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SN74S3708JP4

Texas Instruments

SN74S3708JP4 by Texas Instruments

SN74S3708JP4 by Texas Instruments is a 1KX8 OTP ROM IC with 8192-bit memory density. Operating b/w 0°C to 70°C, it features TTL technology and a rectangular ceramic package style with 24 terminals. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,815 parts In-Stock

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8,815

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Digiode

USA . 3,971 parts In-Stock

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3,971

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 743 parts In-Stock

1+ parts

$2.772

100+ parts

-

1k+ parts

$3.257

10k+ parts

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743

$2.772

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$3.257

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DigiPath Technology Company

USA . 1,216 parts In-Stock

1+ parts

$3.053

100+ parts

$2.808

1k+ parts

-

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1,216

$3.053

$2.808

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ChromeModa Solutions

Germany . 5,627 parts In-Stock

1+ parts

$3.115

100+ parts

$2.554

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-

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5,627

$3.115

$2.554

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IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$3.115

100+ parts

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1k+ parts

$2.804

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1,764

$3.115

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$2.804

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AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$4.913

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634

$4.913

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One Stop Electronics

USA . 1,464 parts In-Stock

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$30.000

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1,464

$30.000

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Corphita

USA . 1,508 parts In-Stock

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1,508

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Overview

Unlock the power of cutting-edge technology with the SN74S3708JP4 by Texas Instruments. Crafted with precision and expertise, this OTP ROM offers unrivaled quality and reliability. Designed for a wide range of applications, from industrial automation to consumer electronics, this product provides exceptional value and performance. Experience seamless integration and enhanced functionality with the SN74S3708JP4, a testament to Texas Instruments' commitment to innovation and excellence. Upgrade your systems today and elevate your projects to new heights with this game-changing solution.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body provides excellent thermal conductivity and stability, ensuring reliable performance in various operating conditions.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options, making it compatible with a wide range of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this OTP ROM can withstand moderate heat levels without compromising performance.

Organization: 1KX8

The 1KX8 organization means that the memory is organized as 1 kilobit words of 8 bits each, providing a balanced memory structure for efficient data storage.

Technology: TTL

Using TTL technology ensures compatibility with a wide range of systems and devices, making it a versatile and easily integratable solution.

Memory Width: 8

With a memory width of 8 bits, this OTP ROM can store and retrieve data in byte-sized chunks, providing efficient data handling capabilities.

Technical Specifications

OTP ROM SN74S3708JP4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Terminals:

24

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX8

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74S3708JP4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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