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FRAMs

Ferroelectric Random-Access Memories (or FRAMs), are a type of non-volatile memory technology that combines the advantages of both traditional dynamic random-access memory (DRAM) and non-volatile memory (NVRAM) technologies. FRAMs store data using a ferroelectric material, which has the unique property of being able to retain data even when the power is removed.

FRAMs are used in a variety of fields, including industrial automation, automotive systems, smart meters, and more, where their combination of non-volatility, speed, and endurance can be advantageous. While they may not be as prevalent as other memory types like Flash or DRAM, FRAMs offer a unique set of features that make them suitable for specific use cases.

Here are some key features and characteristics of FRAMs:

Non-Volatile: FRAMs are non-volatile, meaning they can retain data even when the power supply is turned off. This is in contrast to traditional DRAM, which is volatile and loses data when power is removed.

Fast Write Speeds: FRAMs offer very fast write speeds, comparable to DRAM. This makes them suitable for applications where high-speed write operations are required.

Low Power Consumption: FRAMs typically consume less power than other non-volatile memory technologies like Flash memory. This makes them suitable for battery-powered devices and applications where power efficiency is critical.

High Endurance: FRAMs have a high endurance, meaning they can withstand a large number of write cycles without degrading. This is in contrast to some Flash memory technologies that have limited write endurance.

Bit-Addressable: FRAMs are bit-addressable, which means you can read or write individual bits of data. This granularity is useful in applications where precise control over specific data is required.

Radiation Resistance: FRAMs are resistant to radiation, which makes them suitable for use in aerospace and other high-radiation environments.

Limited Density: One limitation of FRAM technology is that it has historically had lower storage density compared to other non-volatile memory technologies like Flash. However, advancements in FRAM technology have been made to increase storage capacity.

FRAMs

Available Parts 404

Part RoHS Manufacturer Description Memory IC Type No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time
FM25CL64B-GTR by Infineon Technologies

FM25CL64B-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 8192 words; Nominal Supply Voltage / Vsup (V): 3.3;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

8KX8

8K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.8985 mm

Not Qualified

SPI

65536 bit

2.7 V

2kv ESD available

30

260

.000006 Amp

4.889 mm

FM24CL64B-GTR by Infineon Technologies

FM24CL64B-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 8192 words; Length: 4.889 mm;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.3 mA

8192 words

3.3

3/3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

8KX8

8K

2.7 V

-40 Cel

MATTE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

Not Qualified

I2C

65536 bit

2.7 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

e3

30

260

.000006 Amp

4.889 mm

FM25V10-GTR by Infineon Technologies

FM25V10-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Maximum Standby Current: .00015 Amp;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

131072 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

128KX8

128K

2.7 V

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

40 MHz

3.8985 mm

SPI

1048576 bit

2.7 V

ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 4KV ESD AVAILABLE

.00015 Amp

4.889 mm

FM24CL64B-G by Infineon Technologies

FM24CL64B-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; Minimum Data Retention Time: 10;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.3 mA

8192 words

3.3

3/3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

8KX8

8K

2.7 V

-40 Cel

MATTE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

Not Qualified

I2C

65536 bit

2.7 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

e3

30

260

.000006 Amp

4.889 mm

FM25W256-GTR by Infineon Technologies

FM25W256-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Package Equivalence Code: SOP8,.25;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2 mA

32768 words

3.3

3/5

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

32KX8

32K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

5.5 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.8985 mm

Not Qualified

SPI

262144 bit

2.7 V

4KV ESD AVAILABLE

30

260

.00003 Amp

4.889 mm

FM25CL64B-G by Infineon Technologies

FM25CL64B-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.65 V; Qualification: Not Qualified;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

8KX8

8K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.8985 mm

Not Qualified

SPI

65536 bit

2.7 V

2kv ESD available

30

260

.000006 Amp

4.889 mm

FM25L16B-GTR by Infineon Technologies

FM25L16B-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Serial Bus Type: SPI;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

2KX8

2K

2.7 V

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.8985 mm

SPI

16384 bit

2.7 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

.000006 Amp

4.889 mm

FM24W256-GTR by Infineon Technologies

FM24W256-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL; Terminal Pitch: 1.27 mm;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.4 mA

