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MRAMs

MRAM, or Magnetoresistive Random-Access Memory, is a type of non-volatile memory technology that uses the magnetic properties of materials to store data. MRAM combines the benefits of both traditional RAM (Random-Access Memory) and non-volatile memory technologies. Here are some key characteristics and features of MRAM:

Non-Volatile: MRAM is non-volatile, meaning it retains data even when the power is turned off. This is in contrast to traditional DRAM, which is volatile and loses data when powered down.

High Speed: MRAM offers fast read and write speeds, similar to traditional SRAM (Static Random-Access Memory). This makes it suitable for applications that require high-speed data access.

Endurance: MRAM has a high endurance, which means it can withstand a large number of write cycles without degradation. This durability is important for applications that involve frequent data updates.

Low Power Consumption: MRAM typically consumes less power compared to some other non-volatile memory technologies like Flash memory. This makes it energy-efficient and suitable for battery-powered devices.

Bit-Addressable: MRAM is bit-addressable, allowing for precise read and write operations at the individual bit level. This granularity is useful in applications where fine data control is required.

Durability: MRAM is known for its robustness and resistance to environmental factors such as radiation and extreme temperatures. This makes it suitable for applications in harsh environments, including aerospace and automotive industries.

Scalability: MRAM technology has been evolving, and efforts are ongoing to increase storage capacity while maintaining its favorable characteristics.

MRAM is used in embedded systems, IoT devices, data storage, and more, where its combination of non-volatility, speed, and endurance makes it beneficial.

MRAMs

Available Parts 150

Part RoHS Manufacturer Description Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Width Qualification Maximum Write Cycle Time (tWC) Memory Density Minimum Supply Voltage (Vsup) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time
MR4A16BCYS35R by Everspin Technologies

MR4A16BCYS35R

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;

MRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

1048576 words

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

SRAMs

20

.8 mm

85 Cel

1MX16

1M

3 V

-40 Cel

TIN

DUAL

R-PDSO-G54

3

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

16777216 bit

3 V

e3

260

.009 Amp

22.22 mm

35 ns

MR25H40MDFR by Everspin Technologies

MR25H40MDFR

Everspin Technologies

MRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;

MRAM

AUTOMOTIVE

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

SRAMs

1.27 mm

125 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3

3.6 V

.9 mm

5 mm

Not Qualified

4194304 bit

3 V

6 mm

MR25H40MDF by Everspin Technologies

MR25H40MDF

Everspin Technologies

MRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;

MRAM

AUTOMOTIVE

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

SRAMs

1.27 mm

125 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3

3.6 V

.9 mm

5 mm

Not Qualified

4194304 bit

3 V

40

260

6 mm

MR2A16ACYS35R by Freescale Semiconductor

MR2A16ACYS35R

Freescale Semiconductor

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

165 mA

262144 words

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

20

.8 mm

85 Cel

256KX16

256K

3 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G44

3

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

4194304 bit

3 V

e3

40

260

.012 Amp

18.41 mm

35 ns

MR25H40CDF by Everspin Technologies

MR25H40CDF

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;

MRAM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

SRAMs

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3

3.6 V

.9 mm

5 mm

Not Qualified

4194304 bit

3 V

260

6 mm

MR25H40CDFR by Everspin Technologies

MR25H40CDFR

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;

MRAM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

SRAMs

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3

3.6 V

.9 mm

5 mm

Not Qualified

4194304 bit

3 V

260

6 mm

MR4A16BCMA35R by Everspin Technologies

MR4A16BCMA35R

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;

MRAM

INDUSTRIAL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

1048576 words

3.3

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA48,6X8,30

SRAMs

20

.75 mm

85 Cel

1MX16

1M

3 V

-40 Cel

BOTTOM

S-PBGA-B48

3.6 V

1.35 mm

10 mm

Not Qualified

.000035 ms

16777216 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.009 Amp

10 mm

35 ns

MR5A16ACMA35R by Everspin Technologies

MR5A16ACMA35R

Everspin Technologies

MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH; Maximum Access Time: 35 ns;

