Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Texas Instruments' 5962-01-218-8478 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it offers a max access time of 75ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
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Ceramic packages provide excellent thermal conductivity and protection against corrosion, making the product durable and reliable for long-term use.
Operates at a standard voltage level commonly used in many systems, ensuring compatibility and ease of integration.
Offers a high storage capacity with 512 words of 8 bits each, allowing for efficient data storage and retrieval.
Uses Transistor-Transistor Logic technology known for its high speed and reliability, providing fast data access and processing.
One-Time Programmable Read-Only Memory ensures secure data storage without the risk of accidental erasure or modification, ideal for critical information.
Offers quick access to stored data with a maximum access time of 75 nanoseconds, reducing latency and improving overall system performance.
OTP ROM 5962-01-218-8478 attributes and parameters. Explore more OTP ROM devices from Texas Instruments
Maximum Access Time:
JESD-30 Code:
Memory Density:
Memory IC Type:
Memory Width:
No. of Terminals:
No. of Words:
No. of Words Code:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Sub-Category:
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
5962-01-218-8478 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
1N4148WS
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
1N4148
Compensated Devices
RECTIFIER DIODE; Terminal Position: UPPER; Terminal Form: NO LEAD; No. of Terminals: 1; Surface Mount: YES; Package Shape: SQUARE;
National Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
0462-201-16141
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
2N2222A
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N5819HW-7-F
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
General Semiconductor
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
Telcom Semiconductor
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
SNC54S471J
Texas Instruments
SNC54S471J by Texas Instruments is a MIL-STD-883 Class B OTP ROM with 256x8 organization, 2048-bit memory density, and 80ns max access time. Ideal for military applications due to its TTL technology, -55 to 125°C operating range, and ceramic package.
DS2502S
Maxim Integrated
DS2502S by Maxim Integrated is an OTP ROM with 1024-bit memory density and 128x8 organization. It operates asynchronously at a max temperature of 85°C, suitable for industrial applications. The package is small outline, surface mountable, with Gull Wing terminals and a supply voltage range of 2.8V to 6V.
5962-01-226-1638
Texas Instruments' 5962-01-226-1638 is a 256x8 OTP ROM with 2048-bit memory density. Operating at 5V, it offers a max access time of 70ns and operates in commercial temperature grades. This rectangular ceramic package with 20 terminals is ideal for applications requiring reliable non-volatile memory storage.
M27C1001-35C6
STMicroelectronics
STMicroelectronics M27C1001-35C6 is a 128Kx8 OTP ROM with 35 ns access time, operating at 5V. It features 3-STATE output and common I/O type, suitable for industrial applications requiring reliable non-volatile memory storage in a compact chip carrier package.
5962-01-218-8487
Texas Instruments' 5962-01-218-8487 is a 512x8 OTP ROM with 4096-bit memory density. It operates at 5V, has a max access time of 75ns, and supports TTL technology. Ideal for commercial applications requiring non-volatile memory storage in a ceramic rectangular package.
TBP28L46N
TBP28L46N by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates at a nominal voltage of 5V and has a max access time of 95ns. This rectangular package IC, suitable for commercial use, features 24 terminals in an in-line style and TTL technology.
AT27C512R-70RC
Atmel
Atmel's AT27C512R-70RC is a 64KX8 OTP ROM with 70ns access time, operating at 5V. It features 3-STATE output, GULL WING terminals, and supports parallel interface. Ideal for commercial applications requiring non-volatile memory with small outline package style.
SN74S475J4
SN74S475J4 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density. It operates in commercial temperature grade range of 0-70°C, with max access time of 75ns. Ideal for applications requiring non-volatile memory storage in electronic devices.
AT27C512R-12JC
AT27C512R-12JC by Atmel is a 64KX8 OTP ROM with 120 ns access time, operating at 5V. It features 3-STATE output and supports parallel interface. Commonly used in commercial applications requiring non-volatile memory storage.
5962-01-267-5826
Texas Instruments' 5962-01-267-5826 is a 512x8 OTP ROM with 4096-bit memory density. Operating at 5V, it has a max access time of 60ns and operates in commercial temperature grades. This rectangular package with 20 terminals is ideal for applications requiring non-volatile memory storage in TTL technology.
