parts In-Stock

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1,426

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Robosynatics

Brazil . 950 parts In-Stock

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950

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Lucentia Tech

USA . 950 parts In-Stock

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950

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LMD Electronica

Estonia . 604 parts In-Stock

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604

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Futuretech Components

Singapore . 574 parts In-Stock

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574

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Overview

Unlock the power of reliable networking with the Microchip Technology KSZ8895MLUB Ethernet Switch. Manufactured by a trusted industry leader, this Telecom - Switching IC provides seamless connectivity for a wide range of applications. Offering exceptional value and benefits, this product ensures high-quality performance with its advanced features. Elevate your network infrastructure with the KSZ8895MLUB and experience superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easier to handle and cheaper to manufacture.

Surface Mount: YES

Surface mount technology allows for a higher component density on the PCB, saving space and improving overall design flexibility.

Screening Level: AEC-Q100; TS 16949

Compliance with automotive and industrial standards ensures reliability and quality, making this product suitable for harsh environments.

Package Shape: SQUARE

The square shape allows for efficient use of PCB real estate, optimizing component layout and improving overall system design.

Nom. of Terminals: 128

Having a high number of terminals allows for a greater degree of connectivity and versatility in networking applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes this product suitable for use in industrial and automotive applications where temperatures can vary greatly.

Nominal Supply Voltage: 1.2 V

The low supply voltage requirement allows for energy-efficient operation and can help reduce power consumption in the overall system.

Technical Specifications

Telecom - Switching ICs KSZ8895MLUB attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e3

Length:

14 mm

No. of Functions:

1

No. of Terminals:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

KSZ8895MLUB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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