MRAM

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA48,6X8,30

20

.75 mm

85 Cel

2MX16

2M

3 V

-40 Cel

BOTTOM

S-PBGA-B48

3.6 V

1.35 mm

10 mm

.000035 ms

33554432 bit

3 V

.018 Amp

10 mm

35 ns

MR5A16ACMA35 by Everspin Technologies

MR5A16ACMA35

Everspin Technologies

MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Parallel or Serial: PARALLEL; Memory Width: 16;

MRAM

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA48,6X8,30

20

.75 mm

85 Cel

2MX16

2M

3 V

-40 Cel

BOTTOM

S-PBGA-B48

3.6 V

1.35 mm

10 mm

.000035 ms

33554432 bit

3 V

.018 Amp

10 mm

35 ns

MR4A16BCMA35 by Everspin Technologies

MR4A16BCMA35

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Terminal Pitch: .75 mm;

MRAM

INDUSTRIAL

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

1048576 words

3.3

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA48,6X8,30

SRAMs

20

.75 mm

85 Cel

1MX16

1M

3 V

-40 Cel

BOTTOM

S-PBGA-B48

5

3.6 V

1.35 mm

10 mm

Not Qualified

.000035 ms

16777216 bit

3 V

40

260

.009 Amp

10 mm

35 ns

MR25H40VDFR by Everspin Technologies

MR25H40VDFR

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;

MRAM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

SRAMs

1.27 mm

105 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3

3.6 V

.9 mm

5 mm

Not Qualified

4194304 bit

3 V

6 mm

MR25H40CDCR by Everspin Technologies

MR25H40CDCR

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SON; Package Shape: RECTANGULAR; Maximum Seated Height: 1.05 mm;

MRAM

INDUSTRIAL

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE

SOLCC8,.25

SRAMs

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3.6 V

1.05 mm

5 mm

Not Qualified

4194304 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

6 mm

MR4A16BCYS35 by Everspin Technologies

MR4A16BCYS35

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;

MRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

1048576 words

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

SRAMs

20

.8 mm

85 Cel

1MX16

1M

3 V

-40 Cel

TIN

DUAL

R-PDSO-G54

3

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

16777216 bit

3 V

e3

260

.009 Amp

22.22 mm

35 ns

MR25H40CDC by Everspin Technologies

MR25H40CDC

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;

MRAM

INDUSTRIAL

8

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE

SOLCC8,.25

SRAMs

1.27 mm

85 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3

3.6 V

1.05 mm

5 mm

Not Qualified

4194304 bit

3 V

6 mm

MR2A16AYS35R by Freescale Semiconductor

MR2A16AYS35R

Freescale Semiconductor

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

155 mA

262144 words

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

20

.8 mm

70 Cel

256KX16

256K

3 V

0 Cel

MATTE TIN

DUAL

R-PDSO-G44

3

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

4194304 bit

3 V

e3

40

260

.012 Amp

18.41 mm

35 ns

MR25H40VDF by Everspin Technologies

MR25H40VDF

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Memory Width: 8;

MRAM

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SYNCHRONOUS

524288 words

3.3

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

SRAMs

1.27 mm

105 Cel

512KX8

512K

-40 Cel

DUAL

R-PDSO-N8

3

3.6 V

.9 mm

5 mm

Not Qualified

4194304 bit

3 V

6 mm

M3032316045NX0IBCY by Renesas Electronics

M3032316045NX0IBCY

Renesas Electronics

MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER; Maximum Standby Current: .007 Amp;

MRAM

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

30 mA

2097152 words

3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA48,6X8,30

10

.75 mm

85 Cel

2MX16

2M

2.7 V

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B48

3

3.6 V

1.35 mm

100000000000000 Write/Erase Cycles

10 mm

33554432 bit

2.7 V

e1

260

.007 Amp

10 mm

45 ns

MR4A08BCYS35R by Everspin Technologies

MR4A08BCYS35R

Everspin Technologies

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Standby Voltage: 3 V;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

