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CY15B108QSN-108BKXI

Infineon Technologies

CY15B108QSN-108BKXI by Infineon Technologies

Infineon CY15B108QSN-108BKXI FRAM offers 1MX8 organization, operates at 108 MHz clock frequency, and has a memory density of 8388608 bit. Ideal for applications requiring high endurance with 100T write/erase cycles, such as industrial automation and IoT devices.

Median Price

$26.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 790 parts In-Stock

1+ parts

$26.380

100+ parts

$22.510

1k+ parts

$22.120

10k+ parts

-

790

$26.380

$22.510

$22.120

-

DigiKey

USA . 8 parts In-Stock

1+ parts

$44.720

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$44.720

-

-

-

Flip Electronics (Authorized)

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960

-

-

-

-

Rochester

USA . 332 parts In-Stock

1+ parts

-

100+ parts

$14.730

1k+ parts

$13.180

10k+ parts

$12.410

332

-

$14.730

$13.180

$12.410

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 418 parts In-Stock

1+ parts

$40.708

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$40.708

-

-

-

Vyrian

USA . 9,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,006

-

-

-

-

Flip Electronics

USA . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

960

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 697 parts In-Stock

1+ parts

$38.510

100+ parts

-

1k+ parts

-

10k+ parts

$36.970

697

$38.510

-

-

$36.970

Corphita

USA . 365 parts In-Stock

1+ parts

$38.565

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$38.565

-

-

-

Continental Prestige Electronics

USA . 100 parts In-Stock

1+ parts

$40.590

100+ parts

$34.580

1k+ parts

-

10k+ parts

-

100

$40.590

$34.580

-

-

Component Stockers USA

USA . 254 parts In-Stock

1+ parts

$41.460

100+ parts

$30.800

1k+ parts

-

10k+ parts

-

254

$41.460

$30.800

-

-

Northwest PG Solutions

USA . 1,196 parts In-Stock

1+ parts

$42.361

100+ parts

-

1k+ parts

-

10k+ parts

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1,196

$42.361

-

-

-

Overview

Unlock the power of cutting-edge technology with the CY15B108QSN-108BKXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality FRAMs that offer unparalleled reliability and performance. Ideal for a wide range of applications, this product provides customers with a seamless experience, thanks to its innovative design and advanced features. Experience the difference with Infineon's CY15B108QSN-108BKXI and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material makes the package lightweight and durable, ensuring the product is easy to handle and has a long lifespan.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and facilitating efficient production processes.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with common power systems and enhances energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance of 85°C ensures reliability in various environmental conditions.

Organization: 1MX8

1 Megabit organization with 8-bit memory width offers a good balance between storage capacity and data processing capabilities.

Memory IC Type: FRAM

Using Ferroelectric RAM (FRAM) technology provides fast read/write speeds, high endurance, and low power consumption, making it a reliable memory solution.

Technical Specifications

FRAMs CY15B108QSN-108BKXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

108 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000435 Amp

Maximum Supply Current:

27.5 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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