Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TBP24S10J4 by Texas Instruments is a 256x4 OTP ROM with 1024-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 55ns. This IC, housed in a ceramic rectangular package, is ideal for commercial applications requiring reliable non-volatile memory storage.
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The ceramic package body material ensures excellent durability and resistance to high temperatures, making the product reliable for long-term use.
The 5V supply voltage provides stable power to the device, ensuring consistent performance and reliability.
With 16 terminals, this product offers flexibility in connectivity options and allows for easy integration into different systems.
The high maximum operating temperature of 70°C ensures that the product can perform reliably even in demanding environmental conditions.
The OTP ROM memory type ensures that the data stored in the memory is secure and cannot be easily altered, making it ideal for applications requiring permanent data storage.
OTP ROM TBP24S10J4 attributes and parameters. Explore more OTP ROM devices from Texas Instruments
Maximum Access Time:
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Terminals:
No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Sub-Category:
Maximum Supply Current:
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
TBP24S10J4 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
M24308/2-1F
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
Changzhou Galaxy Century Microelectronics
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99LT1G
BAV99LT1G by Onsemi is a series connected diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.006 us and can handle up to 100V repetitive peak reverse voltage. Ideal for rectification applications, this diode operates b/w -65°C to 150°C temperature range.
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
Crimson Semiconductor
SS14+
Multicomp Pro
SS14+ by Multicomp Pro is a Schottky rectifier diode with a max output current of 1A and a reverse test voltage of 40V. It is designed for surface mount applications in electronic circuits, offering a small outline package style and dual terminal position. With a temperature range from -65°C to 150°C, it is suitable for various industrial and consumer electronics.
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
5962-01-218-8482
Texas Instruments
Texas Instruments' 5962-01-218-8482 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 75ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
TBP18S46JP4
The Texas Instruments TBP18S46JP4 is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates at a nominal voltage of 5V, making it suitable for commercial-grade applications requiring reliable non-volatile memory storage in a ceramic rectangular package.
TBP28L42NP1
TBP28L42NP1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 95ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology environments.
5962-01-214-2161
Texas Instruments' 5962-01-214-2161 is a MILITARY-grade OTP ROM with 512X8 organization, 4096-bit memory density, and 85ns max access time. Ideal for applications requiring reliable non-volatile memory in harsh environments.
AT27C512R-90JC
Atmel
Atmel's AT27C512R-90JC is a 64KX8 OTP ROM chip with 90 ns access time, operating at 5V. It features 3-STATE output, CMOS technology, and operates in parallel mode. Commonly used for memory storage applications due to its 524288-bit density and commercial temperature grade suitability.
DS2502P+
Analog Devices
DS2502P+ by Analog Devices is a 1024-bit OTP ROM with 128x8 organization. It operates at 5V, has a temperature range of -40 to 85°C, and features serial interface. Commonly used in industrial applications for secure data storage due to its small outline package and asynchronous operation mode.
SN74S476NP1
SN74S476NP1 by Texas Instruments is a 5V OTP ROM with 1KX4 organization and 4096-bit memory density. It features TTL technology, operates b/w 0-70°C, and has an IN-LINE package style. Ideal for applications requiring non-volatile memory storage in commercial-grade environments.
TBP18SA22JP4
TBP18SA22JP4 by Texas Instruments is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it has a max access time of 70ns and operates in commercial temperature grade. This rectangular ceramic package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage in TTL technology.
SNM54S471J
SNM54S471J by Texas Instruments is a MIL-STD-883 Class C OTP ROM with 256x8 organization and 2048-bit memory density. Operating b/w -55 to 125°C, it has a max access time of 80ns. Ideal for military applications requiring reliable data storage in harsh environments.
DS2502S
Maxim Integrated
DS2502S by Maxim Integrated is an OTP ROM with 1024-bit memory density and 128x8 organization. It operates asynchronously at a max temperature of 85°C, suitable for industrial applications. The package is small outline, surface mountable, with Gull Wing terminals and a supply voltage range of 2.8V to 6V.
JBP18S030MW
Texas Instruments JBP18S030MW is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features a max access time of 50ns, suitable for military-grade applications requiring fast and reliable non-volatile memory storage in harsh environments. The package style is flatpack with ceramic and glass-sealed body material, making it ideal for surface-mount designs in compact spaces.
5962-8769001RX
Texas Instruments' 5962-8769001RX is a MILITARY-grade OTP ROM with 512X8 organization, 4096 bit memory density, and 70 ns max access time. It operates in ASYNCHRONOUS mode at temperatures ranging from -55 to 125 °C, making it ideal for military applications requiring reliable non-volatile memory storage.
CBP28R165MJ
The Texas Instruments CBP28R165MJ is a MIL-STD-883 Class B OTP ROM with 2KX8 organization and 16384-bit memory density. It operates b/w -55 to 125 °C, making it ideal for military applications requiring reliable TTL technology in a ceramic package. With 24 terminals in an in-line rectangular shape, this device offers secure data storage and retrieval capabilities.
AT27C256R-12JI
Atmel's AT27C256R-12JI is a 32Kx8 OTP ROM with 120ns access time, operating at 5V. It features asynchronous mode, 3-STATE output, and J BEND terminals. Widely used in industrial applications for storing code or data due to its 262144-bit memory density and parallel interface.
AT27C4096-90JU
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
JBP34SA162MJ
JBP34SA162MJ by Texas Instruments is a MILITARY-grade OTP ROM with 4KX4 organization, 16384-bit memory density, and 4096 words. It operates b/w -55°C to 125°C, making it suitable for rugged environments requiring reliable non-volatile memory storage in military applications.
SNJ54S475J
SNJ54S475J by Texas Instruments is a MILITARY-grade OTP ROM with 512x8 organization and 4096-bit memory density. It operates b/w -55°C to 125°C, has a max access time of 85ns, and consumes up to 155mA. Ideal for applications requiring reliable non-volatile memory in harsh environments.
SN74S478NP3
SN74S478NP3 by Texas Instruments is a 1KX8 OTP ROM with 8192-bit memory density and 70ns max access time. It operates at a nominal voltage of 5V, suitable for commercial-grade applications requiring reliable non-volatile memory storage in a rectangular plastic/epoxy package.
CMS209-250
Texas Instruments' CMS209-250 is a 64KX16 OTP ROM with 60 terminals. Operating at 5V, it offers 3-STATE output and supports parallel mode. Ideal for commercial applications, this CMOS technology device has a max access time of 250ns.
SNJ54S475W
SNJ54S475W by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. Operating b/w -55°C to 125°C, it has a max access time of 85ns and consumes up to 155mA supply current. Ideal for military-grade applications requiring fast and reliable non-volatile memory storage in a compact flatpack package.
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DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
TBP24S81-55J
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 2K;
TBP24S41J4
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
TBP24S10N
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.25 V;
TBP24S41NP1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 4;
TBP24S41MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
TBP24S10NP3
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TBP24S81-55J4
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Supply Current: 175 mA;
TBP24S41JP4
TBP24S10N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TBP24S41N3
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 60 ns;
TBP24S41N
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
TBP24S10NP1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 256 words;
TBP24S41NP3
TBP24S10MJ
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 4;
TBP24S41J
TBP24S10J
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TBP24S10JP4
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 4;
TBP24S10N3
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 256X4;
TBP24S41N1
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 1024 words;
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