20

.8 mm

85 Cel

2MX8

2M

3 V

-40 Cel

DUAL

R-PDSO-G44

3

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

16777216 bit

3 V

40

260

.009 Amp

18.41 mm

35 ns

MR5A16AUMA45R by Everspin Technologies

MR5A16AUMA45R

Everspin Technologies

MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; No. of Words Code: 2M; Terminal Position: BOTTOM;

MRAM

48

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

16

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA48,6X8,30

20

.75 mm

125 Cel

2MX16

2M

3 V

-40 Cel

BOTTOM

S-PBGA-B48

3.6 V

1.35 mm

10 mm

.000045 ms

33554432 bit

3 V

.018 Amp

10 mm

45 ns

MR4A08BYS35 by Everspin Technologies

MR4A08BYS35

Everspin Technologies

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Width: 8;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

20

.8 mm

70 Cel

2MX8

2M

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

16777216 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.009 Amp

18.41 mm

35 ns

MR4A08BYS35R by Everspin Technologies

MR4A08BYS35R

Everspin Technologies

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

20

.8 mm

70 Cel

2MX8

2M

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

16777216 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.009 Amp

18.41 mm

35 ns

MR5A16ACYS35R by Everspin Technologies

MR5A16ACYS35R

Everspin Technologies

MRAM; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; Maximum Operating Temperature: 85 Cel;

MRAM

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

20

.8 mm

85 Cel

2MX16

2M

3 V

-40 Cel

DUAL

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

.000035 ms

33554432 bit

3 V

.018 Amp

22.22 mm

35 ns

MR0A16ACYS35R by Freescale Semiconductor

MR0A16ACYS35R

Freescale Semiconductor

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

165 mA

65536 words

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

20

.8 mm

85 Cel

64KX16

64K

3 V

-40 Cel

MATTE TIN

DUAL

R-PDSO-G44

3

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

1048576 bit

3 V

e3

40

260

.012 Amp

18.41 mm

35 ns

MR4A16BUYS45 by Everspin Technologies

MR4A16BUYS45

Everspin Technologies

MRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Standby Current: .009 Amp;

MRAM

AUTOMOTIVE

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

1048576 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

20

.8 mm

125 Cel

1MX16

1M

3 V

-40 Cel

DUAL

R-PDSO-G54

3

3.6 V

1.2 mm

10.16 mm

.000045 ms

16777216 bit

3 V

.009 Amp

22.22 mm

45 ns

MR5A16ACYS35 by Everspin Technologies

MR5A16ACYS35

Everspin Technologies

MRAM; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; Organization: 2MX16;

MRAM

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

180 mA

2097152 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

20

.8 mm

85 Cel

2MX16

2M

3 V

-40 Cel

DUAL

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

.000035 ms

33554432 bit

3 V

.018 Amp

22.22 mm

35 ns

EM064LXQADG13CS1R by Everspin Technologies

EM064LXQADG13CS1R

Everspin Technologies

STT MRAM;

STT MRAM

EM064LXQADG13CS1T by Everspin Technologies

EM064LXQADG13CS1T

Everspin Technologies

STT MRAM;

STT MRAM

MR2S16ATS35C by NXP Semiconductors

MR2S16ATS35C

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

256KX16

256K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

4194304 bit

3 V

.012 Amp

18.41 mm

35 ns

MR1A08ACYS35 by NXP Semiconductors

MR1A08ACYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Qualification: Not Qualified;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

165 mA

262144 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

85 Cel

256KX8

256K

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

2097152 bit

3 V

.012 Amp

18.41 mm

35 ns

MR0S8AYS35 by NXP Semiconductors

MR0S8AYS35

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Width: 8;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

131072 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

128KX8

128K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

1048576 bit

3 V

.012 Amp

18.41 mm

35 ns

MR0A16ATS35C by NXP Semiconductors

MR0A16ATS35C

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

155 mA

65536 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

64KX16

64K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

1048576 bit

3 V

.012 Amp

18.41 mm

35 ns

MR0A8ACYS35 by NXP Semiconductors

MR0A8ACYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 128KX8;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