32768 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

32KX8

32K

2.7 V

-40 Cel

PURE TIN

DUAL

R-PDSO-G8

3

5.5 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

I2C

262144 bit

2.7 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

30

260

.00003 Amp

4.889 mm

FM25V02A-GTR by Infineon Technologies

FM25V02A-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.727 mm; Peak Reflow Temperature (C): 260;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2.5 mA

32768 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

32KX8

32K

2 V

-40 Cel

MATTE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

40 MHz

3.8985 mm

SPI

262144 bit

2 V

e3

30

260

.00015 Amp

4.889 mm

FM25V10-G by Infineon Technologies

FM25V10-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING; Memory Width: 8;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

131072 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

128KX8

128K

2.7 V

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

40 MHz

3.8985 mm

SPI

1048576 bit

2.7 V

ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 4KV ESD AVAILABLE

.00015 Amp

4.889 mm

FM24CL16B-GTR by Infineon Technologies

FM24CL16B-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .000006 Amp; Write Protection: HARDWARE;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.3 mA

2048 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

2KX8

2K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

I2C

16384 bit

2.7 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

30

260

.000006 Amp

4.889 mm

FM25W256-G by Infineon Technologies

FM25W256-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE; Technology: CMOS;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2 mA

32768 words

3.3

3/5

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

32KX8

32K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

5.5 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.8985 mm

Not Qualified

SPI

262144 bit

2.7 V

4KV ESD AVAILABLE

30

260

.00003 Amp

4.889 mm

FM24CL04B-GTR by Infineon Technologies

FM24CL04B-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Write Protection: HARDWARE; Maximum Standby Current: .000006 Amp;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.3 mA

512 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

512X8

512

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

Not Qualified

I2C

4096 bit

2.7 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

30

260

.000006 Amp

4.889 mm

FM25V05-GTR by Infineon Technologies

FM25V05-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.727 mm; Width: 3.8985 mm;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

65536 words

3.3

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

64KX8

64K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

40 MHz

3.8985 mm

Not Qualified

SPI

524288 bit

2.7 V

also operates with 2minv supply @ 25 mhz and 4kv esd availabe

30

260

.00015 Amp

4.889 mm

FM24W256-G by Infineon Technologies

FM24W256-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; No. of Words Code: 32K;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.4 mA

32768 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

32KX8

32K

2.7 V

-40 Cel

PURE TIN

DUAL

R-PDSO-G8

3

5.5 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

I2C

262144 bit

2.7 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

30

260

.00003 Amp

4.889 mm

FM28V100-TG by Infineon Technologies

FM28V100-TG

Infineon Technologies

FRAM; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Organization: 128KX8; Minimum Operating Temperature: -40 Cel;

FRAM

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

12 mA

131072 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.53,20

10

.5 mm

85 Cel

128KX8

128K

2 V

-40 Cel

PURE TIN

DUAL

R-PDSO-G32

3

3.6 V

1.2 mm

100000000000000 Write/Erase Cycles

8 mm

1048576 bit

2 V

2kv ESD available

260

.00015 Amp

11.8 mm

105 ns

FM24V10-GTR by Infineon Technologies

FM24V10-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Write Protection: HARDWARE;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1 mA

131072 words

3.3

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

128KX8

128K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

3.4 MHz

3.8985 mm

Not Qualified

I2C

1048576 bit

2 V

30

260

.00015 Amp

4.889 mm

FM28V100-TGTR by Infineon Technologies

FM28V100-TGTR

Infineon Technologies

FRAM; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Supply Current: 12 mA; Minimum Standby Voltage: 2 V;

FRAM

32

TSOP1

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

12 mA

131072 words

3.3

8

SMALL OUTLINE, THIN PROFILE

TSSOP32,.53,20

10

.5 mm

85 Cel

128KX8

128K

2 V

-40 Cel

PURE TIN

DUAL

R-PDSO-G32

3

3.6 V

1.2 mm

100000000000000 Write/Erase Cycles

8 mm

1048576 bit

2 V

2kv ESD available

.00015 Amp

11.8 mm

105 ns

FM25V02A-G by Infineon Technologies

FM25V02A-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Package Equivalence Code: SOP8,.25;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

2.5 mA

32768 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

32KX8

32K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

40 MHz

3.8985 mm

SPI

262144 bit

2 V

30

260

.00015 Amp

4.889 mm

FM25V20A-GTR by Infineon Technologies

FM25V20A-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 5.23 mm; Moisture Sensitivity Level (MSL): 3;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

