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OTP ROM

OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.

OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.

OTP ROM

Available Parts 2,400+

Part RoHS Manufacturer Description Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time Programming Voltage (V)
AT27C256R-70PU by Microchip Technology

AT27C256R-70PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

32768 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T28

5.5 V

6.35 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

e3

.001 Amp

37.4015 mm

70 ns

5

AT27C256R-70JU by Microchip Technology

AT27C256R-70JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LCC32,.45X.55

OTP ROMs

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

2

5.5 V

3.556 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

e3

40

245

.001 Amp

13.97 mm

70 ns

5

AT27C512R-70PU by Microchip Technology

AT27C512R-70PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .0001 Amp;

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T28

5.5 V

6.35 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

.0001 Amp

37.4015 mm

70 ns

5

AT27C256R-45PU by Microchip Technology

AT27C256R-45PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

32768 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T28

5.5 V

6.35 mm

15.24 mm

Not Qualified

262144 bit

4.5 V

e3

.001 Amp

37.4015 mm

45 ns

5

AT27C256R-70JU-T by Microchip Technology

AT27C256R-70JU-T

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Position: QUAD;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

32768 words

COMMON

5

8

CHIP CARRIER

LCC32,.45X.55

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

QUAD

1

R-PQCC-J32

5.5 V

3.556 mm

11.43 mm

262144 bit

4.5 V

.0001 Amp

13.97 mm

70 ns

13

AT27C512R-45PU by Microchip Technology

AT27C512R-45PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T28

5.5 V

6.35 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

.0001 Amp

37.4015 mm

45 ns

5

AT27C256R-45JU by Microchip Technology

AT27C256R-45JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

32768 words

COMMON

5

5

8

CHIP CARRIER

LCC32,.45X.55

OTP ROMs

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

2

5.5 V

3.556 mm

11.43 mm

Not Qualified

262144 bit

4.5 V

e3

40

245

.001 Amp

13.97 mm

45 ns

5

AT27C256R-45JU-T by Microchip Technology

AT27C256R-45JU-T

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Length: 13.97 mm;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

32768 words

COMMON

5

8

CHIP CARRIER

LCC32,.45X.55

1.27 mm

85 Cel

3-STATE

32KX8

32K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

5.5 V

3.556 mm

11.43 mm

262144 bit

4.5 V

e3

.0001 Amp

13.97 mm

45 ns

13

AT27C512R-70JU by Microchip Technology

AT27C512R-70JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; JESD-30 Code: R-PQCC-J32;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e3

40

245

.0001 Amp

13.97 mm

70 ns

5

AT27C010-70PU by Microchip Technology

AT27C010-70PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;

OTP ROM

INDUSTRIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

25 mA

131072 words

COMMON

5

5

8

IN-LINE

DIP32,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T32

5.5 V

4.826 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

.00001 Amp

42.037 mm

70 ns

13

AT27C512R-45JU by Microchip Technology

AT27C512R-45JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Width: 11.43 mm;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e3

40

245

.0001 Amp

13.97 mm

45 ns

5

AT27C512R-70JU-T by Microchip Technology

AT27C512R-70JU-T

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

8

CHIP CARRIER

LDCC32,.5X.6

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

5.5 V

3.556 mm

11.43 mm

524288 bit

4.5 V

e3

.0001 Amp

13.97 mm

70 ns

5

AT27C512R-45JU-T by Microchip Technology

AT27C512R-45JU-T

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Style (Meter): CHIP CARRIER;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

8

CHIP CARRIER

LDCC32,.5X.6

1.27 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

5.5 V

3.556 mm

11.43 mm

524288 bit

4.5 V

e3

30

260

.0001 Amp

13.97 mm

45 ns

5

DS2502P-E48/T&R by Maxim Integrated

DS2502P-E48/T&R

Maxim Integrated

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: LSOC; Package Shape: RECTANGULAR; Memory Density: 1024 bit;

OTP ROM

INDUSTRIAL

6

LSOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

SYNCHRONOUS

.005 mA

1024 words

COMMON

3/5

1

SMALL OUTLINE, LOW PROFILE

SOC6,.17

Other Memory ICs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-C6

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

e0

.000005 Amp

3.94 mm

DS2502P-E48+T&R by Analog Devices

DS2502P-E48+T&R

Analog Devices

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Power Supplies (V): 3/5;

OTP ROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

.005 mA

1024 words

COMMON

3/5

1

SMALL OUTLINE

SOC6,.17

Other Memory ICs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

6 V

1.5 mm

3.81 mm

Not Qualified

1024 bit

2.8 V

e3

30

260

.000005 Amp

3.937 mm

DS2502P-E48 by Maxim Integrated

DS2502P-E48

Maxim Integrated

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: LSOC; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

