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Analog Data Transmission Interfaces

Analog data transmission interfaces are used to transmit analog signals between electronic devices. They are commonly used in a variety of applications, such as audio and video equipment, medical devices, and industrial control systems.

Analog data transmission interfaces typically consist of a transmitter and a receiver. The transmitter converts the analog signal into a form that can be transmitted over a communication channel, such as a wire or radio frequency signal. The receiver then converts the transmitted signal back into its original analog form.

Some common types of analog data transmission interfaces include:

1. Analog audio interfaces: These are used to transmit audio signals between electronic devices, such as microphones, amplifiers, and speakers. Examples include XLR, RCA, and TRS connectors.

2. Composite video interfaces: These are used to transmit analog video signals, such as those used in standard definition television. Examples include RCA and BNC connectors.

3. VGA interfaces: These are used to transmit analog video signals from computers and other devices to displays, such as computer monitors and projectors.

4. Analog sensor interfaces: These are used to transmit analog signals from sensors, such as temperature sensors or pressure sensors, to electronic devices that can process and analyze the data.

Analog data transmission interfaces offer several advantages over digital interfaces. They are often simpler and less expensive to implement, and they can provide high-quality audio and video signals without the need for compression or conversion. However, they can also be susceptible to interference and noise, and their performance may be limited by the quality of the transmission channel.

Analog Data Transmission Interfaces

Available Parts 563

Part RoHS Manufacturer Description Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions No. of Channels Technology Nominal Negative Supply Voltage Maximum Supply Current Nominal Supply Voltage Hybrid Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Maximum Noise Battery Supply (V) Minimum Operating Temperature Terminal Finish Terminal Position Data Rate JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Minimum Power Supply Rejection Ratio (PSRR) Additional Features Battery Feed JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length
MC3419-1L by Motorola

MC3419-1L

Motorola

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

BIPOLAR

-48 V

.2 mA

2-4 CONVERSION

-48

IN-LINE

DIP18,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

10 dBrnC

-48

0 Cel

TIN LEAD

DUAL

R-GDIP-T18

5.08 mm

7.62 mm

Not Qualified

CONSTANT CURRENT

e0

22.73 mm

MC3419C1L by Motorola

MC3419C1L

Motorola

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

-48 V

2-4 CONVERSION

-48

IN-LINE

DIP18,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

-48

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T18

Not Qualified

CONSTANT CURRENT

e0

MC3419L by Motorola

MC3419L

Motorola

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

2-4 CONVERSION

IN-LINE

DIP18,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T18

Not Qualified

RESISTIVE

e0

MC3419CL by Motorola

MC3419CL

Motorola

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

2-4 CONVERSION

IN-LINE

DIP18,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T18

Not Qualified

RESISTIVE

e0

LMH0344SQE/NOPB by Texas Instruments

LMH0344SQE/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.1 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

MC3419A1L by Motorola

MC3419A1L

Motorola

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

-48 V

2-4 CONVERSION

-48

IN-LINE

DIP18,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

-48

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T18

Not Qualified

CONSTANT CURRENT

e0

MC3419P by Motorola

MC3419P

Motorola

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

BIPOLAR

2-4 CONVERSION

IN-LINE

DIP18,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-PDIP-T18

Not Qualified

RESISTIVE

e0

MC3419AL by Motorola

MC3419AL

Motorola

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL

THROUGH-HOLE

18

DIP

RECTANGULAR

CERAMIC

NO

BIPOLAR

2-4 CONVERSION

IN-LINE

DIP18,.3

Analog Transmission Interfaces

2.54 mm

70 Cel

0 Cel

Tin/Lead (Sn/Pb)

DUAL

R-XDIP-T18

Not Qualified

RESISTIVE

e0

EQCO125X40C1-I/8EX by Microchip Technology

EQCO125X40C1-I/8EX

Microchip Technology

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.25 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

1

.95 mm

4 mm

e4

30

260

4 mm

LMH0384SQE/NOPB by Texas Instruments

LMH0384SQE/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.11 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

LMH0344SQ/NOPB by Texas Instruments

LMH0344SQ/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.1 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N20