262144 words

3.3

8

SMALL OUTLINE

SOP8,.3

10

1.27 mm

85 Cel

256KX8

256K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

100000000000000 Write/Erase Cycles

40 MHz

5.23 mm

SPI

2097152 bit

2.7 V

ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 2KV ESD AVAILABLE

260

.00025 Amp

5.28 mm

FM25V20A-G by Infineon Technologies

FM25V20A-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2.7 V; Maximum Clock Frequency (fCLK): 40 MHz;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

262144 words

3.3

8

SMALL OUTLINE

SOP8,.3

10

1.27 mm

85 Cel

256KX8

256K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

100000000000000 Write/Erase Cycles

40 MHz

5.23 mm

SPI

2097152 bit

2.7 V

ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 2KV ESD AVAILABLE

260

.00025 Amp

5.28 mm

FM25L16B-G by Infineon Technologies

FM25L16B-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2.7 V; No. of Functions: 1;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

2KX8

2K

2.7 V

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.8985 mm

SPI

16384 bit

2.7 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

.000006 Amp

4.889 mm

CY15B104Q-SXI by Infineon Technologies

CY15B104Q-SXI

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.28 mm; Nominal Supply Voltage / Vsup (V): 3.3;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

524288 words

3.3

8

SMALL OUTLINE

SOP8,.3

10

1.27 mm

85 Cel

512KX8

512K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

100000000000000 Write/Erase Cycles

40 MHz

5.23 mm

SPI

4194304 bit

2 V

2kv ESD available

260

.00025 Amp

5.28 mm

FM25V02A-DGQ by Infineon Technologies

FM25V02A-DGQ

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Endurance: 10000000000000 Write/Erase Cycles; No. of Words Code: 32K;

FRAM

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

5 mA

32768 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16,37

10

.95 mm

105 Cel

32KX8

32K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

3.6 V

.8 mm

10000000000000 Write/Erase Cycles

33 MHz

4 mm

SPI

262144 bit

2.7 V

2kv ESD available

30

260

.0005 Amp

4.5 mm

FM22L16-55-TGTR by Infineon Technologies

FM22L16-55-TGTR

Infineon Technologies

FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 512KX8; Maximum Supply Current: 12 mA;

FRAM

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

12 mA

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

10

.8 mm

85 Cel

256KX16

256K

2.7 V

-40 Cel

PURE TIN

DUAL

R-PDSO-G44

3

3.6 V

1.2 mm

100000000000000 Write/Erase Cycles

10.16 mm

4194304 bit

2.7 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 512KX8

30

260

.00027 Amp

18.41 mm

110 ns

FM25CL64B-GA by Cypress Semiconductor

FM25CL64B-GA

Cypress Semiconductor

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 65536 bit; No. of Words: 8192 words;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

11

1.27 mm

125 Cel

8KX8

8K

3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

10000000000000 Write/Erase Cycles

16 MHz

3.8985 mm

Not Qualified

SPI

65536 bit

3 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 4KV ESD AVAILABLE

e4

20

260

.000006 Amp

4.889 mm

CY15E004Q-SXET by Infineon Technologies

CY15E004Q-SXET

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Screening Level: AEC-Q100; Maximum Clock Frequency (fCLK): 16 MHz;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3.2 mA

512 words

5

8

SMALL OUTLINE

SOP8,.25

11

1.27 mm

125 Cel

512X8

512

4.5 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

5.5 V

1.727 mm

10000000000000 Write/Erase Cycles

16 MHz

3.8985 mm

SPI

4096 bit

4.5 V

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

260

.00003 Amp

4.889 mm

FM25V20A-DGQ by Infineon Technologies

FM25V20A-DGQ

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Minimum Data Retention Time: 11; Endurance: 100000000000000 Write/Erase Cycles;

FRAM

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

262144 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

11

1.27 mm

105 Cel

256KX8

256K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

3.6 V

.8 mm

100000000000000 Write/Erase Cycles

33 MHz

5 mm

SPI

2097152 bit

2 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

.00025 Amp

6 mm

FM25V02A-DGQTR by Infineon Technologies

FM25V02A-DGQTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Endurance: 10000000000000 Write/Erase Cycles; Minimum Data Retention Time: 10;

