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VSC7440XMT

Microchip Technology

VSC7440XMT by Microchip Technology

Microchip Technology's VSC7440XMT is an Ethernet switch IC with 324 terminals, operating from -40 to 125°C. It has a supply voltage of 1V and max current of 3300mA. Ideal for automotive applications due to its compact square grid array package design.

Median Price

$67.310

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 173 parts In-Stock

1+ parts

$67.310

100+ parts

$54.188

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173

$67.310

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Mouser Electronics

USA . 19 parts In-Stock

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$67.310

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$55.570

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19

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Verical

USA . 8 parts In-Stock

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8

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$56.821

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10

$56.821

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Vyrian

USA . 8,170 parts In-Stock

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8,170

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Chip Stock

USA . 3,395 parts In-Stock

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3,395

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,430 parts In-Stock

1+ parts

$7.957

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1,430

$7.957

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Corohmni

South Africa . 363 parts In-Stock

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$12.279

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363

$12.279

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AZTECH Wire

Italy . 627 parts In-Stock

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$16.887

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627

$16.887

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Andel Nordic

Denmark . 999 parts In-Stock

1+ parts

$46.640

100+ parts

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$32.649

10k+ parts

$32.649

999

$46.640

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$32.649

$32.649

Continental Prestige Electronics

USA . 1,282 parts In-Stock

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$56.821

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$55.685

1,282

$56.821

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$55.685

Netroflash

USA . 500 parts In-Stock

1+ parts

$56.821

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$53.980

10k+ parts

$52.844

500

$56.821

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$53.980

$52.844

Ampacity Inc.

Singapore . 47 parts In-Stock

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$57.210

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47

$57.210

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Semicontronic

India . 47 parts In-Stock

1+ parts

$57.210

100+ parts

$55.780

1k+ parts

$55.494

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47

$57.210

$55.780

$55.494

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QUARKTWIN TECHNOLOGY LTD

USA . 22,817 parts In-Stock

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Lixinc

USA . 19,629 parts In-Stock

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19,629

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Argo Parts USA

USA . 1,266 parts In-Stock

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Perfect Parts

USA . 282 parts In-Stock

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282

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Fulton Briggs Corp.

USA . 230 parts In-Stock

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230

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Overview

Experience unparalleled connectivity and efficiency with the VSC7440XMT by Microchip Technology. Known for their top-notch quality and reliability, this Ethernet switch IC is a game-changer in the telecom industry. Whether you're looking to enhance your network performance or streamline your communication systems, this product offers unmatched value and benefits. Say goodbye to connectivity issues and hello to seamless operations with the VSC7440XMT. Trust in Microchip Technology to deliver cutting-edge solutions for all your switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the internal components of the switching IC, ensuring reliable performance over time.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation of the switching IC on circuit boards, saving time and effort during assembly.

No. of Terminals: 324

Having a high number of terminals enables the switching IC to support a wide range of connections and configurations, increasing its versatility for different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this switching IC can withstand demanding environmental conditions and maintain stable performance under heat stress.

Width: 19 mm

A compact width of 19mm allows for efficient use of space on circuit boards, making this switching IC suitable for applications where size constraints are a concern.

Telecom IC Type: ETHERNET SWITCH

Being an Ethernet switch enables this IC to efficiently manage network traffic, ensuring fast and reliable communication within telecom systems.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1V makes this switching IC energy-efficient, helping to reduce power consumption in telecom applications.

Technical Specifications

Telecom - Switching ICs VSC7440XMT attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B324

Length:

19 mm

No. of Functions:

1

No. of Terminals:

324

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA324,18X18,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.8 mm

Maximum Supply Current:

3300 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Trade Compliance

VSC7440XMT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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