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

SN65LVCP1412RLHR by Texas Instruments

SN65LVCP1412RLHR

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: RECTANGULAR;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

24

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2

2.5 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16X.2,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N24

2

.8 mm

4 mm

Not Qualified

e4

30

260

5 mm

LMH0384SQ/NOPB by Texas Instruments

LMH0384SQ/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.11 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

LMH0384SQX/NOPB by Texas Instruments

LMH0384SQX/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.11 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

LMH0344SQX/NOPB by Texas Instruments

LMH0344SQX/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.1 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

DS15EA101SQE/NOPB by Texas Instruments

DS15EA101SQE/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.077 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

LE88286DLC by Microchip Technology

LE88286DLC

Microchip Technology

SLIC; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HLQFP; Package Shape: SQUARE; Nominal Supply Voltage: 3.3 V;

SLIC

GULL WING

80

HLQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

2-4 CONVERSION

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

.65 mm

85 Cel

19 dBrnC

-40 Cel

QUAD

S-PQFP-G80

1.6 mm

14 mm

40 dB

14 mm

LMH0074SQE/NOPB by Texas Instruments

LMH0074SQE/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.077 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

540 Mbps

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

SN65LVCP1412RLHT by Texas Instruments

SN65LVCP1412RLHT

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: RECTANGULAR;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

24

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

1

2

2.5 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16X.2,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N24

2

.8 mm

4 mm

Not Qualified

e4

30

260

5 mm

LMH0044SQ by Texas Instruments

LMH0044SQ

Texas Instruments

LINE EQUALIZER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

OTHER

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.077 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

0 Cel

TIN LEAD

QUAD

S-PQCC-N16

1

.8 mm

4 mm

Not Qualified

e0

260

4 mm

HC5549CMZ by Renesas Electronics

HC5549CMZ

Renesas Electronics

SLIC; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Terminal Finish: MATTE TIN;

SLIC

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

8 mA

5 V

2-4 CONVERSION

CHIP CARRIER

LDCC28,.5SQ

1.27 mm

75 Cel

19 dBrnC

-24 TO -48

0 Cel

MATTE TIN

QUAD

S-PQCC-J28

3

4.57 mm

11.505 mm

CONSTANT CURRENT/RESISTIVE

e3

30

245

11.505 mm

PEB4266TV12SLL62 by Intel

PEB4266TV12SLL62

Intel

SLIC; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Terminal Position: UNSPECIFIED; Package Body Material: UNSPECIFIED; No. of Functions: 1;

SLIC

UNSPECIFIED

UNSPECIFIED

UNSPECIFIED

1

UNSPECIFIED

SI3210M-GT by Silicon Labs

SI3210M-GT

Silicon Labs

SLIC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

SLIC

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Analog Transmission Interfaces

.5 mm

85 Cel

15 dBrnC

-96 TO -10

-40 Cel

DUAL

R-PDSO-G38

1.2 mm

4.4 mm

Not Qualified

40 dB

CONSTANT CURRENT

40

260

9.7 mm

SI3210M-GTR by Silicon Labs

SI3210M-GTR

Silicon Labs

SLIC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR;

SLIC

INDUSTRIAL

GULL WING

38

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP38,.25,20

Analog Transmission Interfaces

.5 mm

85 Cel

15 dBrnC

-96 TO -10

-40 Cel

Matte Tin (Sn)

DUAL

R-PDSO-G38

3

1.2 mm

4.4 mm

Not Qualified

40 dB

CONSTANT CURRENT

e3

40

260

9.7 mm

SI32185-A-FMR by Silicon Labs

SI32185-A-FMR

Silicon Labs

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE;

SLIC

COMMERCIAL

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

70 Cel

0 Cel

QUAD

S-XQCC-N40

NOT SPECIFIED

NOT SPECIFIED

SI32391-B-GMR by Silicon Labs

SI32391-B-GMR

Silicon Labs

Analog Transmission Interfaces; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2;

2

40

260

HC55143IM by Renesas Electronics

HC55143IM

Renesas Electronics

SLIC; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR;

