Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; No. of Words: 262144 words; Moisture Sensitivity Level (MSL): 3;
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MRAMs M3004316035NX0ITAR attributes and parameters. Explore more MRAMs devices from Renesas Electronics
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M3004316035NX0ITAR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Obsolescence/ EOL - Mult DEV EOL 01/Dec/2023 Retraction of PLC230011-A1
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
PIC18F4550-I/PT
Microchip Technology
PIC18F4550-I/PT by Microchip: 8-bit microcontroller with 44 terminals, 48 MHz clock frequency, and USB connectivity. Ideal for industrial applications requiring low power mode and 10-bit ADC channels.
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
Weitron Technology
Synsemi
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
BAV99
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
STM8S003F3P6TR
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
Transys Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMMBT2222ALT1G
Onsemi
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
M3004316045NX0ITAY
Renesas Electronics
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit; JESD-609 Code: e3;
MR2S8AYS35
NXP Semiconductors
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Data Retention Time: 20;
M3016316035NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Memory Density: 16777216 bit; Surface Mount: YES;
MR4A08BCYS35R
Everspin Technologies
Everspin Technologies' MR4A08BCYS35R is a 2MX8 MRAM with 3.3V supply, operating at -40 to 85 °C. It features a small outline package, parallel interface, and 35ns access time. Ideal for industrial applications requiring fast non-volatile memory with high endurance and low power consumption.
M3004316045NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.7 V; No. of Words Code: 256K;
MR25H40MDFR
MR25H40MDFR by Everspin Technologies is a 512Kx8 MRAM with 3.3V supply, operating at -40 to 125 °C. It features synchronous operation, small outline package, and AEC-Q100 screening level. Ideal for automotive applications requiring fast and reliable non-volatile memory solutions.
MR4S8AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; No. of Words: 2097152 words;
M3016316035NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Parallel or Serial: PARALLEL; Nominal Supply Voltage / Vsup (V): 3;
M3004316045NX0PTAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Peak Reflow Temperature (C): 260;
MR4S16AVYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;
M3004316035NX0PTAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Terminal Pitch: .8 mm; Technology: CMOS;
M3004316045NX0IBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Organization: 256KX16; Minimum Data Retention Time: 10;
MR4S08ATS35C
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 35 ns;
M3004316035NX0ITBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Density: 4194304 bit; Minimum Standby Voltage: 2.7 V;
MR1A8AYS35
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
MR4S16ATS35C
MR2S08ATS35C
MRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MR25H40VDFR
MR25H40VDFR by Everspin Technologies is a 512Kx8 MRAM with 3.3V supply, operating at -40 to 105 °C. It features synchronous mode, small outline package, and CMOS technology. Ideal for industrial applications requiring fast non-volatile memory with 4194304-bit density.
M3016316035NX0IBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS; No. of Functions: 1;
MR2S16AVYS35
MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
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M3004316045NX0PBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Terminal Form: BALL; No. of Words Code: 256K;
M3004316035NX0PTBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Terminal Form: GULL WING;
M3004316035NX0ITBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; No. of Words Code: 256K;
M3004316045NX0ITBR
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 10; Memory Width: 16;
M3004316045NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; No. of Words Code: 256K; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
M3004316035NX0PTAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2.7 V; No. of Functions: 1;
M3004316035NX0IBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
M3004316035NX0PTBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; Memory Width: 16; Terminal Position: DUAL;
M3004316035NX0PBCY
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Technology: CMOS; Endurance: 100000000000000 Write/Erase Cycles;
M3004316045NX0ITBY
MRAM; No. of Terminals: 54; Package Code: TSOP; Package Shape: RECTANGULAR; No. of Words: 262144 words; Package Equivalence Code: TSOP54,.46,32;
M3004316035NX0ITAY
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Memory Density: 4194304 bit;
M3004316035NX0IBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Maximum Supply Voltage (Vsup): 3.6 V; Package Equivalence Code: BGA48,6X8,30;
M3004316035NX0PBCR
MRAM; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Memory Density: 4194304 bit; Maximum Operating Temperature: 105 Cel;
M3004316045NX0ITAR
MRAM; No. of Terminals: 44; Package Code: TSOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3; Terminal Finish: TIN;
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