OTP ROM

INDUSTRIAL

6

LSOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

SYNCHRONOUS

.005 mA

1024 words

COMMON

3/5

1

SMALL OUTLINE, LOW PROFILE

SOC6,.17

Other Memory ICs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-C6

1

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

e0

20

240

.000005 Amp

3.94 mm

DS2502P-E48+ by Analog Devices

DS2502P-E48+

Analog Devices

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Maximum Supply Current: .005 mA;

OTP ROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

.005 mA

1024 words

COMMON

3/5

1

SMALL OUTLINE

SOC6,.17

Other Memory ICs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

e3

30

260

.000005 Amp

3.94 mm

AT27C256R-70JU-306 by Microchip Technology

AT27C256R-70JU-306

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Width: 11.43 mm;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

32768 words

5

8

CHIP CARRIER

1.27 mm

85 Cel

32KX8

32K

-40 Cel

QUAD

R-PQCC-J32

5.5 V

3.556 mm

11.43 mm

262144 bit

4.5 V

13.97 mm

70 ns

AT27C256R-70JUSL383 by Microchip Technology

AT27C256R-70JUSL383

Microchip Technology

OTP ROM; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Programming Voltage (V): 5; Operating Mode: ASYNCHRONOUS;

OTP ROM

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

32768 words

SEPARATE

5

8

CHIP CARRIER

LDCC32,.5X.6

1.27 mm

85 Cel

32KX8

32K

-40 Cel

QUAD

R-PQCC-J32

5.5 V

3.556 mm

11.43 mm

262144 bit

4.5 V

.001 Amp

13.97 mm

70 ns

5

AT27C010-70JU by Microchip Technology

AT27C010-70JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

25 mA

131072 words

COMMON

5

5

8

CHIP CARRIER

LCC32,.45X.55

OTP ROMs

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

11.43 mm

Not Qualified

1048576 bit

4.5 V

e3

40

245

.00001 Amp

13.97 mm

70 ns

13

AT27C040-70PU by Microchip Technology

AT27C040-70PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP32,.6;

OTP ROM

INDUSTRIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

5

5

8

IN-LINE

DIP32,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T32

5.5 V

4.826 mm

15.24 mm

Not Qualified

4194304 bit

4.5 V

e3

.0001 Amp

42.037 mm

70 ns

13

AT27C1024-70PU by Microchip Technology

AT27C1024-70PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

OTP ROM

INDUSTRIAL

40

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

16

IN-LINE

DIP40,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T40

5.5 V

4.826 mm

15.24 mm

Not Qualified

1048576 bit

4.5 V

e3

.0001 Amp

52.324 mm

70 ns

13

AT27C010-70JU-T by Microchip Technology

AT27C010-70JU-T

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

25 mA

131072 words

COMMON

5

8

CHIP CARRIER

LCC32,.45X.55

1.27 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

QUAD

1

R-PQCC-J32

5.5 V

3.556 mm

11.43 mm

1048576 bit

4.5 V

.0001 Amp

13.97 mm

70 ns

13

M27C512-90C1 by STMicroelectronics

M27C512-90C1

STMicroelectronics

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Equivalence Code: LDCC32,.5X.6;

OTP ROM

COMMERCIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

TIN LEAD

QUAD

R-PQCC-J32

5.5 V

3.56 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

13.97 mm

90 ns

AT27C1024-70JU by Microchip Technology

AT27C1024-70JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Surface Mount: YES;

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

1

S-PQCC-J44

3

5.5 V

4.572 mm

16.586 mm

Not Qualified

1048576 bit

4.5 V

e3

40

245

.0001 Amp

16.586 mm

70 ns

13

AT27C4096-55JU by Microchip Technology

AT27C4096-55JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

40 mA

262144 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

85 Cel

3-STATE

256KX16

256K

-40 Cel

MATTE TIN

QUAD

1

S-PQCC-J44

3

5.5 V

4.572 mm

16.586 mm

Not Qualified

4194304 bit

4.5 V

e3

40

245

.0001 Amp

16.586 mm

55 ns

13

AT27C040-70JU by Microchip Technology

AT27C040-70JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

5

5

8

CHIP CARRIER

LCC32,.45X.55

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

11.43 mm

Not Qualified

4194304 bit

4.5 V

e3

40

245

.0001 Amp

13.97 mm

70 ns

13

AT27C040-90JU by Microchip Technology

AT27C040-90JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 8;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

