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M27C256B-15C1

STMicroelectronics

M27C256B-15C1 by STMicroelectronics

STMicroelectronics M27C256B-15C1 is a 32KX8 OTP ROM with 150 ns access time, operating at 5V. It features 3-STATE output and supports parallel interface. Commonly used in commercial applications requiring non-volatile memory storage.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

44

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 5 parts In-Stock

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$2.609

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TEDSS.com

USA . 40 parts In-Stock

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$5.000

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40

$5.000

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$8.430

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1

$8.430

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Vyrian

USA . 6,115 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 5,310 parts In-Stock

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J2 Sourcing AB

Sweden . 4,760 parts In-Stock

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Pegasus Components GmbH

Germany . 3,808 parts In-Stock

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Digiode

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LIBRA Elektronik GmbH

Germany . 2,896 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 2,839 parts In-Stock

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Electro Mavin

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Standard Data Resources

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ECAB

Sweden . 1,428 parts In-Stock

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A2Z Electronics, Inc.

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Bristol Electronics

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Tectiva GmbH

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Anansix

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Electronics Depot

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PC Components Company LLC

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Nova Conductors

Japan . 300 parts In-Stock

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ComSIT Distribution GmbH

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ComSIT USA

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Prism Electronics

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Cyclops Electronics Ltd

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Digital Electronic Gebert Verwaltungs UG

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Resion

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Holdelec - ElecDif-Pro

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Extreme Components

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Beltway Electronics Company

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Manoshevitz Elec. Sales

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Sogenti Electronics

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Fibra_Brandt Electronic GMBH

Germany . 32 parts In-Stock

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Kronex Distribution GmbH

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Odi Ramu Company

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Electronic Expediters

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Classic Components Corporation

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Lighthouse Electronics, Inc.

USA . 16 parts In-Stock

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LWI Electronics Inc

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LittleDiode

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 3 parts In-Stock

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Legend Electronics Inc.

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,607 parts In-Stock

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$2.798

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$2.518

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$2.798

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$2.518

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MKK Technologies

India . 1,495 parts In-Stock

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$5.261

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$5.261

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DigiPath Technology Company

USA . 1,495 parts In-Stock

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$5.261

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$5.261

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Microchip USA

USA . 436 parts In-Stock

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$5.594

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436

$5.594

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Ampacity Inc.

Singapore . 1,181 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 512 parts In-Stock

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$9.635

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512

$9.635

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RC Electronics

USA . 36,321 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 16,439 parts In-Stock

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S.R.D Solutions

India . 15,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,422 parts In-Stock

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Kepictronics

USA . 5,947 parts In-Stock

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Assy Fe

Spain . 5,314 parts In-Stock

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Argo Parts USA

USA . 4,406 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,281 parts In-Stock

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Corphita

USA . 1,079 parts In-Stock

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Continental Prestige Electronics

USA . 781 parts In-Stock

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781

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Perfect Parts

USA . 461 parts In-Stock

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461

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Bastille Electronics

Australia . 300 parts In-Stock

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Parana Technologies

USA . 143 parts In-Stock

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$3.345

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Cyclops Electronics Ltd (Excess)

UK . 64 parts In-Stock

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Glotronic Ltd.

UK . 51 parts In-Stock

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Standard Data Resources (Excess)

USA . 18 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 7 parts In-Stock

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Overview

Discover the M27C256B-15C1 by STMicroelectronics, a top-of-the-line OTP ROM chip that delivers unparalleled quality and reliability. With STMicroelectronics' reputation for excellence in semiconductor manufacturing, this chip offers exceptional performance and durability for a wide range of applications. Whether you're working on consumer electronics, automotive systems, or industrial equipment, the M27C256B-15C1 provides the value, benefits, and advantages you need to bring your projects to life. Trust STMicroelectronics to deliver cutting-edge technology that meets and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this OTP ROM lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount design of this OTP ROM allows for easy and efficient installation onto circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape of this OTP ROM ensures compatibility with standard PCB layouts, making it easy to integrate into existing designs.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode of this OTP ROM allows for flexible and independent access to data, enhancing overall system performance.

Input/Output Type: COMMON

The common input/output type of this OTP ROM simplifies connections and communication with other components, streamlining the design process.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with a wide range of systems, making this OTP ROM a versatile choice for various applications.

Power Supplies (V): 5

With a power supply voltage of 5V, this OTP ROM efficiently operates within standard voltage ranges, reducing the risk of overloading or overheating.

No. of Terminals: 32

The 32 terminals of this OTP ROM provide ample connectivity options, allowing for versatile integration into complex circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style of this OTP ROM offers a compact and space-saving form factor, ideal for applications with limited PCB real estate.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70°C ensures reliable performance in a wide range of environmental conditions, making this OTP ROM suitable for various applications.

Technical Specifications

OTP ROM M27C256B-15C1 attributes and parameters. Explore more OTP ROM devices from STMicroelectronics

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e3

Length:

13.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.75

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

OTP ROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

M27C256B-15C1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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