165 mA

131072 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

85 Cel

128KX8

128K

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

1048576 bit

3 V

.012 Amp

18.41 mm

35 ns

MR1A8AYS35 by NXP Semiconductors

MR1A8AYS35

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

155 mA

262144 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

256KX8

256K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

2097152 bit

3 V

.012 Amp

18.41 mm

35 ns

MR0S16ATS35C by NXP Semiconductors

MR0S16ATS35C

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

65536 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

64KX16

64K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

1048576 bit

3 V

.012 Amp

18.41 mm

35 ns

MR4S08ACYS35 by NXP Semiconductors

MR4S08ACYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Organization: 2MX8;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

165 mA

2097152 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

85 Cel

2MX8

2M

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

16777216 bit

3 V

.012 Amp

18.41 mm

35 ns

MR1S16AYS35 by NXP Semiconductors

MR1S16AYS35

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

131072 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

128KX16

128K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

2097152 bit

3 V

.012 Amp

18.41 mm

35 ns

MR0S08ATS35C by NXP Semiconductors

MR0S08ATS35C

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

131072 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

128KX8

128K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

1048576 bit

3 V

.012 Amp

18.41 mm

35 ns

MR1S08AVYS35 by NXP Semiconductors

MR1S08AVYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Qualification: Not Qualified;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

165 mA

262144 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

105 Cel

256KX8

256K

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

2097152 bit

3 V

.012 Amp

18.41 mm

35 ns

MR4S08AYS35 by NXP Semiconductors

MR4S08AYS35

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Length: 18.41 mm;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

2097152 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

2MX8

2M

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

16777216 bit

3 V

.012 Amp

18.41 mm

35 ns

MR4S08ATS35C by NXP Semiconductors

MR4S08ATS35C

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

2097152 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

2MX8

2M

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

16777216 bit

3 V

.012 Amp

18.41 mm

35 ns

MR2S8ACYS35 by NXP Semiconductors

MR2S8ACYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

165 mA

524288 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

85 Cel

512KX8

512K

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

4194304 bit

3 V

.012 Amp

18.41 mm

35 ns

MR1S16ATS35C by NXP Semiconductors

MR1S16ATS35C

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

131072 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

128KX16

128K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

2097152 bit

3 V

.012 Amp

18.41 mm

35 ns

MR0A08AYS35 by NXP Semiconductors

MR0A08AYS35

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

155 mA

131072 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

128KX8

128K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

1048576 bit

3 V

.012 Amp

18.41 mm

35 ns

MR1A08AYS35 by NXP Semiconductors

MR1A08AYS35

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Standby Voltage: 3 V;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

155 mA

262144 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

256KX8

256K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

2097152 bit

3 V

.012 Amp

18.41 mm

35 ns

MR2S08ATS35C by NXP Semiconductors

MR2S08ATS35C

NXP Semiconductors

MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL;

MRAM

COMMERCIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

155 mA

524288 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

70 Cel

512KX8

512K

3 V

0 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

4194304 bit

3 V

.012 Amp

18.41 mm

35 ns

MR2S16ACYS35 by NXP Semiconductors

MR2S16ACYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

165 mA

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

85 Cel

256KX16

256K

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

4194304 bit

3 V

.012 Amp

18.41 mm

35 ns

MR0S16ACYS35 by NXP Semiconductors

MR0S16ACYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

165 mA

65536 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

85 Cel

64KX16

64K

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.000035 ms

1048576 bit

3 V

.012 Amp

18.41 mm

35 ns

MR2S08AVYS35 by NXP Semiconductors

MR2S08AVYS35

NXP Semiconductors

MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Standby Current: .012 Amp;

MRAM

INDUSTRIAL

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

165 mA

524288 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

20

.8 mm

105 Cel

512KX8

512K

3 V

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

.035 ms

4194304 bit

3 V

.012 Amp

18.41 mm

35 ns