FRAM

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

5 mA

32768 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16,37

10

.95 mm

105 Cel

32KX8

32K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

3.6 V

.8 mm

10000000000000 Write/Erase Cycles

4 mm

SPI

262144 bit

2.7 V

2kv ESD available

30

260

.0005 Amp

4.5 mm

FM24CL64B-GA by Cypress Semiconductor

FM24CL64B-GA

Cypress Semiconductor

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3.3; Minimum Data Retention Time: 10;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

.34 mA

8192 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

125 Cel

8KX8

8K

3 V

-40 Cel

Tin (Sn)

DUAL

HARDWARE

R-PDSO-G8

3

3.6 V

1.727 mm

10000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

Not Qualified

I2C

65536 bit

3 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE; @85, 121 retention

e3

30

260

.00002 Amp

4.889 mm

FM25CL64B-GATR by Cypress Semiconductor

FM25CL64B-GATR

Cypress Semiconductor

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Minimum Data Retention Time: 11;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

8192 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

11

1.27 mm

125 Cel

8KX8

8K

3 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

10000000000000 Write/Erase Cycles

16 MHz

3.8985 mm

Not Qualified

SPI

65536 bit

3 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 4KV ESD AVAILABLE

e4

20

260

.000006 Amp

4.889 mm

FM24V10-G by Infineon Technologies

FM24V10-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Peak Reflow Temperature (C): 260;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

1 mA

131072 words

3.3

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

128KX8

128K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

3.4 MHz

3.8985 mm

Not Qualified

I2C

1048576 bit

2 V

30

260

.00015 Amp

4.889 mm

FM25V02A-DG by Infineon Technologies

FM25V02A-DG

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 40 MHz; Length: 4.5 mm;

FRAM

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2.5 mA

32768 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.2,25

10

.95 mm

85 Cel

32KX8

32K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-N8

3

3.6 V

.8 mm

100000000000000 Write/Erase Cycles

40 MHz

4 mm

SPI

262144 bit

2 V

30

260

.00015 Amp

4.5 mm

FM25V05-G by Infineon Technologies

FM25V05-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: PURE TIN; No. of Functions: 1;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

65536 words

3.3

2.5/3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

64KX8

64K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

40 MHz

3.8985 mm

Not Qualified

SPI

524288 bit

2.7 V

also operates with 2minv supply @ 25 mhz and 4kv esd availabe

30

260

.00015 Amp

4.889 mm

FM25V20A-DG by Infineon Technologies

FM25V20A-DG

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Write Protection: HARDWARE/SOFTWARE; Parallel or Serial: SERIAL;

FRAM

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

262144 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

10

1.27 mm

85 Cel

256KX8

256K

2.7 V

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

3

3.6 V

.8 mm

100000000000000 Write/Erase Cycles

40 MHz

5 mm

SPI

2097152 bit

2.7 V

ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 2KV ESD AVAILABLE

e3

30

260

.00025 Amp

6 mm

FM24C04B-GTR by Infineon Technologies

FM24C04B-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Maximum Clock Frequency (fCLK): 1 MHz;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

.4 mA

512 words

5

5

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

512X8

512

4.5 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-G8

3

5.5 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

Not Qualified

I2C

4096 bit

4.5 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

30

260

.00001 Amp

4.889 mm

FM25V02A-DGTR by Infineon Technologies

FM25V02A-DGTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; No. of Words: 32768 words;

FRAM

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

2.5 mA

32768 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.2,25

10

.95 mm

85 Cel

32KX8

32K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-N8

3

3.6 V

.8 mm

100000000000000 Write/Erase Cycles

40 MHz

4 mm

SPI

262144 bit

2 V

30

260

.00015 Amp

4.5 mm

FM25L04B-GTR by Infineon Technologies

FM25L04B-GTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Minimum Operating Temperature: -40 Cel;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

512 words

3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

512X8

512

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.9 mm

SPI

4096 bit

2.7 V

e3

30

260

.000006 Amp

4.889 mm

FM24CL64B-GATR by Cypress Semiconductor

FM24CL64B-GATR

Cypress Semiconductor

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 8192 words; Maximum Supply Current: .34 mA;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

.34 mA

8192 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

125 Cel

8KX8

8K

3 V

-40 Cel

Tin (Sn)

DUAL

HARDWARE

R-PDSO-G8

3

3.6 V

1.727 mm

10000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

Not Qualified

I2C

65536 bit

3 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE; @85, 121 retention

e3

30

260

.00002 Amp

4.889 mm

CY15B104Q-SXIT by Infineon Technologies

CY15B104Q-SXIT

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 512KX8; Maximum Seated Height: 2.03 mm;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