AT27C256R-70JU-306
Microchip Technology
AT27C256R-70JU-306 by Microchip: 32KX8 OTP ROM, 262144 bit memory density, 70 ns access time. Ideal for industrial applications requiring reliable non-volatile memory with a supply voltage range of 4.5V to 5.5V and operating temperatures from -40°C to 85°C.
SN74S473J
SN74S473J by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring reliable non-volatile memory storage in a ceramic rectangular package with 20 terminals.
5962-01-140-2997
Texas Instruments' 5962-01-140-2997 is a 5V OTP ROM with 1KX4 organization, 4096-bit memory density, and operates b/w 0 to 70°C. It has an IN-LINE package style, suitable for commercial-grade applications requiring reliable non-volatile memory storage in a compact form factor.
AT27C512R-45JI
Atmel's AT27C512R-45JI is a 64KX8 OTP ROM with 45 ns access time, operating at 5V. Ideal for industrial applications, it features a 3-STATE output and operates in asynchronous mode. With a memory density of 524288 bits, this CMOS technology chip carrier package supports parallel input/output.
TBP18SA030MJ
TBP18SA030MJ by Texas Instruments is a 256-bit OTP ROM with 32x8 organization, operating at 5V. It features a max access time of 50ns and operates in parallel mode. Ideal for military-grade applications requiring fast and reliable non-volatile memory storage.
AT27LV040A-90JI
AT27LV040A-90JI by Atmel is a 512Kx8 OTP ROM chip with 3.3V nominal voltage, operating in asynchronous mode with 90ns access time. It features 32 terminals in a rectangular chip carrier package and is ideal for industrial applications requiring reliable non-volatile memory storage.
DS2505+
OTP ROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 3; Package Code: TO-92; Package Shape: ROUND; Operating Mode: ASYNCHRONOUS;
TBP18SA46N1
TBP18SA46N1 by Texas Instruments is a 512x8 OTP ROM with 4096-bit memory density and 75ns max access time. It operates b/w 0-70°C, drawing a max of 155mA supply current. Ideal for commercial applications requiring reliable non-volatile memory storage in a compact IN-LINE package style.
5962-8851806LA
Qp Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 512;
CY7C281A-45DMB
Cypress Semiconductor
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
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CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
Defense Logistics Agency
Defense Logistics Agency's 5962-8851806LA is a MILITARY-grade OTP ROM with 512X8 organization, operating at -55 to 125 °C. It features CERAMIC, GLASS-SEALED RECTANGULAR package, SYNCHRONOUS mode, and 5V supply voltage. Ideal for applications requiring reliable non-volatile memory storage in harsh environments.
Teledyne E2v (Uk)
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Length: 31.877 mm;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
5962-8851805LA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;
Defense Logistics Agency's 5962-8851805LA is a MILITARY-grade OTP ROM with 512X8 organization, operating at -55 to 125 °C. It features CERAMIC package, SYNCHRONOUS mode, and 24 terminals for parallel connection. Ideal for secure data storage in harsh environments.
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .12 Amp;
5962-8765102LA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
Defense Logistics Agency's 5962-8765102LA is a MILITARY-grade OTP ROM with 1KX8 organization, 8192 bit memory density, and 45 ns access time. It operates at -55 to 125 °C, with a supply voltage of 4.5-5.5 V. Ideal for applications requiring reliable non-volatile memory in harsh environments.
5962-8863603LA
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 8;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; JESD-30 Code: R-GDIP-T24;
5962-01-143-5793
Advanced Micro Devices
5962-01-143-5793 by Advanced Micro Devices is a MILITARY-grade OTP ROM with 512x8 organization, 70ns access time, and 4096-bit memory density. It operates b/w -55 to 125 °C and is ideal for high-reliability applications in military and aerospace sectors.
5962-01-143-5798
5962-01-143-5798 by Advanced Micro Devices is an OTP ROM with 512x8 organization, MILITARY grade, and 70ns access time. It is used in applications requiring reliable memory storage in harsh environments.
5962-01-085-7965
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP20,.3;
5962-01-053-0019
OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 1K;
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