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CMS213-200

Texas Instruments

CMS213-200 by Texas Instruments

Texas Instruments' CMS213-200 is a 64KX8 OTP ROM with 3-STATE output, operating at 5V. It features ASYNCHRONOUS mode and COMMON I/O type, suitable for commercial applications requiring fast access times of up to 200ns. The MICROELECTRONIC ASSEMBLY package style houses this CMOS technology device with 60 terminals.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,475 parts In-Stock

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Digiode

USA . 4,250 parts In-Stock

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Parana Technologies

USA . 973 parts In-Stock

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$2.368

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$2.868

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973

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DigiPath Technology Company

USA . 1,176 parts In-Stock

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$2.608

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$2.399

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ChromeModa Solutions

Germany . 4,168 parts In-Stock

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$2.661

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$2.182

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IDEA Electronic Components Group

UK . 1,115 parts In-Stock

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$2.661

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$2.395

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Native Components

USA . 191 parts In-Stock

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$8.691

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Northwest PG Solutions

USA . 593 parts In-Stock

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$9.560

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$8.604

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One Stop Electronics

USA . 409 parts In-Stock

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$12.000

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AZTECH Wire

Italy . 306 parts In-Stock

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Corphita

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Overview

Discover the cutting-edge technology of the Texas Instruments CMS213-200, a top-of-the-line OTP ROM that offers unparalleled quality and reliability. Ideal for a wide range of applications, this microelectronic assembly boasts a 64KX8 organization with 3-STATE output characteristics and operates at a nominal supply voltage of 5V. With a maximum access time of 200ns and a commercial temperature grade, this versatile device delivers high performance and efficiency. Unlock the endless possibilities with the CMS213-200 and experience superior functionality like never before.

Feature Benefit Bullets

Operating Mode: ASYNCHRONOUS

Allows for independent and simultaneous operations, making the product versatile and efficient.

Input/Output Type: COMMON

Simplifies the interface design and enhances compatibility with other devices.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage level ensures compatibility with most systems and power sources.

Power Supplies (V): 5

Provides stable power to the device, reducing the risk of malfunctions or data loss.

No. of Terminals: 60

Sufficient terminals for versatile connectivity and integration with other components.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

Compact and efficient packaging for space-saving and easy integration into devices.

Maximum Operating Temperature: 55 °C

Operates efficiently within a wide temperature range, suitable for various applications.

Organization: 64KX8

Optimal organization for data storage and retrieval, maximizing efficiency.

Output Characteristics: 3-STATE

Allows for multiple output states, enhancing flexibility in data transmission and processing.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without compromising performance.

Minimum Supply Voltage (Vsup): 4.75 V

Tolerant to fluctuations in power supply, reducing the risk of damage or data corruption.

Temperature Grade: COMMERCIAL

Suitable for commercial applications where reliability and performance are essential.

Technology: CMOS

Low power consumption and high noise immunity for efficient and reliable operation.

Parallel or Serial: PARALLEL

Parallel data transfer for faster and more efficient communication with other devices.

Maximum Supply Current: 50 mA

Low current consumption for energy efficiency and extended battery life.

No. of Words: 65536 words

Large storage capacity for storing a vast amount of data or program instructions.

Memory Width: 8

Suitable for processing and storing data in 8-bit units, compatible with many systems.

No. of Words Code: 64K

High memory capacity for storing a large amount of code or data.

Maximum Supply Voltage (Vsup): 5.25 V

Safe voltage limit to prevent damage to the device and ensure reliable operation.

Memory Density: 524288 bit

High memory density for storing a large amount of data in a compact form factor.

Memory IC Type: OTP ROM

OTP (One-Time Programmable) ROM for secure and non-volatile storage of data or code.

Maximum Standby Current: 0.0035 Amp

Low standby current consumption for energy efficiency and prolonged battery life.

Maximum Access Time: 200 ns

Fast access time for quick data retrieval and processing, enhancing overall performance.

Technical Specifications

OTP ROM CMS213-200 attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

Input/Output Type:

COMMON

JESD-30 Code:

X-XXMA-X60

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

60

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

CARD60

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.0035 Amp

Sub-Category:

Other Memory ICs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

UNSPECIFIED

Terminal Position:

UNSPECIFIED

Trade Compliance

CMS213-200 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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