524288 words

COMMON

5

5

8

CHIP CARRIER

LCC32,.45X.55

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

3

5.5 V

3.556 mm

11.43 mm

Not Qualified

4194304 bit

4.5 V

e3

40

245

.0001 Amp

13.97 mm

90 ns

13

M27C512-90B6 by STMicroelectronics

M27C512-90B6

STMicroelectronics

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e3;

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

MATTE TIN

DUAL

R-PDIP-T28

5.5 V

5.08 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e3

.0001 Amp

36.83 mm

90 ns

AT27C512R-90PI by Atmel

AT27C512R-90PI

Atmel

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;

OTP ROM

INDUSTRIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

64KX8

64K

-40 Cel

TIN LEAD

DUAL

R-PDIP-T28

1

5.5 V

5.59 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

36.95 mm

90 ns

AT27C1024-70JU-T by Microchip Technology

AT27C1024-70JU-T

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER;

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

30 mA

65536 words

COMMON

5

16

CHIP CARRIER

LDCC44,.7SQ

1.27 mm

85 Cel

3-STATE

64KX16

64K

-40 Cel

MATTE TIN

QUAD

1

S-PQCC-J44

5.5 V

4.572 mm

16.586 mm

1048576 bit

4.5 V

e3

.0001 Amp

16.586 mm

70 ns

13

DS2502P/T&R by Maxim Integrated

DS2502P/T&R

Maxim Integrated

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 240;

OTP ROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

128 words

COMMON

5

3/5

8

SMALL OUTLINE

SOC6,.17

Other Memory ICs

1.27 mm

85 Cel

128X8

128

-40 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDSO-C6

1

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e0

20

240

3.94 mm

15000 ns

DS2502P+T&R by Analog Devices

DS2502P+T&R

Analog Devices

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Additional Features: MICROLAN COMPATIBLE;

OTP ROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

128 words

5

8

SMALL OUTLINE

1.27 mm

85 Cel

128X8

128

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e3

30

260

3.94 mm

AT27C020-55PU by Microchip Technology

AT27C020-55PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 25 mA;

OTP ROM

INDUSTRIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

25 mA

262144 words

COMMON

5

5

8

IN-LINE

DIP32,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T32

5.5 V

4.826 mm

15.24 mm

Not Qualified

2097152 bit

4.5 V

e3

.0001 Amp

42.037 mm

55 ns

13

AT27C512R-12JC by Atmel

AT27C512R-12JC

Atmel

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Package Equivalence Code: LDCC32,.5X.6;

OTP ROM

COMMERCIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

CHIP CARRIER

LDCC32,.5X.6

OTP ROMs

1.27 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

TIN LEAD

QUAD

R-PQCC-J32

2

5.5 V

3.55 mm

11.43 mm

Not Qualified

524288 bit

4.5 V

e0

225

.0001 Amp

13.97 mm

120 ns

DS2502R/T&R by Maxim Integrated

DS2502R/T&R

Maxim Integrated

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Terminal Pitch: .95 mm;

OTP ROM

INDUSTRIAL

3

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

ASYNCHRONOUS

128 words

COMMON

5

3/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TO-236

Other Memory ICs

.95 mm

85 Cel

128X8

128

-40 Cel

TIN LEAD

DUAL

R-PDSO-G3

1

6 V

1.12 mm

1.3 mm

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e0

2.92 mm

15000 ns

DS2502R+T&R by Analog Devices

DS2502R+T&R

Analog Devices

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TSSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;

OTP ROM

INDUSTRIAL

3

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

ASYNCHRONOUS

128 words

COMMON

5

3/5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TO-236

Other Memory ICs

.95 mm

85 Cel

128X8

128

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-G3

1

6 V

1.12 mm

1.3 mm

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e3

30

260

2.92 mm

15000 ns

AT27C512R-70PC by Atmel

AT27C512R-70PC

Atmel

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

OTP ROM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

TIN LEAD

DUAL

R-PDIP-T28

1

5.5 V

5.59 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

36.95 mm

70 ns

AT27C020-90PU by Microchip Technology

AT27C020-90PU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;

OTP ROM

INDUSTRIAL

32

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

25 mA

262144 words

COMMON

5

5

8

IN-LINE

DIP32,.6

OTP ROMs

2.54 mm

85 Cel

3-STATE

256KX8

256K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T32

5.5 V

4.826 mm

15.24 mm

Not Qualified

2097152 bit

4.5 V

e3

.0001 Amp

42.037 mm

90 ns

13

AT27C512R-15PC by Atmel

AT27C512R-15PC

Atmel

OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;