524288 words

3.3

8

SMALL OUTLINE

SOP8,.3

10

1.27 mm

85 Cel

512KX8

512K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

100000000000000 Write/Erase Cycles

40 MHz

5.23 mm

SPI

4194304 bit

2 V

2kv ESD available

260

.00025 Amp

5.28 mm

FM25V20A-DGQTR by Infineon Technologies

FM25V20A-DGQTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE; Minimum Standby Voltage: 2 V;

FRAM

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

262144 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

11

1.27 mm

105 Cel

256KX8

256K

2 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3

3.6 V

.8 mm

100000000000000 Write/Erase Cycles

33 MHz

5 mm

SPI

2097152 bit

2 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

.00025 Amp

6 mm

FM24CL04B-G by Infineon Technologies

FM24CL04B-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Terminal Position: DUAL;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.3 mA

512 words

3.3

3.3

8

SMALL OUTLINE

SOP8,.25

SRAMs

10

1.27 mm

85 Cel

512X8

512

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

Not Qualified

I2C

4096 bit

2.7 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

30

260

.000006 Amp

4.889 mm

FM25V20A-DGTR by Infineon Technologies

FM25V20A-DGTR

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Additional Features: ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 2KV ESD AVAILABLE;

FRAM

8

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

3 mA

262144 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

10

1.27 mm

85 Cel

256KX8

256K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-XDSO-N8

3

3.6 V

.8 mm

100000000000000 Write/Erase Cycles

40 MHz

5 mm

SPI

2097152 bit

2.7 V

ALSO OPERATES AT 25MHZ FROM 2.0-2.7V SUPPLY AND 2KV ESD AVAILABLE

.00025 Amp

6 mm

CY15B102QN-50SXE by Infineon Technologies

CY15B102QN-50SXE

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Memory Density: 2097152 bit;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

8 mA

262144 words

3.3

8

SMALL OUTLINE

SOP8,.3

11

1.27 mm

125 Cel

256KX8

256K

1.8 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

10000000000000 Write/Erase Cycles

50 MHz

5.23 mm

SPI

2097152 bit

1.8 V

2kv ESD available

260

.00035 Amp

5.28 mm

CY15B102QN-50SXET by Infineon Technologies

CY15B102QN-50SXET

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

8 mA

262144 words

3.3

8

SMALL OUTLINE

SOP8,.3

11

1.27 mm

125 Cel

256KX8

256K

1.8 V

-40 Cel

PURE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

2.03 mm

10000000000000 Write/Erase Cycles

50 MHz

5.23 mm

SPI

2097152 bit

1.8 V

2kv ESD available

260

.00035 Amp

5.28 mm

FM25L04B-G by Infineon Technologies

FM25L04B-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Write Protection: HARDWARE/SOFTWARE; JESD-609 Code: e3;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

3 mA

512 words

3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

512X8

512

-40 Cel

MATTE TIN

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3

3.6 V

1.727 mm

100000000000000 Write/Erase Cycles

20 MHz

3.9 mm

SPI

4096 bit

2.7 V

e3

30

260

.000006 Amp

4.889 mm

FM24CL64B-DG by Infineon Technologies

FM24CL64B-DG

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Minimum Standby Voltage: 2.7 V;

FRAM

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

.3 mA

8192 words

3.3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.16,37

SRAMs

10

.95 mm

85 Cel

8KX8

8K

2.7 V

-40 Cel

PURE TIN

DUAL

HARDWARE

R-PDSO-N8

3

3.65 V

.85 mm

100000000000000 Write/Erase Cycles

1 MHz

4 mm

Not Qualified

I2C

65536 bit

2.7 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

260

.000006 Amp

4.5 mm

FM24CL16B-G by Infineon Technologies

FM24CL16B-G

Infineon Technologies

FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.727 mm; Package Body Material: PLASTIC/EPOXY;

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

.3 mA

2048 words

3.3

8

SMALL OUTLINE

SOP8,.25

10

1.27 mm

85 Cel

2KX8

2K

2.7 V

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

HARDWARE

R-PDSO-G8

3

3.65 V

1.727 mm

100000000000000 Write/Erase Cycles

1 MHz

3.8985 mm

I2C

16384 bit

2.7 V

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

e4

20

260

.000006 Amp

4.889 mm