Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CY15B064Q-SXET by Infineon Technologies is a FRAM with 8Kx8 organization, operating at 3.3V. It has a max clock frequency of 16MHz and offers 10000000000000 write/erase cycles. This FRAM is commonly used in applications requiring high endurance and non-volatile memory storage.
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Arrow
$4.511
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$5.116
$4.049
$3.715
Chip1Stop
$5.630
$3.320
DigiKey
$5.650
$4.869
$4.481
$4.331
Mouser Electronics
$4.870
$4.120
$3.940
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Verical
$3.080
Rochester
$2.990
$2.680
$2.520
Farnell
$4.088
$3.921
Element14
$7.050
$6.300
Digiode
$2.812
Nova Conductors
$4.182
Flip Electronics
Chip Stock
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IBS Electronics
$4.909
Ampacity Inc.
$2.550
Semicontronic
$2.486
$2.474
Corphita
$2.664
Component Stockers USA
$3.420
$3.210
$2.900
$3.040
Argo Parts USA
$4.050
Advanced Electronics
$103.000
$97.850
GreenTree Electronics
Futuretech Components
RC Electronics
$3.760
$3.650
Perfect Parts
Eastek
Formix International (Excess)
Glotronic Ltd.
Continental Prestige Electronics
$3.190
$3.100
Authorized Procurement Solutions
This material is durable and lightweight, making the product suitable for various applications while ensuring long-lasting performance.
Synchronous operation ensures efficient data transfer and processing, improving overall performance.
Operating at a lower voltage helps in reducing power consumption, making the product energy-efficient.
With high memory density, this product offers ample storage capacity for data-intensive applications.
The high endurance level ensures reliable and long-term usage of the product without compromising on performance.
Serial Peripheral Interface (SPI) allows for high-speed data transfer and communication between the device and other components.
FRAMs CY15B064Q-SXET attributes and parameters. Explore more FRAMs devices from Infineon Technologies
Additional Features:
Maximum Clock Frequency (fCLK):
Minimum Data Retention Time:
Endurance:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Screening Level:
Maximum Seated Height:
Serial Bus Type:
Maximum Standby Current:
Minimum Standby Voltage:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Width:
Write Protection:
CY15B064Q-SXET Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.1.B.2
ECCN Governance
EAR
PCN Assembly/Origin - Mult Dev Wafer Add 29/Sep/2020
PCN Packaging - Ship Label/Document Standardization 24/Jan/2018 Ship Label REV
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
1N4148
Philips Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MMBT3904-7-F
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
BAV99
Kingwell Technonlogy
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
Vishay Telefunken
BSS138DW-7-F
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
MBRA160T3G
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
FM25040B-GTR
Infineon Technologies
Infineon's FM25040B-GTR is a FRAM with 512x8 organization, operating at 5V. It offers 20MHz clock frequency, SPI serial bus type, and 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
CY15B104Q-LHXIT
CY15B104Q-LHXIT by Infineon Technologies is a FRAM with 512KX8 organization and 524288 words. It operates at a max clock frequency of 40 MHz and has a memory density of 4194304 bit. It is commonly used in applications requiring high endurance and low power consumption.
CY15V104QN-50SXIT
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES; No. of Functions: 1;
FM25V20A-GTR
Cypress Semiconductor
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING; No. of Words: 262144 words;
CY15B108QN-20LPXC
Infineon CY15B108QN-20LPXC FRAM offers 1MX8 organization, 20 MHz clock frequency, and 3.2 mA supply current. Ideal for applications requiring high endurance, such as industrial automation systems or IoT devices.
CY15V116QN-40BKXQT
FRAM;
CY15B004J-SXET
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V; Maximum Supply Voltage (Vsup): 3.6 V;
FM25640B-G
Infineon's FM25640B-G FRAM offers 8Kx8 organization, operates at 5V with SPI serial bus type. Ideal for applications requiring high endurance, such as industrial automation and automotive systems. Compact rectangular package with small outline and gull wing terminals make it suitable for space-constrained designs.
CY15B102N-ZS60XET
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 105 ns; Maximum Supply Current: 20 mA;
MB85R4002ANC-GE1
Fujitsu Semiconductor America
FRAM; No. of Terminals: 48; Package Code: TSOP1; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G48; Minimum Standby Voltage: 3 V;
FM24CL04B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 512X8; Package Body Material: PLASTIC/EPOXY;
FM25VN10-GTR
Ramtron International
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 2.5/3.3; Maximum Supply Current: 3 mA;
CYPT15B102Q-GGMB
FRAM; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1; Additional Features: DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE;
CY15E004Q-SXET
Infineon's CY15E004Q-SXET FRAM offers 512x8 organization, operates at 5V with 16MHz clock frequency. Ideal for automotive applications due to AEC-Q100 screening, SPI serial bus type, and endurance of 10^13 write/erase cycles.
FM24CL16B-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm; Maximum Clock Frequency (fCLK): 1 MHz;
FM25640B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 4 mA; Memory Width: 8;
CY15V116QN-40BKXAT
FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Form: BALL; Package Body Material: PLASTIC/EPOXY;
CY15V104QSN-108LPXIT
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Terminal Position: DUAL; No. of Words Code: 512K;
FM25L04B-GA
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS; Terminal Position: DUAL;
MB85RC256VPNF-G-JNE1
Fujitsu
Fujitsu's MB85RC256VPNF-G-JNE1 FRAM features 32KX8 organization, operates at 3.3V, and offers 1000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with a serial bus type of I2C and small outline package style.
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FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS; Terminal Finish: PURE TIN;
CY15B104Q-SXI
Infineon's CY15B104Q-SXI is a FRAM with 512KX8 organization, operating at 3.3V. It offers synchronous operation, 40MHz clock frequency, and SPI serial bus type. Ideal for applications requiring high endurance with 100T write/erase cycles in a small outline package style.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 2.03 mm; Peak Reflow Temperature (C): 260;
CY15B104Q-SXIT
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 512KX8; Maximum Seated Height: 2.03 mm;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.28 mm; Minimum Supply Voltage (Vsup): 2 V;
CY15B102QN-50SXE
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.8 V; Maximum Seated Height: 2.03 mm;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Memory Density: 2097152 bit;
CY15B102QN-50SXET
Infineon CY15B102QN-50SXET is a 256Kx8 FRAM with 50MHz clock frequency, SPI interface, and 3.3V supply voltage. Ideal for automotive applications due to AEC-Q100 screening, it offers 10000000000000 write/erase cycles and operates in temperatures ranging from -40°C to 125°C.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.8 V; No. of Words: 262144 words;
CY15B064Q-SXET
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; No. of Words Code: 8K;
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; Terminal Finish: PURE TIN;
CY15B104Q-LHXI
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words Code: 512K; Parallel or Serial: SERIAL;
Infineon's CY15B104Q-LHXI FRAM offers 512KX8 organization, operates at 3.3V with 40MHz clock frequency. Ideal for applications requiring high endurance, such as IoT devices and industrial automation systems.
CY15B108QN-40SXI
Infineon CY15B108QN-40SXI is a 1MX8 FRAM with 40MHz clock frequency, 3.3V supply voltage, and SPI serial bus type. It operates synchronously at -40 to 85°C, offering 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed non-volatile memory with low power consumption.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; JESD-30 Code: R-PDSO-G8;
CY15B104QSN-108SXI
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.8 V; Minimum Operating Temperature: -40 Cel;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.28 mm; Maximum Standby Current: .00035 Amp;
CY15B064J-SXE
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1; Additional Features: DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE;
Supply Digital Components
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