SLIC

INDUSTRIAL

J BEND

32

QCCJ

RECTANGULAR

PLASTIC/EPOXY

YES

1

.003 mA

5 V

2-4 CONVERSION

5

CHIP CARRIER

LDCC32,.5X.6

Analog Transmission Interfaces

1.27 mm

85 Cel

13 dBrnC

-24 AND -48

-40 Cel

TIN LEAD

QUAD

R-PQCC-J32

1

3.55 mm

11.43 mm

Not Qualified

CONSTANT CURRENT/RESISTIVE

e0

13.97 mm

SI32391-B-FMR by Silicon Labs

SI32391-B-FMR

Silicon Labs

Analog Transmission Interfaces; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 40;

2

40

260

LE88286DLCT by Microchip Technology

LE88286DLCT

Microchip Technology

SLIC; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: HLQFP; Package Shape: SQUARE; Surface Mount: YES;

SLIC

GULL WING

80

HLQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

2-4 CONVERSION

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

.65 mm

85 Cel

19 dBrnC

-40 Cel

QUAD

S-PQFP-G80

1.6 mm

14 mm

40 dB

14 mm

SI32192-A-GM1 by Silicon Labs

SI32192-A-GM1

Silicon Labs

SLIC; Terminal Form: NO LEAD; No. of Terminals: 38; Package Code: HVQCCN; Package Shape: RECTANGULAR; Length: 6 mm;

SLIC

NO LEAD

38

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC38,.16X.24,16

.4 mm

85 Cel

14 dBrnC

-100 TO -15

-40 Cel

QUAD

R-XQCC-N38

.9 mm

4 mm

CONSTANT CURRENT/RESISTIVE

6 mm

SI32192-A-GM1R by Silicon Labs

SI32192-A-GM1R

Silicon Labs

SLIC; Terminal Form: NO LEAD; No. of Terminals: 38; Package Code: HVQCCN; Package Shape: RECTANGULAR; Battery Feed: CONSTANT CURRENT/RESISTIVE;

SLIC

NO LEAD

38

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC38,.16X.24,16

.4 mm

85 Cel

14 dBrnC

-100 TO -15

-40 Cel

QUAD

R-XQCC-N38

.9 mm

4 mm

CONSTANT CURRENT/RESISTIVE

6 mm

LMH0044SQE/NOPB by Texas Instruments

LMH0044SQE/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

OTHER

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.077 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

0 Cel

MATTE TIN

QUAD

1485 Mbps

S-XQCC-N16

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

LMH0395SQE/NOPB by Texas Instruments

LMH0395SQE/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.078 mA

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N24

1

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

GS12190-INE3 by Semtech

GS12190-INE3

Semtech

LINE EQUALIZER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: RECTANGULAR; JESD-30 Code: R-XQCC-N40;

LINE EQUALIZER

NO LEAD

40

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

164 mA

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.16X.24,16

.4 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

R-XQCC-N40

3

1 mm

4 mm

e4

40

260

6 mm

HPA02292SQ/NOPB by Texas Instruments

HPA02292SQ/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.1 mA

3.3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

1

.8 mm

4 mm

e3

30

260

4 mm

LCP22-150B1RL by STMicroelectronics

LCP22-150B1RL

STMicroelectronics

SLIC; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.3 mm;

SLIC

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

SMALL OUTLINE

SOP8,.3

1.27 mm

125 Cel

-120 TO 120

-55 Cel

DUAL

R-PDSO-G8

1

2.1 mm

5.24 mm

Hybrid fiber coax (HFC) AVAILABLE

CONSTANT CURRENT/RESISTIVE

5.3 mm

LE79555-2BVC by Microsemi

LE79555-2BVC

Microsemi

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: TQFP; Package Shape: SQUARE;

SLIC

COMMERCIAL

GULL WING

44

TQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

5 V

FLATPACK, THIN PROFILE

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

1.2 mm

10 mm

Not Qualified

10 mm

SN75LVCP600SDSKR by Texas Instruments

SN75LVCP600SDSKR

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: HVSON; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

