Loading...

TBP24SA41J

Texas Instruments

TBP24SA41J by Texas Instruments

TBP24SA41J by Texas Instruments is an OTP ROM with 1KX4 organization, operating at 5V. It features a memory density of 4096 bit and max access time of 60ns. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,777

-

-

-

-

Digiode

USA . 3,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,122

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,021 parts In-Stock

1+ parts

$3.383

100+ parts

-

1k+ parts

$3.910

10k+ parts

-

2,021

$3.383

-

$3.910

-

DigiPath Technology Company

USA . 1,389 parts In-Stock

1+ parts

$3.725

100+ parts

$3.427

1k+ parts

-

10k+ parts

-

1,389

$3.725

$3.427

-

-

ChromeModa Solutions

Germany . 1,915 parts In-Stock

1+ parts

$3.801

100+ parts

$3.117

1k+ parts

-

10k+ parts

-

1,915

$3.801

$3.117

-

-

IDEA Electronic Components Group

UK . 420 parts In-Stock

1+ parts

$3.801

100+ parts

-

1k+ parts

$3.421

10k+ parts

-

420

$3.801

-

$3.421

-

AZTECH Wire

Italy . 352 parts In-Stock

1+ parts

$9.270

100+ parts

-

1k+ parts

-

10k+ parts

-

352

$9.270

-

-

-

One Stop Electronics

USA . 1,602 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,602

$24.000

-

-

-

Corphita

USA . 1,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,717

-

-

-

-

Overview

Upgrade your system with the TBP24SA41J by Texas Instruments, a top-of-the-line OTP ROM that offers unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications. With its advanced technology and commercial-grade temperature grade, this OTP ROM ensures optimal performance in any environment. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the TBP24SA41J and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides durability and protection, making this OTP ROM suitable for various environments and conditions.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexibility in timing and communication, making this OTP ROM compatible with different systems and applications.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures stable and reliable performance, making this OTP ROM a dependable choice for electronic devices.

Memory Density: 4096 bit

With a high memory density of 4096 bits, this OTP ROM provides ample storage capacity for data and instructions, making it suitable for complex applications.

Maximum Access Time: 60 ns

The maximum access time of 60 nanoseconds ensures fast and efficient read operations, making this OTP ROM ideal for applications requiring quick data retrieval.

Technical Specifications

OTP ROM TBP24SA41J attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

60 ns

JESD-30 Code:

R-GDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX4

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

OTP ROMs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TBP24SA41J Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20