OTP ROM

COMMERCIAL

28

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

20 mA

65536 words

COMMON

5

5

8

IN-LINE

DIP28,.6

OTP ROMs

2.54 mm

70 Cel

3-STATE

64KX8

64K

0 Cel

TIN LEAD

DUAL

R-PDIP-T28

1

5.5 V

5.59 mm

15.24 mm

Not Qualified

524288 bit

4.5 V

e0

.0001 Amp

36.95 mm

150 ns

DS2502P by Maxim Integrated

DS2502P

Maxim Integrated

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-C6;

OTP ROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

128 words

COMMON

5

3/5

8

SMALL OUTLINE

SOC6,.17

Other Memory ICs

1.27 mm

85 Cel

128X8

128

-40 Cel

Tin/Lead (Sn85Pb15)

DUAL

R-PDSO-C6

1

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e0

20

240

3.94 mm

15000 ns

DS2502P+ by Analog Devices

DS2502P+

Analog Devices

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 6; Package Code: SOC; Package Shape: RECTANGULAR; Package Equivalence Code: SOC6,.17;

OTP ROM

INDUSTRIAL

6

SOC

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

C BEND

SERIAL

ASYNCHRONOUS

128 words

COMMON

5

3/5

8

SMALL OUTLINE

SOC6,.17

Other Memory ICs

1.27 mm

85 Cel

128X8

128

-40 Cel

Matte Tin (Sn) - annealed

DUAL

R-PDSO-C6

1

6 V

1.5 mm

3.76 mm

Not Qualified

1024 bit

2.8 V

MICROLAN COMPATIBLE

e3

30

260

3.94 mm

15000 ns

AT27LV040A-90JU by Microchip Technology

AT27LV040A-90JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Width: 8;

OTP ROM

INDUSTRIAL

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

10 mA

524288 words

COMMON

3.3

3.3/5

8

CHIP CARRIER

LCC32,.45X.55

OTP ROMs

1.27 mm

85 Cel

3-STATE

512KX8

512K

-40 Cel

MATTE TIN

QUAD

1

R-PQCC-J32

3

3.6 V

3.556 mm

11.43 mm

Not Qualified

4194304 bit

3 V

ALSO OPERATES AT 5V SUPPLY

e3

40

245

.00002 Amp

13.97 mm

90 ns

13

5962-8851806LA by Defense Logistics Agency

5962-8851806LA

Defense Logistics Agency

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 512X8;

OTP ROM

MILITARY

24

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

SYNCHRONOUS

512 words

5

8

IN-LINE

125 Cel

512X8

512

-55 Cel

TIN LEAD

DUAL

R-GDIP-T24

5.5 V

Qualified

4096 bit

4.5 V

e0

AT27C4096-90JU by Microchip Technology

AT27C4096-90JU

Microchip Technology

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 4.5 V;

OTP ROM

INDUSTRIAL

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

J BEND

PARALLEL

ASYNCHRONOUS

40 mA

262144 words

COMMON

5

5

16

CHIP CARRIER

LDCC44,.7SQ

OTP ROMs

1.27 mm

85 Cel

3-STATE

256KX16

256K

-40 Cel

MATTE TIN

QUAD

1

S-PQCC-J44

3

5.5 V

4.572 mm

16.586 mm

Not Qualified

4194304 bit

4.5 V

e3

40

245

.0001 Amp

16.586 mm

90 ns

13

DS2502-E48 by Maxim Integrated

DS2502-E48

Maxim Integrated

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Shape: ROUND; Parallel or Serial: SERIAL; Operating Mode: SYNCHRONOUS;

OTP ROM

INDUSTRIAL

3

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

.005 mA

1024 words

COMMON

3/5

1

CYLINDRICAL

SIP3,.1,50

Other Memory ICs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

TIN LEAD

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

e0

245

.000005 Amp

DS2502-E48+ by Analog Devices

DS2502-E48+

Analog Devices

OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Shape: ROUND; Package Style (Meter): CYLINDRICAL; Organization: 1KX1;

OTP ROM

INDUSTRIAL

3

ROUND

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

ASYNCHRONOUS

.005 mA

1024 words

COMMON

3/5

1

CYLINDRICAL

SIP3,.1,50

Other Memory ICs

1.27 mm

85 Cel

1KX1

1K

-40 Cel

Matte Tin (Sn) - annealed

BOTTOM

O-PBCY-T3

6 V

Not Qualified

1024 bit

2.8 V

e3

250

.000005 Amp

5962-8851805LA by Defense Logistics Agency

5962-8851805LA

Defense Logistics Agency

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;

OTP ROM

MILITARY

24

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

THROUGH-HOLE

PARALLEL

SYNCHRONOUS

512 words

5

8

IN-LINE

125 Cel

512X8

512

-55 Cel

TIN LEAD

DUAL

R-GDIP-T24

5.5 V

Qualified

4096 bit

4.5 V

e0