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VSC7423XJG-02

Microchip Technology

VSC7423XJG-02 by Microchip Technology

VSC7423XJG-02 by Microchip Tech is an Ethernet switch IC with 672 terminals in a square grid array package. Operating temp range from -40 to 125°C, suitable for automotive applications. Features include 1V nominal voltage, 2000mA max supply current, and surface mount compatibility.

Median Price

$48.294

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1 parts In-Stock

1+ parts

$13.400

100+ parts

$13.400

1k+ parts

$13.400

10k+ parts

-

1

$13.400

$13.400

$13.400

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Verical

USA . 6 parts In-Stock

1+ parts

$47.630

100+ parts

-

1k+ parts

-

10k+ parts

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6

$47.630

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-

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Farnell

UK . 39 parts In-Stock

1+ parts

$47.959

100+ parts

-

1k+ parts

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39

$47.959

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Arrow

USA . 6 parts In-Stock

1+ parts

$48.630

100+ parts

$47.630

1k+ parts

-

10k+ parts

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6

$48.630

$47.630

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Element14

Singapore . 39 parts In-Stock

1+ parts

$58.466

100+ parts

$50.733

1k+ parts

-

10k+ parts

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39

$58.466

$50.733

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Mouser Electronics

USA . 40 parts In-Stock

1+ parts

$59.730

100+ parts

$49.990

1k+ parts

$47.970

10k+ parts

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40

$59.730

$49.990

$47.970

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$50.543

100+ parts

-

1k+ parts

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50

$50.543

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Vyrian

USA . 4,854 parts In-Stock

1+ parts

-

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4,854

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Bristol Electronics

USA . 40 parts In-Stock

1+ parts

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40

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Bas Electronics GmbH & Co. KG

Germany . 4 parts In-Stock

1+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 54 parts In-Stock

1+ parts

$11.390

100+ parts

-

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54

$11.390

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AZTECH Wire

Italy . 760 parts In-Stock

1+ parts

$16.586

100+ parts

-

1k+ parts

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760

$16.586

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Continental Prestige Electronics

USA . 39 parts In-Stock

1+ parts

$49.310

100+ parts

$40.440

1k+ parts

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10k+ parts

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39

$49.310

$40.440

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A-Z Elektronik GmbH

Germany . 4,632 parts In-Stock

1+ parts

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4,632

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RGB Technical Solutions

Ukraine . 3,826 parts In-Stock

1+ parts

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3,826

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$49.532

1k+ parts

$48.016

10k+ parts

$47.005

2,000

-

$49.532

$48.016

$47.005

Lixinc

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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800

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Legend Electronics Inc. (Excess)

USA . 726 parts In-Stock

1+ parts

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726

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Overview

Unleash the power of seamless connectivity with the VSC7423XJG-02 by Microchip Technology. This cutting-edge Telecom - Switching IC boasts unparalleled quality and reliability, showcasing the superior engineering that Microchip is renowned for. Designed for automotive applications, this Ethernet switch offers customers unmatched value and benefits, ensuring smooth operation even in extreme temperatures. Embrace the future of telecommunications with the VSC7423XJG-02 and experience a new level of connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection for the internal components of the switching IC, ensuring reliable performance over time.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape helps in efficient layout design on the PCB, optimizing space utilization in telecom applications.

No. of Terminals: 672

With a high number of terminals, this switching IC can support complex switching and networking functions, making it suitable for advanced telecom systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures the reliability of the IC under demanding conditions in telecom environments.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for the IC to function in various environmental conditions, making it versatile for different deployments.

Terminal Position: BOTTOM

Bottom terminal position aids in seamless PCB mounting and heat dissipation, contributing to the overall performance and longevity of the IC.

Maximum Seated Height: 2.36 mm

Low seated height facilitates compact PCB designs, enabling space-efficient telecom products without compromising on functionality.

Width: 27 mm

Optimal width measurement allows for easy integration into standard telecom equipment racks and enclosures, ensuring compatibility with industry standards.

Length: 27 mm

Compact length dimensions further contribute to space-saving design considerations in telecom applications, enhancing overall system efficiency.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature specifications indicate robustness and reliability of the IC under extreme temperature fluctuations, making it suitable for automotive telecom applications.

Terminal Form: BALL

Ball terminal form ensures secure electrical connections and solder joints, enhancing the overall durability and performance of the switching IC.

Maximum Supply Current: 2000 mA

High maximum supply current rating enables the IC to handle heavy loads and multiple network connections simultaneously, making it suitable for high-demand telecom environments.

Telecom IC Type: ETHERNET SWITCH

Specifically designed as an Ethernet switch IC, this product offers advanced networking capabilities and features tailored to telecom infrastructure requirements.

Nominal Supply Voltage: 1 V

Stable nominal supply voltage of 1V ensures consistent power delivery to the IC, optimizing its performance and reliability in telecom applications.

Terminal Pitch: 1 mm

Fine terminal pitch of 1mm enables high-density PCB designs with multiple terminals, enhancing connectivity options and functionality in telecom systems.

Technical Specifications

Telecom - Switching ICs VSC7423XJG-02 attributes and parameters. Explore more Telecom - Switching ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B672

Length:

27 mm

No. of Functions:

1

No. of Terminals:

672

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA672,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Maximum Seated Height:

2.36 mm

Maximum Supply Current:

2000 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

VSC7423XJG-02 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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