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DS100DF410SQE/NOPB

Texas Instruments

DS100DF410SQE/NOPB by Texas Instruments

DS100DF410SQE/NOPB by Texas Instruments is a 4-channel line equalizer with CMOS technology. It operates at 2.5V, has a temp range of -40 to 85°C, and comes in a square chip carrier package. Ideal for analog data transmission interfaces in industrial applications.

Median Price

$30.520

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 103,750 parts In-Stock

1+ parts

$22.038

100+ parts

$19.250

1k+ parts

$13.276

10k+ parts

-

103,750

$22.038

$19.250

$13.276

-

DigiKey

USA . 273 parts In-Stock

1+ parts

$30.520

100+ parts

$21.622

1k+ parts

$20.858

10k+ parts

-

273

$30.520

$21.622

$20.858

-

Mouser Electronics

USA . 165 parts In-Stock

1+ parts

$30.520

100+ parts

$21.630

1k+ parts

$20.850

10k+ parts

-

165

$30.520

$21.630

$20.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 178 parts In-Stock

1+ parts

$16.800

100+ parts

$14.861

1k+ parts

$14.216

10k+ parts

-

178

$16.800

$14.861

$14.216

-

Digiode

USA . 3,213 parts In-Stock

1+ parts

$20.936

100+ parts

-

1k+ parts

-

10k+ parts

-

3,213

$20.936

-

-

-

Vyrian

USA . 8,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,920

-

-

-

-

Chip Stock

USA . 4,290 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,290

-

-

-

-

Odintec Ltd.

Israel . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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500

-

-

-

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Microfarads

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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172

-

-

-

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Sensible Micro Corp

USA . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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120

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 110 parts In-Stock

1+ parts

$6.430

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$6.430

-

-

-

Parana Technologies

USA . 1,654 parts In-Stock

1+ parts

$6.441

100+ parts

-

1k+ parts

$7.186

10k+ parts

-

1,654

$6.441

-

$7.186

-

DigiPath Technology Company

USA . 1,230 parts In-Stock

1+ parts

$7.092

100+ parts

-

1k+ parts

-

10k+ parts

-

1,230

$7.092

-

-

-

ChromeModa Solutions

Germany . 1,620 parts In-Stock

1+ parts

$7.237

100+ parts

$5.934

1k+ parts

-

10k+ parts

-

1,620

$7.237

$5.934

-

-

IDEA Electronic Components Group

UK . 538 parts In-Stock

1+ parts

$7.237

100+ parts

-

1k+ parts

$6.513

10k+ parts

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538

$7.237

-

$6.513

-

Corphita

USA . 3,830 parts In-Stock

1+ parts

$19.834

100+ parts

-

1k+ parts

-

10k+ parts

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3,830

$19.834

-

-

-

iodParts Technologies Inc.

India . 12,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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12,000

-

-

-

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Lixinc

USA . 6,411 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,411

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-

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Speed Components Ltd (Excess)

Israel . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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552

-

-

-

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Northwest PG Solutions

USA . 472 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.301

10k+ parts

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472

-

-

$6.301

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ChipstoGo Electronic ltd

UK . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6

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Overview

Enhance your analog data transmission interfaces with the DS100DF410SQE/NOPB by Texas Instruments. With a reputation for excellence, Texas Instruments delivers top-quality products that guarantee reliability and performance. This versatile chip carrier with a very thin profile is perfect for industrial applications, offering 4 channels of line equalization. Experience seamless communication and enhanced efficiency with this innovative solution. Upgrade your systems today with the DS100DF410SQE/NOPB and stay ahead of the competition.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes the product easier to install and enables compact design, saving space on the PCB.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and is ideal for applications where a compact form factor is important.

Power Supplies (V): 2.5

Operating at 2.5V makes the product energy-efficient and suitable for low-power applications.

No. of Terminals: 48

Having a high number of terminals provides flexibility for connecting multiple channels and components, enhancing the product's versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of different package styles offers various mounting options, thermal management, and space-saving benefits for different application requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in harsh environments without risk of overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold conditions, expanding its usability range.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for reliable connections, contributing to the product's overall durability.

Terminal Position: QUAD

Quad terminal position offers a balanced layout for ease of routing signals and connections, enhancing signal integrity and reducing interference.

Maximum Seated Height: 0.8 mm

Low maximum seated height allows for a slim profile and compact design, making the product suitable for space-constrained applications.

Width: 7 mm

The moderate width provides a good balance between size and functionality, allowing for easy integration into various system configurations.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature reduces the risk of component damage during assembly, ensuring reliable performance during the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures the product can withstand the soldering process without degradation, ensuring long-term reliability.

Length: 7 mm

The length of 7mm offers a compact form factor, making the product suitable for applications where space is limited.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product can operate reliably in a wide range of temperature environments, making it suitable for industrial applications.

No. of Channels: 4

Having 4 channels allows for versatile signal processing capabilities and is ideal for applications requiring multiple data transmission channels.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast response times, making the product efficient and reliable.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with regulations, making the product a sustainable and safe choice.

Telecom IC Type: LINE EQUALIZER

Line equalizer telecom IC type ensures signal integrity and quality over long transmission distances, making the product suitable for telecom applications.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V makes the product compatible with standard power sources, enhancing its ease of integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables high-density packaging and precise signal routing, making the product suitable for applications with space constraints.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate sensitivity to moisture during storage or soldering, requiring standard handling procedures to ensure reliability.

Technical Specifications

Analog Data Transmission Interfaces DS100DF410SQE/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

ATM/SONET/SDH ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DS100DF410SQE/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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