1

45 mA

3.3 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N10

2

.8 mm

2.5 mm

e4

30

260

2.5 mm

DS15EA101SQX/NOPB by Texas Instruments

DS15EA101SQX/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

.077 mA

3.3 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

LMH0034MA/NOPB by Texas Instruments

LMH0034MA/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

LINE EQUALIZER

OTHER

GULL WING

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.077 mA

3.3 V

3.3

SMALL OUTLINE

SOP16,.25

Other Telecom ICs

1.27 mm

85 Cel

0 Cel

MATTE TIN

DUAL

1485 Mbps

R-PDSO-G16

1

1.753 mm

3.9 mm

Not Qualified

e3

30

260

9.902 mm

LMH0394SQE/NOPB by Texas Instruments

LMH0394SQE/NOPB

Texas Instruments

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.065 mA

2.5 V

2.5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

2970 Mbps

S-XQCC-N16

3

.8 mm

4 mm

Not Qualified

e3

30

260

4 mm

HC55185AIM by Intersil

HC55185AIM

Intersil

SLIC; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

SLIC

INDUSTRIAL

J BEND

28

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BIPOLAR

.0135 mA

5 V

2-4 CONVERSION

5

CHIP CARRIER

LDCC28,.5SQ

Analog Transmission Interfaces

1.27 mm

85 Cel

13 dBrnC

+100

-40 Cel

TIN LEAD

QUAD

S-PQCC-J28

1

4.57 mm

11.505 mm

Not Qualified

45 dB

CONSTANT CURRENT

e0

11.505 mm

EQCO125T40C1-I/8EX by Microchip Technology

EQCO125T40C1-I/8EX

Microchip Technology

LINE EQUALIZER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;

LINE EQUALIZER

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1.25 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

1

.95 mm

4 mm

e4

30

260

4 mm

SI3220-FQ by Silicon Labs

SI3220-FQ

Silicon Labs

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE;

SLIC

COMMERCIAL

GULL WING

64

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3.3 V

3.3/5

FLATPACK, THIN PROFILE, FINE PITCH

TQFP64,.47SQ

Analog Transmission Interfaces

.5 mm

70 Cel

15 dBrnC

-15 TO -99

0 Cel

QUAD

S-PQFP-G64

1.2 mm

10 mm

Not Qualified

40 dB

CONSTANT CURRENT

NOT SPECIFIED

NOT SPECIFIED

10 mm

SI32185-A-FM by Silicon Labs

SI32185-A-FM

Silicon Labs

SLIC; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: QCCN; Package Shape: SQUARE;

SLIC

COMMERCIAL

NO LEAD

40

QCCN

SQUARE

UNSPECIFIED

YES

1

3.3 V

CHIP CARRIER

70 Cel

0 Cel

QUAD

S-XQCC-N40

NOT SPECIFIED

NOT SPECIFIED

SI32176-B-FM1 by Silicon Labs

SI32176-B-FM1

Silicon Labs

SLIC; Terminal Form: NO LEAD; No. of Terminals: 42; Package Code: HLGA; Package Shape: RECTANGULAR; No. of Functions: 1;

SLIC

NO LEAD

42

HLGA

RECTANGULAR

UNSPECIFIED

YES

1

3.3 V

2-4 CONVERSION

GRID ARRAY, HEAT SINK/SLUG

LCC42,.27X.2,20

.5 mm

70 Cel

12 dBrnC

-15 TO -110

0 Cel

BOTTOM

R-XLGA-N42

.9 mm

5 mm

CONSTANT CURRENT/RESISTIVE

7 mm

SI32178-B-FM1 by Silicon Labs

SI32178-B-FM1

Silicon Labs

SLIC;

SLIC

HC3-5504B-5 by Intersil

HC3-5504B-5

Intersil

SLIC; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR;

SLIC

COMMERCIAL EXTENDED

THROUGH-HOLE

24

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

BIPOLAR

.006 mA

5 V

2-4 CONVERSION

5/12

IN-LINE

DIP24,.6

Analog Transmission Interfaces

2.54 mm

75 Cel

5 dBrnC

-48

0 Cel

TIN LEAD

DUAL

R-PDIP-T24

6.35 mm

15.24 mm

Not Qualified

15 dB

CONSTANT CURRENT

e0

31 mm