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VSC7425XJG-02

Microchip Technology

VSC7425XJG-02 by Microchip Technology

Microchip Technology's VSC7425XJG-02 is an Ethernet switch IC with 672 terminals in a square grid array package. It operates b/w 0-125°C, with a supply voltage of 1V and max current of 2700mA. Ideal for telecom applications requiring high-speed switching in compact designs.

Median Price

$71.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 48 parts In-Stock

1+ parts

$71.140

100+ parts

-

1k+ parts

$59.260

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48

$71.140

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$59.260

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DigiKey

USA . 39 parts In-Stock

1+ parts

$71.140

100+ parts

$57.263

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39

$71.140

$57.263

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Verical

USA . 40 parts In-Stock

1+ parts

$88.985

100+ parts

$73.112

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-

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40

$88.985

$73.112

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$63.606

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900

$63.606

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Electro Sonic

Canada . 40 parts In-Stock

1+ parts

$70.500

100+ parts

$57.930

1k+ parts

$56.200

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40

$70.500

$57.930

$56.200

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Vyrian

USA . 1,122 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 832 parts In-Stock

1+ parts

$14.702

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832

$14.702

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Vigor

Singapore . 4,000 parts In-Stock

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$50.050

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4,000

$50.050

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Ampacity Inc.

Singapore . 1,462 parts In-Stock

1+ parts

$60.470

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1,462

$60.470

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Continental Prestige Electronics

USA . 3,852 parts In-Stock

1+ parts

$63.606

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10k+ parts

$62.334

3,852

$63.606

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$62.334

Microchip USA

USA . 1,515 parts In-Stock

1+ parts

$163.622

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1,515

$163.622

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Lixinc

USA . 15,505 parts In-Stock

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15,505

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Marpe Global Electronics

Taiwan . 6,036 parts In-Stock

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6,036

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QualityLine Systems

Poland . 6,036 parts In-Stock

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6,036

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XL Components Corporation

Australia . 6,036 parts In-Stock

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6,036

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Argo Parts USA

USA . 4,817 parts In-Stock

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4,817

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A-Z Elektronik GmbH

Germany . 2,613 parts In-Stock

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2,613

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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Kepictronics

USA . 90 parts In-Stock

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90

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Overview

Discover the innovative VSC7425XJG-02 by Microchip Technology, a cutting-edge Ethernet switch designed for telecom applications. With a high-quality plastic/epoxy package and 672 terminals in a convenient grid array style, this product offers exceptional performance and reliability. Whether you're looking to upgrade your network infrastructure or enhance communication systems, this telecom IC provides superior functionality and efficiency. Experience seamless connectivity and optimized operations with the VSC7425XJG-02, delivering value and benefits that exceed expectations. Elevate your telecommunications experience with Microchip Technology's advanced solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making this product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the product on circuit boards, saving time and effort during assembly.

No. of Terminals: 672

With 672 terminals, this product offers a high level of connectivity and compatibility with various components, enabling seamless integration into complex systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the reliable performance of the product even under challenging environmental conditions.

Telecom IC Type: ETHERNET SWITCH

As an Ethernet switch, this product allows for efficient data transmission and networking capabilities, making it a versatile choice for telecommunications applications.

Technical Specifications

Telecom - Switching ICs VSC7425XJG-02 attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B672

Length:

27 mm

No. of Functions:

1

No. of Terminals:

672

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA672,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

2.44 mm

Maximum Supply Current:

2700 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

VSC7425XJG-02 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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